| Document |
Document Title |
|
WO/2020/012753A1 |
The present invention provides: a curable composition which is excellent in terms of the formation of a highly accurate multilayer wiring line and the like; a method for easily forming a structure such as a highly accurate multilayer wir...
|
|
WO/2020/013268A1 |
Provided is a highly thermally conductive material having flexing properties which comprises a resin and an alumina fiber sheet comprising continuous alumina fibers, wherein the alumina fiber sheet is contained in an amount of 30-80 mass...
|
|
WO/2020/013508A1 |
A retainer ring according to an embodiment of the present invention is used in a CMP device and comprises: a frame layer which is coupled to the lower end of a carrier of the CMP device and includes a thermosetting resin; a synthetic res...
|
|
WO/2020/007820A1 |
The invention relates to the use of a kit in the form of a cartridge or a film bag, which has multiple, in particular two compartments, of which one contains synthetic resin components comprising a radically polymerisable synthetic resin...
|
|
WO/2020/009001A1 |
The present invention addresses the problem of providing a resin composition for obtaining a cured product that has excellent environmental suitability, high strength and good flame retardance, said resin composition suitably being used ...
|
|
WO/2020/007252A1 |
Disclosed are a high-strength carbon fiber composite bar material with a resin rib on the surface and a preparation method therefor, relating to the technical field of building materials. The carbon fiber composite bar material comprises...
|
|
WO/2020/007432A1 |
A method for improving the cleanability of an epoxy paint coat on a surface is provided. A paint composition, and its use in improving cleanability is also provided. A kit-of-parts comprising the components of the paint composition is al...
|
|
WO/2020/009973A1 |
A floor element for forming a floor covering, wherein the floor element comprises a decorative layer made of a ceramic material and a support layer arranged below the decorative layer, wherein the support layer comprises edges provided w...
|
|
WO/2020/003662A1 |
The present invention addresses the problem of providing a prepreg having excellent process passability and stackability, and a method for industrially advantageously producing the prepreg. This prepreg comprises at least constituent ele...
|
|
WO/2020/003122A1 |
Provided is a curable composition containing a reactive mixture of components including an polyethersulfone having a chemical group reactive with an epoxide, a cycloaliphatic polyepoxide resin, a polyepoxide having a functionality greate...
|
|
WO/2020/003971A1 |
This silicone composition containing (A) a copolymer comprising polysiloxane and polyalkylene oxide repeating units, (B) a polyether-modified silicone, and/or (C) an organic acid has high dispersibility in water, and a fiber treatment ag...
|
|
WO/2019/244479A1 |
The purpose of the present invention is to provide: a composition in which a continuity test can be carried out even when a wiring of a circuit device to be inspected is narrow pitched, and a wiring is fine and thinned, and which has exc...
|
|
WO/2019/244868A1 |
The present invention provides: an acid group-containing (meth)acrylate resin composition which contains an acid group-containing (meth)acrylate resin (A) and an amine-modified epoxy resin (B), and which is characterized in that the cont...
|
|
WO/2019/244829A1 |
The purpose of the present invention is to provide: an epoxy resin composition capable of giving cured resins which combine flexural modulus with flexural strain on a high level and have excellent heat resistance; a prepreg comprising th...
|
|
WO/2019/244879A1 |
This epoxy resin composition contains an (A) ingredient, a (B) ingredient, a (C) ingredient and a (D) ingredient; the content ratio for the (A) ingredient is between 60 parts by mass and 90 parts by mass inclusive with respect to 100 par...
|
|
WO/2019/244569A1 |
A liquid crystal panel according to one embodiment of the present invention is provided with: a first substrate; a second substrate which faces the first substrate; a sealing part which bonds the first substrate and the second substrate ...
|
|
WO/2019/241743A1 |
An epoxy resin composition comprises about 70 wt % to about 95 wt % by weight of the composition of an epoxy component; and a curing component comprising about 5 wt % to about 30 wt % by weight of the composition, wherein the curing comp...
|
|
WO/2019/240083A1 |
Provided is a resin material capable of lowering the dielectric loss tangent and suppressing the occurrence of delamination. The resin material according to the present invention contains an epoxy compound, an inorganic filler, a curing ...
|
|
WO/2019/240897A1 |
Disclosed is a toughened epoxy composition comprising (a) a first epoxy component comprising one or more epoxy resins having at least one oxazolidone ring structure; and (b) a second epoxy component comprising one or more liquid epoxy re...
|
|
WO/2019/239267A1 |
An adhesion promoter comprises a reaction product of: a) a polyepoxide; b) an aminosilane represented by the formula HNR1R2. R1 and R2 independently represent -Z-SiL3. Each Z independently represents a divalent linking group having from ...
|
|
WO/2019/238880A1 |
Formulations comprising from 10 to 80% by weight of the formulation of a halogenated epoxy resin; from 1 to 15% by weight of the formulation of an antimony based fire retardant; from 1 to 10% by weight of the formulation of an inorganic ...
|
|
WO/2019/241187A1 |
The present invention relates to methods for making synthetic non-adhesive picture or image cabochons and to the synthetic cabochons themselves. These cabochons can be part of a further article of manufacture such as jewelry, a button, r...
|
|
WO/2019/240259A1 |
The present invention includes: a resin composition comprising an (A) component, which is a modified polyolefin-based resin, a (B) component, which is a compound having an annular ether group, a (C) component, which is a tackifier having...
|
|
WO/2019/240079A1 |
This curable resin composition contains a curable resin and a compound represented by general formula (1). In general formula (1), R1 through R3 each independently represents a monovalent hydrocarbon group.
|
|
WO/2019/240044A1 |
This cationically curable composition generates a silanol group upon being irradiated with light and is cured by heat. The cationically curable composition contains: a cationically curable component; porous particles that hold an aluminu...
|
|
WO/2019/235435A1 |
[Problem] The purpose of the present invention is to provide a composition that can give a cured product having excellent light absorption properties in a prescribed wavelength region. [Solution] The present invention solves this problem...
|
|
WO/2019/235505A1 |
[Problem] The present invention addresses the problem of providing a polybutylene terephthalate resin composition containing a halogenated epoxy flame retardant and having excellent flame retardancy. [Solution] The abovementioned problem...
|
|
WO/2019/232817A1 |
Disclosed is a high-toughness cable granule made of the following raw materials by weight: 50-65 parts of bisphenol A epoxy resin, 15-25 parts of terminal carboxylated nitrile rubber, 30-45 parts of acrylonitrile, 10 -20 parts of polyeth...
|
|
WO/2019/234139A1 |
The present invention relates to a particulate coating composition, and preferably a powder coating composition, comprising: (i) at least one epoxy resin; (ii) at least one curing agent; (iii) at least one organosilane adhesion promoter;...
|
|
WO/2019/235378A1 |
Provided is a method for producing a flame retardant resin composition which exhibits excellent thermal stability and which contains a styrene-based resin and a brominated polymer type flame retardant. In the production of a styrene-base...
|
|
WO/2019/230821A1 |
A resin metal composite member for tires, which comprises a metal member (27) and a covering resin layer (28) that covers the metal member (27) and contains a resin composition. This resin metal composite member for tires is configured s...
|
|
WO/2019/229961A1 |
The present invention provides a compound which suppresses cracks in a molded body that is produced from this compound and a metal member. This compound comprises a metal element-containing powder and a resin composition; and if Tg (°C)...
|
|
WO/2019/229018A1 |
The present invention relates to a curing agent (100) for curing a resin (200), including a mixture of an organic acid (110) and an ester (120).
|
|
WO/2019/229960A1 |
A composition having a low degree of shrinkage in molding is provided. The composition comprises a metallic-element-containing powder and a resin composition, wherein the resin composition comprises an epoxy resin and a compound having a...
|
|
WO/2019/229962A1 |
This resin composition, when cured, has a thermal conductivity of 5 W/(m·K) or more and a storage modulus of 8 GPa or less.
|
|
WO/2019/230709A1 |
The purpose of the present invention is to provide a sealant for a liquid crystal display element, the sealant having excellent adhesiveness, moisture permeation prevention, and liquid crystal contamination resistance. Another purpose of...
|
|
WO/2019/223201A1 |
Disclosed by the present invention is a biological epoxy asphalt, comprising a component A, a component B and a component C. The component A includes epoxidized soybean oil and a diluent, the component B includes a curing agent, an accel...
|
|
WO/2019/226980A1 |
Novel cytotoxic fluoropyrimidine polymers for treating cancer (e.g., colorectal cancer (CRC)) in a subject (e.g., a subject having cancer) are nucleic acid molecules including 5-fluoro- 2'deoxyuridine monophosphate (FdUMP)[l0] having a p...
|
|
WO/2019/225482A1 |
Provided is a resin varnish having high heat resistance, low relative permittivity, high metal foil adhesion, high glass transition temperature, and low thermal expansion properties, excellent moldability and plating uniformity, and also...
|
|
WO/2019/225659A1 |
The present invention discloses a polycarbonate resin composition which contains (a) an aromatic polycarbonate, (b) a polyester and (c) a polymer having an epoxy group. This polycarbonate resin composition satisfies the following require...
|
|
WO/2019/221134A1 |
One aspect of the present invention is a thermal storage molded article containing a resin and microcapsules that encapsulate a thermal storage component and are dispersed in the resin, the resin containing a cured product of a water-sol...
|
|
WO/2019/220663A1 |
A resin composition according to one aspect of the present invention contains an acrylic resin obtained by polymerizing a monomer component containing: a first monomer represented by formula (1); and a second monomer which is copolymeriz...
|
|
WO/2019/220665A1 |
A curable composition according to one aspect of the present invention contains: an epoxy compound; a capsule containing a heat storage component; and a curing agent.
|
|
WO/2019/220540A1 |
The semiconductor device according to the present invention includes: a substrate; a first semiconductor element that is disposed on the substrate; a first encapsulation layer that encapsulates the first semiconductor element; and a seco...
|
|
WO/2019/220664A1 |
A curable composition according to one aspect of the present invention contains: a compound having a (meth)acryloyl group; a capsule containing a heat storage component; and a polymerization initiator.
|
|
WO/2019/221262A1 |
The purpose of the present invention is to provide a composite material that has improved strength and contains an epoxide resin. This problem can be solved by a curable epoxide composition, the curable epoxide composition containing an ...
|
|
WO/2019/220662A1 |
A curable composition according to one aspect of the present invention contains: a compound having an isocyanate group; and a capsule containing a heat storage component. A curable composition according to another aspect of the present i...
|
|
WO/2019/215533A1 |
Curable compositions, cured compositions formed from the curable compositions, and articles containing the cured compositions are provided. The curable compositions include (a) a curable component that includes (1) an epoxy resin, (2) a ...
|
|
WO/2019/216388A1 |
The present invention is a curable composition including an epoxy compound (A), a curing agent (B) which is liquid at 23°C, an inorganic filler (C) which has a thermal conductivity of 10 W/m∙K or greater and is spherical, and an ion e...
|
|
WO/2019/214001A1 |
Provided are a resin composition, a prepreg sheet for a printed circuit, and a metal-clad laminate. The resin composition comprises: a silicon arylacetylene resin; and a hydroxyl-terminated polyphenylether resin. The metal-clad laminate ...
|
