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WO/2019/187988A1 |
The cured product of a resin composition according to the present invention comprises at least silsesquioxane. When the average thermal expansion coefficient at 30-200°C of the cured product is expressed as α1 [K-1], α1 satisfies the ...
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WO/2019/189621A1 |
The present invention addresses the problem of providing a powder/granular material that is for a thermosetting resin and that can be well dispersed in a thermosetting matrix resin. The problem can be solved by containing, at a specific ...
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WO/2019/189226A1 |
The present invention provides an epoxy resin composition which can impart flexibility to an epoxy resin while maintaining the characteristic high elastic modulus thereof to achieve both impact resistance and mechanical strength, and whi...
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WO/2019/188444A1 |
The present invention addresses the problem of providing: a boron nitride powder that is useful as, inter alia, a filler of a heat-conductive resin composition, has low thermal anisotropy, and has exceptional heat resistance and solvent ...
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WO/2019/189750A1 |
One aspect of the present invention pertains to a conductive composition containing at least an acrylic resin and a conductive powder. The acrylic resin contains at least polymerized units (A) of an epoxy group-containing (meth)acrylate ...
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WO/2019/188432A1 |
This resin composition contains an annular olefin polymer (A) having a polar group, and an epoxy resin (B) with an epoxy equivalent of greater than or equal to 500.
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WO/2019/189220A1 |
Provided are a dry film, a cured product and a printed wiring board which exhibit excellent reliability as cured products while exhibiting excellent slit processability and handleability and excellent lamination properties. This dry film...
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WO/2019/190158A1 |
The communication module according to one embodiment of the present invention comprises: a printed circuit board; an antenna unit and electronic components arranged on the printed circuit board; and a sheet layer arranged on the antenna ...
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WO/2019/189466A1 |
A resin material is provided which can 1) reduce the dielectric loss tangent of a cured product, 2) increase adhesion between an insulation layer and a metal layer, 3) increase the plated peel strength, 4) increase flame retardancy of th...
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WO/2019/189142A1 |
This particulate resin composition for sealing contains an epoxy resin and an inorganic filler; and the void occupancy of a cured product of this particulate resin composition for sealing as determined under specific conditions is 0.10 o...
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WO/2019/181336A1 |
[Problem] To provide an aqueous dispersion composition which exhibits excellent adhesion not only to polyolefin base materials but also to other plastic base materials, and which is thus useful in applications such as coating materials, ...
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WO/2019/178775A1 |
Disclosed are curable epoxy resin compositions containing at least one epoxy resin having on average more than one epoxide group per molecule, at least one inorganic filler, at least one hydraulic binder, and at least one polycarboxylate...
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WO/2019/181139A1 |
Provided is a thermosetting resin composition that can achieve both low Dk and low CTE of a cured product, and ensures satisfactory storage stability of a dry film. The thermosetting resin composition includes: (A) an epoxy resin, (B) a ...
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WO/2019/175338A1 |
The disclosure relates to a curable mixture, in particular for use in impregnation of paper bushings, comprising (a) a resin composition comprising a bisphenol-A-diglycidylether; a polyglycidylether different from BADGE and/or a cycloali...
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WO/2019/176859A1 |
This epoxy resin composition contains an epoxy resin, a curing agent, alumina particles, and a silane compound that does not have a functional group reactive to an epoxy group, that has a functional group not reactive to an epoxy group, ...
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WO/2019/174972A1 |
The present invention relates to a PVC plastisol composition comprising at least one vinyl chloride polymer selected from polyvinylchlorides and copolymers of vinyl chloride with one or more monomers; at least one plasticizer; at least o...
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WO/2019/176074A1 |
This epoxy resin has a mesogenic structure and a siloxane structure. This epoxy resin composition contains: an epoxy resin having a mesogenic structure and a siloxane structure; and a curing agent.
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WO/2019/175342A1 |
Disclosed are a storage stable resin composition, comprising an epoxy resin, a block-copolymer with silicone and organic blocks, and a silane, a process for obtaining such storage stable resin composition, a curable resin composition obt...
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WO/2019/176554A1 |
Provided are an underfill material whereby high connection reliability can be obtained, and a method for manufacturing a semiconductor device using the same. The underfill material contains an epoxy compound, an epoxy curing agent, and a...
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WO/2019/171993A1 |
Provided are: an epoxy resin composition which enables the achievement of an epoxy resin cured product that has excellent tracking resistance and excellent thermal decomposition stability, while having a good balance between the tracking...
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WO/2019/171998A1 |
The present invention addresses the problem of providing: a coloring curable resin composition which is capable of forming a color filter that is suppressed in decrease of the brightness even if a metal compound is contained therein; a c...
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WO/2019/171991A1 |
The purpose of the present invention is to provide a resin composition which has excellent fast curing properties without deteriorating heat resistance and low viscosity. A resin composition for fiber-reinforced composite materials, whic...
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WO/2019/171613A1 |
Provided is a resin composition comprising; (A) a cellulose acylate; (B) a polyester resin; and (C) a cardanol composition containing a cardanol type compound having an epoxy group.
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WO/2019/172347A1 |
[Problem] To provide: a curable composition for a polymer electrolyte, the curable composition being capable of providing strong adhesion between a polymer electrolyte and another substrate such as a heat resistant polymer, and exhibitin...
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WO/2019/172342A1 |
Provided are a prepreg, a layered plate, a multilayer printed wiring board, and a semiconductor package which have high adhesion to conductors, excellent heat resistance, high glass transition temperatures, low thermal expansion coeffici...
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WO/2019/167579A1 |
A heat-curable resin composition which contains at least [A] an epoxy resin having at least two glycidyl groups, [B] a cyanate ester resin having at least two cyanate groups and [C] an amine compound and meets the requirements (1) and (2...
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WO/2019/166579A1 |
The present invention relates to a new elasticizing additive, to be introduced into a polymerizable material, particularly an epoxy resin, and formed with it, a structural adhesive obtained by reaction of a first reaction component made ...
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WO/2019/167905A1 |
The present invention provides a resin composition for sealing, which has excellent moisture barrier properties and is thus capable of suppressing deterioration of an element such as an EL element due to the moisture taken in the resin c...
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WO/2019/165583A1 |
Disclosed by the present invention are a reversible self-repairing epoxy resin and a preparation and recovery remoulding method therefor. Under the catalysis of potassium iodide, the acetate solution of 2-mercaptoacetic acid is oxidized ...
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WO/2019/165281A1 |
The invention provides methods and compositions that prevent, mitigate or delay the onset of corrosion of iron or steel (e.g., plain carbon steel) components used as reinforcement or otherwise at least partially embedded in carbonated co...
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WO/2019/165359A1 |
Disclosed are mixtures of polyphosphonates with carbon nanotubes (CNTs), blends of polycarbonate and polyphosphonate with CNTs, and methods of manufacturing and using the same, as well as articles made therefrom. In some embodiments, art...
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WO/2019/163818A1 |
The present invention pertains to: an epoxy resin composition which is capable of undergoing curing in a short period of time even under low-temperature conditions to form a cured product having excellent moisture resistance, and which i...
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WO/2019/159368A1 |
An epoxy resin composition that is a reaction induction-type epoxy resin composition containing an epoxy compound and a curing agent and capable of forming a smectic liquid crystal structure, that contains no filler or has a filler conte...
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WO/2019/160287A1 |
The present invention relates to a thermosetting resin composition, for a semiconductor package, having excellent flowability and stiffness, and a prepreg using same. More particularly, provided are a thermosetting resin composition for ...
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WO/2019/155950A1 |
A resin composition for semiconductor sealing use according to the present invention which contains an epoxy resin, a curing agent, an inorganic filler and carbon black microparticles. When the resin composition for semiconductor sealing...
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WO/2019/154933A1 |
The invention initially relates to a sprayable formulation for producing a multi-layer insulation for an electrical machine, in particular a rotating electrical machine in the high-voltage or medium-voltage range such as a generator, tra...
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WO/2019/153218A1 |
An environmentally friendly non-destructive fiber-reinforced composite material recovering method, comprising the following steps: (A) placing a fiber-reinforced resin-based composite material in an electrolyte, wherein the electrolyte c...
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WO/2019/155800A1 |
The present invention addresses the problem of providing a resist composition which has excellent storage stability and is excellent in terms of screen printability, resolution, low warpage, flexibility, chemical resistance, and flame re...
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WO/2019/156341A1 |
The present invention relates to a powder coating composition comprising: epoxy resins including a bisphenol A type epoxy resin, an isocyanate modified epoxy resin, and a novolac type epoxy resin; and an amine-based curing agent.
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WO/2019/153108A1 |
The present invention provides a curable epoxy resin composition and a cured product, prepreg, and fiber-reinforced composite material obtained therefrom. The curable epoxy resin composition according to the present invention has low vis...
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WO/2019/154932A1 |
The invention initially relates to a sprayable formulation for producing an insulating system for an electrical machine, in particular a rotating electrical machine in the high-voltage or medium-voltage range such as a generator and/or a...
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WO/2019/150433A1 |
Disclosed is a thermosetting resin composition comprising: an epoxy resin; a hardening agent; a first elastomer having at least one type of functional group selected from a group consisting of a carboxy group and a hydroxy group; and a s...
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WO/2019/151645A1 |
The present invention relates to an adhesive film for a semiconductor, comprising: an adhesive binder; a first layer comprising a heat dissipating filler; and a second layer formed on at least one surface of the first layer and comprisin...
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WO/2019/150994A1 |
Provided is a resin composition capable of suppressing a decrease in capacitance or a decrease in dielectric constant while maintaining excellent dielectric properties and circuit adhesiveness when used as a dielectric layer of a capacit...
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WO/2019/151471A1 |
Provided are: a resist underlayer film having, in particular, a high dry etching speed; the resist underlayer film formation composition; a resist pattern formation method, and a method for manufacturing a semiconductor device. The resis...
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WO/2019/146736A1 |
The present invention provides a curable resin composition for sealing, which contains (A) a bifunctional alicyclic epoxy resin having a molecular weight of less than 1,000, (B) a polyfunctional epoxy resin having a molecular weight of 1...
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WO/2019/145349A1 |
The present invention relates to a composition comprising a binder comprising one or more siloxane polymers, silicone resins, silicone based elastomers, and mixtures thereof, wherein said binder optionally comprises one or more cross-lin...
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WO/2019/146617A1 |
The problem addressed by the present invention is to provide a resin composition for sealing capable of suppressing warpage even when sealing a large-area substrate. To solve this problem, a resin composition for sealing electronic compo...
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WO/2019/146532A1 |
Provided is an alkali-soluble resin that is used to obtain an alkali-soluble radiation-sensitive resin composition having excellent alkali solubility and resolution, and developability with a close fit. The present invention pertains to ...
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WO/2019/145352A1 |
The present invention relates to a composition comprising a binder comprising one or more siloxane polymers, silicone resins, silicone based elastomers, and mixtures thereof, wherein said binder optionally comprises one or more cross- li...
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