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WO/2019/223201A1 |
Disclosed by the present invention is a biological epoxy asphalt, comprising a component A, a component B and a component C. The component A includes epoxidized soybean oil and a diluent, the component B includes a curing agent, an accel...
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WO/2019/226980A1 |
Novel cytotoxic fluoropyrimidine polymers for treating cancer (e.g., colorectal cancer (CRC)) in a subject (e.g., a subject having cancer) are nucleic acid molecules including 5-fluoro- 2'deoxyuridine monophosphate (FdUMP)[l0] having a p...
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WO/2019/225482A1 |
Provided is a resin varnish having high heat resistance, low relative permittivity, high metal foil adhesion, high glass transition temperature, and low thermal expansion properties, excellent moldability and plating uniformity, and also...
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WO/2019/225659A1 |
The present invention discloses a polycarbonate resin composition which contains (a) an aromatic polycarbonate, (b) a polyester and (c) a polymer having an epoxy group. This polycarbonate resin composition satisfies the following require...
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WO/2019/221134A1 |
One aspect of the present invention is a thermal storage molded article containing a resin and microcapsules that encapsulate a thermal storage component and are dispersed in the resin, the resin containing a cured product of a water-sol...
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WO/2019/220663A1 |
A resin composition according to one aspect of the present invention contains an acrylic resin obtained by polymerizing a monomer component containing: a first monomer represented by formula (1); and a second monomer which is copolymeriz...
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WO/2019/220665A1 |
A curable composition according to one aspect of the present invention contains: an epoxy compound; a capsule containing a heat storage component; and a curing agent.
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WO/2019/220540A1 |
The semiconductor device according to the present invention includes: a substrate; a first semiconductor element that is disposed on the substrate; a first encapsulation layer that encapsulates the first semiconductor element; and a seco...
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WO/2019/220664A1 |
A curable composition according to one aspect of the present invention contains: a compound having a (meth)acryloyl group; a capsule containing a heat storage component; and a polymerization initiator.
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WO/2019/221262A1 |
The purpose of the present invention is to provide a composite material that has improved strength and contains an epoxide resin. This problem can be solved by a curable epoxide composition, the curable epoxide composition containing an ...
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WO/2019/220662A1 |
A curable composition according to one aspect of the present invention contains: a compound having an isocyanate group; and a capsule containing a heat storage component. A curable composition according to another aspect of the present i...
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WO/2019/215533A1 |
Curable compositions, cured compositions formed from the curable compositions, and articles containing the cured compositions are provided. The curable compositions include (a) a curable component that includes (1) an epoxy resin, (2) a ...
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WO/2019/216388A1 |
The present invention is a curable composition including an epoxy compound (A), a curing agent (B) which is liquid at 23°C, an inorganic filler (C) which has a thermal conductivity of 10 W/m∙K or greater and is spherical, and an ion e...
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WO/2019/214001A1 |
Provided are a resin composition, a prepreg sheet for a printed circuit, and a metal-clad laminate. The resin composition comprises: a silicon arylacetylene resin; and a hydroxyl-terminated polyphenylether resin. The metal-clad laminate ...
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WO/2019/177013A9 |
This hollow-particle dispersion contains: hollow particles each having a shell formed by at least one layer; an acidic compound; and an organic solvent, wherein the at least one layer contains nitrogen and carbon atoms, the contained amo...
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WO/2019/216425A1 |
Provided is a conductor substrate having a stretchable resin layer and a conductor foil provided on the stretchable resin layer, wherein the stretchable resin layer contains a cured product of a resin composition containing: (A) a rubber...
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WO/2019/214000A1 |
Provided in the present disclosure are a resin composition, a prepreg used for a printed circuit and a metal-clad pressing plate. The resin composition comprises: a resin; and a filler, wherein the resin is a silicon aryne resin. By mean...
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WO/2019/216700A1 |
The present invention relates to a solid dispersion, a preparation method therefor, a chain-extended polyurethane using same, and an epoxy resin composition comprising same and, more particularly, to a solid dispersion in which an inorga...
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WO/2019/210991A1 |
The invention describes a low temperature process for high performance epoxy resins purification via membrane separation technology. Continuous or semi-continuous low temperature processing grants a minimized material aging during produc...
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WO/2019/208374A1 |
Provided are: a composite molded article comprising a molded article which is produced from a poly(arylene sulfide) resin composition and can exhibit excellent epoxy adhesiveness even when being subjected to an annealing treatment and a ...
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WO/2019/206321A1 |
Disclosed is polymer-ceramic composite material with colossal permittivity, comprising polymer matrix and ceramic powders embedded in the polymer matrix, wherein a part of the polymer matrix is exposed and adsorbed to the surface of the ...
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WO/2019/207305A1 |
The present invention relates to a pre-impregnated composite, to a method of producing the pre- impregnated composite, to a composite article comprising the pre-impregnated composite and to a method of producing the graphene composite ar...
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WO/2019/205066A1 |
Monomers, oligomers and polymers useful as additives for adhesive and/or sealant compositions, and particularly to one drop fill ("ODF") sealant compositions for liquid crystal display applications. The sealant compositions permit assemb...
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WO/2019/208377A1 |
Provided are: a molded article of a polyarylene sulfide (PAS) resin composition having excellent epoxy adhesiveness and thermal shock resistance, in particular not only the thermal shock resistance addressed when a welded part is include...
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WO/2019/203266A1 |
The present invention provides: an insulation sheet that includes resin composition layers (14, 24, 34), the relative dielectric constant at a frequency of 1 MHz of one surface side (14X, 24X, 34X) being higher than the relative dielectr...
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WO/2019/203291A1 |
A thermosetting composition including at least a thermosetting compound, wherein the thermosetting composition satisfies relationships represented by formulas (i) and (ii). 0.80 ≤ b/a ≤ 0.98 … (i) 0.05 ≤ c/a ≤ 0.30 … (ii) (in...
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WO/2019/203048A1 |
A method for manufacturing an electronic device according to the present invention is a method for manufacturing an electronic device provided with a substrate having, formed on the surface thereof, a metal-exposed part and an electronic...
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WO/2019/203178A1 |
A heat-conducting layer that contains at least one type of filler, has thermal diffusivity of 5.0 x 10-7m2s-1 or higher, and has volume resistivity of 1.0 x 1011 Ω∙cm or higher is used. The present invention also relates to a photosen...
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WO/2019/203062A1 |
To provide: a polyarylene sulfide resin composition for extrusion molding, provided with both good extrusion molding properties and, for example, flexibility whereby cracking or splitting does not occur even when a tube made of the resin...
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WO/2019/198470A1 |
The purpose of the present invention is to provide a sealant for an organic electroluminescent (EL) display element, which has inkjet coating properties, low outgassing properties, and outstanding adhesion to a substrate and an inorganic...
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WO/2019/199032A1 |
The present invention relates to a thermosetting resin composition for a semiconductor package, a prepreg, and a metal-clad laminate and, more specifically, to a thermosetting resin composition for a semiconductor package, the thermosett...
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WO/2019/199033A1 |
The present invention relates to a thermosetting resin composite for a metal clad laminate and a metal clad laminate and, more specifically, to a thermosetting resin composite for a metal clad laminate having a predetermined thermal stre...
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WO/2019/198703A1 |
An epoxy resin which comprises an epoxy compound having a mesogenic structure and which, when examined for dynamic shear viscosity, has an initial dynamic shear viscosity η'1 (Pa·s) and a maximum dynamic shear viscosity η'2 (Pa·s), t...
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WO/2019/198321A1 |
This polycarbonate resin composition pellet contains a polycarbonate resin (A), an aromatic compound (B) represented by general formula (1), and a phosphorus-type stabilizer (C), wherein the content of the aromatic compound (B) is 0.001 ...
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WO/2019/198766A1 |
Provided are: a fire-resistant epoxy resin for which bleed out does not tend to occur; and a molded body thereof. The epoxy resin composition and the molded body thereof according to the present invention comprise a compound represented ...
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WO/2019/198242A1 |
A resin composition for sealing which comprises (A) an epoxy resin, (B) a hardener containing at least one amino group in the molecule, and (C) inorganic fillers, wherein the inorganic fillers (C) comprise (C1) a first inorganic filler, ...
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WO/2019/198378A1 |
Provided is a compound that has low crystallinity and continues exhibiting excellent properties after being cured. The compound is represented by formula (1) or formula (2). In formula (1) and formula (2), n is an integer of 2 or greater...
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WO/2019/194056A1 |
Provided is a composition for dip molding containing at least: an elastomer containing, in the polymer main chain, a structural unit derived from (meth)acrylonitrile, a structural unit derived from an unsaturated carboxylic acid, and a s...
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WO/2019/187588A1 |
Provided are: a curable resin composition which is excellent in terms of conductor layer/solder resist adhesion after an HAST treatment and which can give cured objects having a low dielectric dissipation factor; a dry film including a r...
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WO/2019/189467A1 |
A resin material is provided which can 1) reduce the dielectric loss tangent of a cured product, 2) increase thermal dimensional stability of the cured product, 3) increase adhesion between an insulation layer and a metal layer, 4) reduc...
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WO/2019/187135A1 |
Provided are: a thermosetting resin composition that makes it possible to form a prepreg that has low elasticity, high heat resistance, and high extensibility at both room temperature and high temperatures and that adheres very strongly ...
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WO/2019/189811A1 |
Provided are: a thermosetting resin composition that makes it possible to form a prepreg that has low elasticity, high heat resistance, high extensibility at both room temperature and high temperatures, highly reliable electrical insulat...
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WO/2019/186987A1 |
Provided are composite particles having improved dispersion in polar solvents. The composite particles comprise inorganic particles and a coating layer covering the inorganic particles. The coating layer is a cured product of a compositi...
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WO/2019/189617A1 |
The present invention is a resin composition containing a component (A), a component (B), and a component (C), the component (A) being a modified polyolefin-based resin, the component (B) being a compound having a cyclic ether group, and...
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WO/2019/188067A1 |
Provided are the following: a curable resin composition which exhibits excellent developing performance and gives a cured product having excellent flexibility, adhesive properties and heat resistance; a dry film having a resin layer obta...
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WO/2019/189618A1 |
The present invention pertains to an electronic device-sealed body comprising an electronic device and an adhesive-cured layer that seals between a UV-impermeable functional film and the electronic device; a sheet-shaped adhesive that is...
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WO/2019/189219A1 |
Provided are the following: a curable resin composition which exhibits excellent B-HAST resistance and PCT resistance while ensuring excellent reliability as a rigid cured product having excellent TCT resistance; and a dry film, a cured ...
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WO/2019/189616A1 |
The present invention is a resin composition which comprises a modified polyolefin resin as a component (A), a compound having a cyclic ether group as a component (B), and a photocationic polymerization initiator as a component (C), wher...
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WO/2019/188291A1 |
Provided are: an epoxy resin composition which is useful for a molding material for providing a cured article having excellent heat conductivity, fluidability, molding properties and others in use applications such as molding, casting, l...
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WO/2019/191095A1 |
Embodiments of the present invention provide improved prosthetic devices. The prosthetic devices may be fabricated using environmental friendly, renewable and sustainable materials. Methods of manufacturing the devices are also provided....
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