| Document |
Document Title |
|
WO/2018/216229A1 |
A thermosetting resin composition which contains a thermosetting resin, an activator and a thixotropy-imparting agent. The thermosetting resin contains a base material and a curing agent. The base material contains a bi- or higher functi...
|
|
WO/2018/217996A1 |
A curable composition, includes a diluent, an epoxy functionalized resin derived from a nutshell oil, an epoxy-rubber copolymer adduct, and a curing agent. There is disclosed a method for making the curable composition, a method of imbui...
|
|
WO/2018/214681A1 |
An epoxy resin wave-absorbing composite material and a preparation method therefor. The method comprises: heating an epoxy resin to 50-70°C and adding carbon black to obtain an epoxy resin/carbon black mixture; heating the epoxy resin/c...
|
|
WO/2018/216752A1 |
The present invention addresses the problem of providing: an epoxy resin that has excellent flexibility; an epoxy resin-containing composition; and a cured product. The present invention relates to an epoxy resin which is a reaction prod...
|
|
WO/2018/216814A1 |
Provided are: a conductive paste composition which has low electrical resistance and does not cause excessive shrinkage during the formation process of an electrode, while being capable of suppressing internal stress upon the completion ...
|
|
WO/2018/211799A1 |
This liquid thermosetting resin composition contains a thermosetting resin (1), nanocarbon (2), an organic additive (5) having, at an end of the molecule, a functional group which reacts with the thermosetting resin and the nanocarbon, a...
|
|
WO/2018/207509A1 |
Provided is a fiber-reinforced composite material having high heat resistance and excellent quality of appearance. This epoxy resin composition for a fiber-reinforced composite material comprises the following constituent elements (A), (...
|
|
WO/2018/207510A1 |
Provided is a method for producing a fiber-reinforced composite material having high heat resistance and excellent quality of appearance. Disclosed is a method for producing a fiber-reinforced composite material, the method comprising: a...
|
|
WO/2018/207820A1 |
Provided is an insulating sheet which can effectively enhance thermal conductivity and adhesiveness, and which can effectively suppress variation in the adhesiveness. This insulating sheet includes a thermosetting component and boron n...
|
|
WO/2018/207532A1 |
Provided are: an active ester compound that exhibits excellent dielectric characteristics and copper foil adhesiveness in a cured product; a curable composition comprising the same and a cured product thereof; and a semiconductor sealing...
|
|
WO/2018/205336A1 |
Disclosed in the present invention is a light-emitting diode (LED) packaging material, which is formed by compositing graphene and silane or epoxy resin so as to alleviate deficiencies which exist when preparing an LED packaging material...
|
|
WO/2018/205020A1 |
The present relates to a process for the depolymerization of a feedstock comprising lignin producing depolymerized lignins comprising the loading of the feedstock, a catalyst, a polyalcohol, and water into a reactor; heating the reactor ...
|
|
WO/2018/207821A1 |
Provided is an insulating sheet which can effectively enhance thermal conductivity and adhesiveness, and which can effectively suppress the occurrence of voids. This insulating sheet includes a thermosetting component and boron nitride...
|
|
WO/2018/201428A1 |
A thermally curable sealant composition, comprising: a) a thermally curable resin selected from maleimide resins, maleimide-modified epoxy resins and any combination thereof；b) a latent curing agent；c) a polysiloxane containing a mer...
|
|
WO/2018/199705A1 |
The present application relates to an encapsulating composition, an organic electronic device comprising same, and a method for manufacturing the organic electronic device, and provides an encapsulating composition which can effectively ...
|
|
WO/2018/199309A1 |
Provided is a method for manufacturing a sealing film containing a heat curable resin, and an inorganic filler, the method comprising: the step for preparing a resin composition containing a resin having a reactive functional group equiv...
|
|
WO/2018/196517A1 |
Disclosed are a wave absorbing material and a preparation method therefor, and the preparation method comprises: mixing a raw rubber, a filler, a vulcanising agent and an auxiliary agent into a mixture in a mixing step, and then hot pres...
|
|
WO/2018/199306A1 |
Provided is a sealing film made of a resin composition comprising a thermosetting resin that has a structural unit represented by formula (1), and an inorganic filler: [in formula (1), X1 denotes a reactive functional group and R1 denote...
|
|
WO/2018/198850A1 |
[Problem] To provide a poly(arylene sulfide) resin composition and an insert-molded article using the resin composition which exhibit excellent impact resistance at high and low temperatures and low warpage. [Solution] This poly(arylene ...
|
|
WO/2018/199038A1 |
The present invention provides a polyarylate resin which has excellent fluidity and reactivity with epoxy resin, and can form a cured product having sufficiently excellent heat resistance and dielectric characteristics; and a production ...
|
|
WO/2018/194410A1 |
The present application relates to a composition for sealing an organic electronic element and an organic electronic device comprising the same, wherein the composition: can form a structure in which the permeation of external moisture o...
|
|
WO/2018/194099A1 |
This resin composition contains: (A) a thermosetting resin; (B) a curing agent; (C) a thermoplastic resin; and (D) a magnetic filler, wherein the modulus of elasticity of a cured product at 23°C is 7-18 GPa, the cured product being obta...
|
|
WO/2018/194100A1 |
This resin composition contains: (A) a thermosetting resin; (B) a curing agent; (C) a thermoplastic resin; (D) a magnetic filler; and (E) an inorganic filler other than the magnetic filler, wherein, when a content mass of component (D) i...
|
|
WO/2018/189945A1 |
The purpose of the present invention is to provide a curable composition that makes it possible to form a hardcoat layer that has a favorable appearance, e.g., favorable surface smoothness (uniformity of thickness), that has high surface...
|
|
WO/2018/190346A1 |
A thermosetting resin composition according to the present invention comprises a polyester amide acid (A), an epoxy compound (B) having a fluorene skeleton, a coloring agent (D), and a thiol compound (E) having a plurality of thiol group...
|
|
WO/2018/190292A1 |
A resin composition which contains an epoxy resin (A) represented by general formula (1) and a cyanic acid ester compound (B).
|
|
WO/2018/188932A1 |
The present invention relates to an organic aerogel obtained by reacting an amine compound having at least two amine functionalities and a cyclic ether compound in the presence of a solvent. An organic aerogel according to the present in...
|
|
WO/2018/184151A1 |
Provided is a light curable composition comprising a) an epoxy resin component; b) epoxy silane oligomer having a general structure (1) or (2) or (3); and c) a cationic photoinitiator. The said composition provides good adhesion properti...
|
|
WO/2018/186339A1 |
Provided is a thermoplastic polyester resin composition obtained by blending 0.05-10 parts by weight of an epoxy compound (B) and 0.001-1 parts by weight of a hindered amine compound (C) with 100 parts by weight of a thermoplastic polyes...
|
|
WO/2018/186030A1 |
Provided is a resin composition capable of: giving a prepreg which has satisfactory formability and high adhesiveness to the base and is reduced in dusting; and forming a cured object having a low coefficient of thermal expansion. The re...
|
|
WO/2018/186972A1 |
An epoxy resin composition is provided which comprises an epoxy resin and a reactive diluent comprising one or more of the monoesters of epoxidized soy oil characterized by a ratio of mols of epoxide groups to mols of ester on the whole ...
|
|
WO/2018/180091A1 |
Provided is a resin composition that is capable of achieving excellent thermal properties. The resin composition comprises an epoxy compound and a trinaphthylbenzene compound. (Provided that in the trinaphthylbenzene compound, one or mor...
|
|
WO/2018/181737A1 |
A paste-like resin composition which contains (A) an epoxy resin, (B) a liquid curing agent, (C) a heat conductive filler and (D) a dispersant.
|
|
WO/2018/181286A1 |
The present invention provides: a method for producing a prepreg which has small variation in the amount of dimensional change; a prepreg which has small variation in the amount of dimensional change; a laminate; a printed wiring board; ...
|
|
WO/2018/181849A1 |
Provided is an epoxy resin composition for fiber-reinforced composite materials, which has a good balance between storage stability and impregnation ability during the production of a prepreg, and which enables the achievement of a molde...
|
|
WO/2018/177939A1 |
An aqueous dispersion comprising at least one fatty acid-modified epoxy amine adduct wherein the fatty acid has an iodine number of lower than 30andat least one polymer obtained from the polymerization of one or more ethylenically unsatu...
|
|
WO/2018/181600A1 |
An epoxy resin composition for sealing, which contains (A) an epoxy resin, (B) a curing agent, (C) a curing accelerator and (D) an inorganic filler, and which is configured such that the inorganic filler contains 75% by mass to 98% by ma...
|
|
WO/2018/181601A1 |
Provided is an epoxy resin composition for sealing, the composition containing (A) an epoxy resin, (B) a curing agent, (C) a curing accelerator, (D) an inorganic filler, and (E) a C17-C50 fatty acid amide compound.
|
|
WO/2018/181947A1 |
A polycarbonate resin composition which contains (A) an aromatic polycarbonate resin, (B) an alicyclic epoxy compound, (C) a predetermined antioxidant and (D) a predetermined phosphorus compound, and wherein, relative to 100 parts by mas...
|
|
WO/2018/181802A1 |
The present invention provides: a curable resin composition with which it is possible to obtain a cured product that is capable of retaining a low thermal expansion rate even in a high-temperature range during component mounting and that...
|
|
WO/2018/181857A1 |
[Problem] To provide a curable resin composition for obtaining a cured product capable of exhibiting both high heat resistance and high adhesion to metals, a cured product of said composition, and a method of producing said curable resin...
|
|
WO/2018/181803A1 |
Provided are: a curable resin composition which enables the achievement of a cured product that is able to maintain low thermal expansion coefficient not only at normal temperature but also in a high temperature range exceeding 200°C du...
|
|
WO/2018/180451A1 |
The present invention addresses the problem of providing: an epoxy resin which is excellent in terms of flowability and curability, gives cured objects having satisfactory moisture resistance and mechanical strength, and is suitable for ...
|
|
WO/2018/180470A1 |
Provided is a resin composition which can be used to form a cured resin product, a resin substrate, and a laminate substrate having excellent heat dissipation properties and tracking resistance, and has excellent filling properties. This...
|
|
WO/2018/181603A1 |
A liquid epoxy resin composition comprises an epoxy resin, a curing agent, and a filler; the epoxy resin comprising an epoxy compound having at least three epoxy groups, and the content ratio of the epoxy compound that has at least three...
|
|
WO/2018/181842A1 |
Provided is a novel soluble polyfunctional vinyl aromatic copolymer capable of giving a cured product or molded body having improved heat resistance, compatibility, dielectric properties, reliability in moist heat and thermal oxidative d...
|
|
WO/2018/176771A1 |
The present invention relates to the field of matt films and manufacturing methods therefor. Disclosed are a BOPP matt film and a manufacturing method therefor. The BOPP matt film comprises three layers, i.e., layers A, B, and C. Layers ...
|
|
WO/2018/181949A1 |
This polycarbonate resin composition contains: an aromatic polycarbonate resin (A); an alicyclic epoxy compound (B); a predetermined antioxidant (C); and a predetermined phosphorus compound (D), wherein with respect to 100 parts by mass ...
|
|
WO/2018/181384A1 |
This epoxy resin composition contains: a monofunctional epoxy compound which has one epoxy group in each molecule; a polyfunctional epoxy compound which has two or more epoxy groups in each molecule; and a curing agent. This curable resi...
|
|
WO/2018/181838A1 |
The present invention is a composition which is capable of forming a heat dissipation member that has high thermal conductivity and high heat resistance, while being able to be controlled with respect to the thermal expansion coefficient...
|
