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Matches 1,101 - 1,150 out of 2,764

Document Document Title
JP4854092B2
To provide a re-releasable pressure-sensitive adhesive which shows little rise in adhesiveness even after a long term even when it is applied to a coated surface and can be easily re-released without leaving any adhesive, and to provide ...  
JP2012001717A
To provide an emulsion polymer of a high polystyrene based microdomain content which has satisfactory adhesion characteristics given by an elasticity continuous matrix in an adhesive formulation.The microdomained aqueous emulsion polymer...  
JP2011256339A
To provide a metal-laminating adhesive for battery, excellent in adhesion to metals and hardly penetrating with an electrolyte.The metal-laminating adhesive for battery contains an acid-modified polyolefin (A) which is obtained by graft-...  
JP4841725B2
An adhesive material is suitable as a bioadhesive and comprises an adhesive polymer and a plasticizier thereof, wherein the adhesive is cross-linked, characterized in that the adhesive comprises ketone groups cross-linked by a polyamine ...  
JP4836108B2
To obtain an adhesiveness-improving agent providing an adhesive composition having excellent adhesive strength, peelability at a constant load, and stain resistance by being formulated with a (meth)acrylic polymer, and having excellent c...  
JP4835966B2  
JP2011246572A
To provide an aqueous emulsion not containing a chlorinated polyolefin and giving a coating film excellent in adhesion to polypropylene.The aqueous emulsion comprises: (A) an acrylic resin comprising a structural unit derived from an α,...  
JP4831268B2
To provide a packaging material excellent in gas barrier properties of steam and other gas as a sheet to be used for a case for housing a polymer battery or the like, having mechanical strength inclusive of thrust resistance or the like,...  
JP2011529118A
A two-part epoxy-based structural adhesive composition comprising a curable epoxy resin, an amine curing agent, a toughening agent, and an oil-displacing agent. The structural adhesive may optionally include reactive liquid modifiers, fi...  
JP4824876B2
To provide a paste material for connecting a circuit, which is excellent in storage stability and workability in application with a dispenser, is free from the exudation of resin, bubbling and bleeding in thermocompression bonding, and g...  
JP4823484B2  
JP2011236261A
To provide an adhesive film for a semiconductor, wherein: the adhesive film has an adhesive layer for making a semiconductor chip adhere to a substrate, lead frame or semiconductor chip; and the adhesive layer can be peeled off a pressur...  
JP4817493B2
Polyethylene-based adhesive compositions which contain as little as 5 weight percent, and up to 35 weight percent of an acid-grafted metallocene polyethylene have superior peel strength to comparable compositions containing an acid graft...  
JP4810878B2  
JP4813733B2
Aqueous (meth)acrylate copolymer dispersions preparable by (I) subjecting at least one monomer (a) containing at least one hydrophilic functional group which brings about the water-solubility or water-dispersibility of the (meth)acrylate...  
JP4794702B2  
JP4794201B2
An object of the present invention is to provide a paste-type cement composition which while retaining adhesion to tooth substance, biocompatibility, surface curability and fluorine sustained-releasability which are the characteristics d...  
JP4794704B2  
JP4794703B2  
JP4792223B2
A composition that includes first solid particles including a first polymer, second solid particles including a second polymer, and a liquid into which the first solid particles and the second solid particles are dispersed, wherein the c...  
JP2011190286A
To provide a hot-melt adhesive composition which enhances adhesive strength to an adherend and is improved in adhesion.The hot-melt adhesive composition contains core-shell particles (B) formed by coating a core layer with a shell layer ...  
JP2011184528A
To provide a circuit connecting material compatible with fast curing property and adhesion and connecting a circuit for a short time.The circuit connecting material is prepared by dispersing conductive particles in an adhesive compositio...  
JP4777343B2
A propylene-based polymer composition for adhesive use and a laminate structure thereof are provided, wherein decrease of bonding strength is prevented when the laminate structure is formed and heat treatment is applied and whitening in ...  
JP2011178861A
To provide a resin dispersion providing excellent adhesiveness and low-temperature heat-sealability when used as an adhesive, and capable of sticking a polyolefin-based resin with a metal by low-temperature and short-time heating, to pro...  
JP2011181525A
To provide an anisotropic conductive material capable of suppressing degradation of an epoxy resin and reducing connection resistance.Conductive particles are dispersed in an insulating adhesive resin containing the epoxy resin, a cation...  
JP4771445B2  
JP4773041B2
To provide a hot sealing system having high heat resistance and a short sealing time. The hot sealing system includes an olefin polymer/copolymer A, a methacrylate copolymer B, and a graft polymer A-X. The hot sealing system consists of ...  
JP4774189B2  
JP4767673B2  
JP4762185B2  
JP2011162637A
To provide an aqueous low-refractive resin and an aqueous low-refractive resin composition mainly for optical articles, which has low refractive index, can be applied with an aqueous medium, with cured article excellent in transparency a...  
JP4737655B2
To provide a metal adhering intermediary film which can rigidly adhere to a metal, which has a stable adhering strength between respective layers, excellent steam barrier properties, and further excellent heat resistance and working suit...  
JP4738850B2  
JP4736146B2
To provide a structure, as a sheet used for a case for housing a polymer battery, having excellent gas barrier properties such as water vapor, mechanical strength such as piercing resistance, usability in high temperature and stability t...  
JP4729401B2
A chlorine-free adhesive composition of the present invention for use in the adhesion of a thermoplastic elastomer and a glass article, which comprises a modified polyolefin having a propylene-±-olefin copolymer as the main chain and at...  
JP2011519989A
An adhesive tape has a carrier and an adhesive that is applied to at least one side of the carrier. The adhesive is made of a tackifier resin and an olefin polymer having a density of between 0.86 and 0.89 g/cm3 and a minimum crystallite...  
JP4718667B2
To provide a cleaning sheet for a substrate treating device which has to be kept away from a foreign matter such as, for example, a manufacturing or detecting device for semiconductor, flat panel display or printed circuit board. This cl...  
JP4717463B2  
JP4714672B2  
JP2011121308A
To provide a laminate wherein a decorative member such as a resin sheet, fabric or nonwoven fabric is effectively and beautifully bonded to a resin or metal base material by solving problems in using a solvent-based adhesive, and to deve...  
JP4707320B2  
JP4707802B2  
JP4703967B2
A process for producing a multi-layer heat shrinkable tube having an adhesive layer on an internal surface thereof, which comprises the following steps 1 to 4: (1) Step 1 of co-extruding a radiation-crosslinking composition comprising a ...  
JP4698049B2  
JP2011516675T
i epoxy resin which provides combining metal especially by the auto industry with structure adhesives which have the improved useful cold shock strength especially, an addition of an elastomer and ii フェノキシ resin, an iii core / ...  
JPWO2009096375A1
The present invention is an aqueous dispersion containing a graft copolymer and water satisfying the following (a) to (e), and exhibits excellent aqueous dispersibility even in a state where the surfactant is reduced, and also. It is an ...  
JP2011516675A
An adhesive formulation having an adduct of an epoxy resin and an elastomer, a phenoxy epoxy hybrid resin supplied as a solution formed by dissolving a phenoxy resin in a liquid epoxy resin to form a pre-formed dissolution product, a cor...  
JP4683567B2
A description is given of an optionally fluorinated polyurethane-polymer hybrid dispersion with enhanced surface properties (low critical surface tensions gammac and very high contact angles theta) which is obtainable by a) preparing a d...  
JP4685301B2
A wet-skin adhesive includes a pressure-sensitive adhesive component that includes at least one monoethylenically unsaturated (meth)acrylic acid ester comprising an alkyl group having at least 4 carbons on average and at least one monoet...  
JP2011084747A
To provide a hot sealing system having high heat resistance and a short sealing time.The hot sealing system includes an olefin polymer/copolymer A, a methacrylate copolymer B, and a graft polymer A-X. The hot sealing system consists of t...  

Matches 1,101 - 1,150 out of 2,764