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JP2001064618A |
To prepare the subject adhesive film having good wetting property in bonding to chip and having an adhesive layer with high heat resistance by forming an adhesive layer containing a polymer having a specific structure onto the surface of...
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JP3146338B2 |
PURPOSE: To provide bondable organic coated metal plate, which develops adhesiveness by heating and the blocking resistance of which is stable at a high level at all times as long as temperature is kept below a specified value. CONSTITUT...
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JP2001501986A |
High-solids and powder coatings are disclosed. The high-solids coatings comprise an acrylic resin; a melamine, silane, or polyisocyanate crosslinking agent; an organic solvent; and optionally, a pigment and a crosslinking catalyst. The a...
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JP2001032177A |
To obtain the subject fabric favorably adhesive to a water-repellent- finished fabric by scattering an adhesive based on resin(s) having respective specified ranges of melting point and weight-average molecular weight such as of polyeste...
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JP2001019054A |
To well fit to the shape of an object to be dehydrated to improve adhesion by applying an adhesive on a portion of one of surfaces of a base material in a manner that a form and a contact area with the object varies according the shape o...
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JP2001019937A |
To provide an adhesive cloth having a thermoplastic resin thermally fused to a surface of a base cloth, provide an adhesive interlining cloth necessary for imparting an aesthetic function and beautiful silhouette especially to a women's ...
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JP2001003022A |
To obtain a composition which has a long pot life and excellent in water, heat and boiling water resistance in terms of adhesive strengths by including a COOH group-modified PVA aqueous solution and a polyamide-epoxy resin.A COOH group-m...
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JP2000336330A |
To provide a film coated with an adhesive at a relatively low temperature and bondable to a 2nd continuous sheet material after the application of the adhesive.This film is produced by applying a reacting adhesive to regions sporadically...
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JP2000515564A |
A process is provided for preparing a dispersion of a polyamide in water, said process comprising: forming a solution of a polyamide having an acid value of greater than about 2 in an organic solvent to form a solution of said polyamide ...
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JP3109707B2 |
PURPOSE: To obtain an adhesive excellent in heat resistance, adhesive force, water absorption and package cracking resistance. CONSTITUTION: This heat-resistant adhesive is used as an adhesive member when producing a semiconductor packag...
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JP2000514814A |
The invention concerns a process for preparing water-dispersible polymer blends comprising a polyamide and a second polymer by polymerizing an aqueous dispersion or solution consisting of a polyamide, one or a plurality of ethylenically ...
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JP2000302916A |
To obtain the subject composition capable of forming an adhesion layer having excellent bond strength, heat resistance and flexibility by making the composition include a specific resol type compound, a specified linear polyamide resin a...
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JP2000273168A |
To obtain an aromatic polyamide which has a high Tg, solubility in organic solvents, and excellent adhesion by selecting a polymer in which the aromatic diamine component essentially consists of an aromatic diamine having a proton-donati...
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JP3088643B2 |
To provide a nonpermeable surface material which has extremely easy handling, excellent ventilation shield and heat fusibility for various base materials by sequentially laminating a skin material, cushioning material and nonpermeable ho...
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JP2000248251A |
To obtain a polyamide resin-based hotmelt adhesive composition having a secondary adhesive performance excellent in water resistant creep property, heat resistance, or the like, and capable of remarkably improving both adhesive property ...
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JP2000246854A |
To provide a multilayered composite consisting of polyamide and polyester. A layer comprising an adhesion auxiliary is provided between a layer comprising a polyamide molding material and a layer comprising a polyester molding material a...
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JP2000248124A |
To obtain a heat seal material having excellent appearance and good heat sealing properties by including an ethylene/vinyl alcohol copolymer with a polyamide resin, an ethylene/unsaturated carboxylie acid copolymer ionomer, and a polyole...
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JP2000511965A |
A process is provided for preparing a dispersion of a polyamide in water, said process comprising: dissolving a polyamide having an amine value of greater than about 2 in an organic solvent to form a solution of said polyamide in said so...
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JP2000219855A |
To provide a method for demonstrating original properties of a resin agent which constitutes an adhesive material. An adhesive sheet 10 is obtained by processing reactive hot-melt resin 10' which solidifies at ordinary temperature and so...
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JP2000204342A |
To obtain a resin composition capable of readily bonding any of solvent bonding types and heat-bonding types in production, etc., of winding such as coil and laminated boards by including a specific resol type compound and a specific lin...
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JP3065243B2 |
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JP2000508701A |
The object of the invention is the use of thermoplastically processable polyester amides as compostable melt adhesives, especially as hot-melt foil, in which said polyester amides consist of 30 to 70 wt.% aliphatic esters and 70 to 30 wt...
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JP2000508699A |
The present invention relates to a compostable adhesive, to a method of producing the same, and to the use of the adhesive for the adhesive bonding of materials.
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JP2000178519A |
To provide semiconductor adhesive films good in workability and yield due to the good adhesiveness to a polyimide film of a substrate film, and lead frames, and also provide semiconductor devices using the same.This semiconductor adhesiv...
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JP2000169734A |
To obtain a resin composition which is excellent in water solubility and film-forming properties and gives a coating film little in stickiness by reacting a resin composition containing a polyurethane or the like having cationizable amin...
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JP2000505370A |
See-through, packaging structures for liquid or semi-liquid fruit or vegetable products, which have a polyamide food contact-layer of at least 0.4 mil. thickness, extends the color-life of the contained food product. The polyamide layer ...
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JP2000119403A |
To obtain a thermal-recovery article which has both high shrinkage and excellent fit to an adherend and shows good resistance to shifts when it is used and good resistance to cracks even when it is used at high temperatures and exert hig...
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JP3034597B2 |
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JP2000086888A |
To provide a resin composition, an adhesive and a film adhesive, which are capable of bonding to an adherend at a low temperature, excellent in heat resistance and particularly suitable for fixing inner leads and a lead frame and a semic...
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JP3017929B2 |
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JP2000073032A |
To obtain a multi-layered laminate type adhesive type capable of realizing good voltage-resistant characteristics, the reduction in the amount of an adhesive, etc., and capable of exhibiting excellent electric insulating and electromagne...
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JP3016274B2 |
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JP2000502136A |
(57) [Summary] A composition comprising an olefin-terminated polyalkene containing a carboxyester binding group and a monoisocyanate capped at least one rainbow hydroxyl group in the nascent stage. The composition also includes a free ra...
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JP2000501755A |
Disclosed is a radiation crosslinkable water-dispersible adhesive composition that is useful in forming paper and plastic articles and other products that can be recycled through a process which includes washing or repulping in aqueous m...
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JP2000044910A |
To obtain an adhesive composition having improved water resistance by incorporating a resin comprising an ethylene/vinyl acetate copolymer saponificate and a polyamide and an alkoxy silicon compound. This composition comprises 100 pts.wt...
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JP2000044888A |
To obtain the subject adhesive capable of being removed without destroying a substrate after being used as an adhesive for a microelectronic device and a semiconductor package by containing a specific maleimide compound and a curing init...
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JP2000007787A |
To provide a very practical aqueous emulsion of a polyamide resin having a low viscosity at normal temperatures and an excellent stability with time. In aqueous emulsions of various types of polyamide resins including dimer acid-modified...
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JPH11354592A |
To improve the adhesiveness, insulation property, and workability of an adhesive-backed tape, by mixing at least a thermoplastic resin and a phenol resin as essential ingredients in the adhesive layer of the tape, and specifying the soft...
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JP2979049B2 |
Heat-activatable bonding agents for the surface treatment of metals or plastics before bonding, containing - 0.1-10% by weight of a carbonyl compound containing at least one activated double bond, - 5-30% by weight of a polymer containin...
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JP2972363B2 |
The present invention relates to a method of improving the adhesion between an aramid cord and sulfur vulcanized rubber comprising (a) treating the aramid cord with a copolymer of the structural formula: wherein w is an integer of from 1...
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JP2972240B2 |
Laminated composites made with layers of fiber reinforced thermosetting resin prepregs and with thermoplastic film interleaf layers are improved by using thermoplastic film coated with thermosetting adhesive as the interleaf layer. In co...
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JPH11293203A |
To prepare a pressure-sensitive adhesive sheet having a support made of a biaxially oriented polystyrene film and a process for producing the same. There is provided a pressure-sensitive adhesive sheet consisting of a biaxially oriented ...
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JPH11286079A |
To prevent an aging change of an antistatic effect and to obtain a transparency by laminating a specific amount of an antistatic agent as a primer layer. A polyester film is used as a base film 1. A primer layer 2 containing an antistati...
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JPH11279903A |
To obtain a filler tape having excellent adhesiveness and washing durability, suitable for waterproof clothing. This filler tape is obtained by laminating a polyurethane resin through an adhesive layer to a warp knitted fabric which is m...
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JPH11511774A |
PCT No. PCT/EP96/02194 Sec. 371 Date Nov. 24, 1997 Sec. 102(e) Date Nov. 24, 1997 PCT Filed May 22, 1996 PCT Pub. No. WO96/37566 PCT Pub. Date Nov. 28, 1996The proposed process for bonding together two substrates with an anhydrous or low...
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JPH11245353A |
To obtain a multilayer film having a polypropylene layer, a thermotropic liquid crystal polymer layer, and a hot melt adhesive layer which is placed between the two layers. A thermotropic liquid crystal layer and a polypropylene layer in...
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JP2949460B2 |
PURPOSE: To provide an organically coated metal plate which can be molded without press oil and shows adhesiveness under heat. CONSTITUTION: An organically coated metal plate has an adhesive organic matter with a film thickness of 0.5-10...
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JP2939324B2 |
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JPH11228931A |
To attain a high-temperature reliability suitable for a flexible printed- wiring board or packaging of an electronic device by employing an epoxy terminal polyamide resin having a specified molecular weight, an epoxy resin, and a curing ...
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JP2935755B2 |
A chip card consisting of a plastic card (1) in which there is a semiconductor chip (9) electrically connected to contact strips (4) which are connected to the plastic card (1) via an adhesive (5) consisting of at least three layers, in ...
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