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JP2004339415A |
To provide a liquid composition capable of forming a heat-sensitive adhesive layer by printing or coating without accompanying any of such a fault that a heating apparatus and a drying apparatus and in addition an apparatus for the count...
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JP3581236B2 |
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JP3577873B2 |
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JP2004531606A |
The invention relates to a hot-melt adhesive composition for use in a textile product, in particular a tufted carpet, containing a polymer chosen from the group of polyamides, with a number-average molecular mass of 500-5000 g/mol and fu...
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JP3577597B2 |
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JP2004277478A |
To provide an adhesive composition which is used for semiconductor devices, gives adhesive layers having high elastic moduli at high temperature, has a high wire bonding property, and gives scarcely bending adhesive sheets, to provide an...
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JP3572815B2 |
To obtain a tape with adhesive for TAB having improved insulation and heat-resistance deformation property by allowing an adhesive layer to include modified polyamide resin with a specific substituent group as an essential ingredient. A ...
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JP3571002B2 |
Copolymers with polyamide and ethoxylated primary amine blocks which have fusion temperature 80-135 degrees C and melt fluidity index 5-80 g/10 min (2.16 kg, 150 degrees C)
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JP3570520B2 |
PURPOSE: To effectively exclude bubbles caused by mixed air in a short period by sticking a plurality of films together via a thermosetting adhesive, and then heat-curing them under a specified compressing condition. CONSTITUTION: A plur...
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JP2004263048A |
To develop a permeation type adhesive which is rapidly penetrated into a minute gap and with which adhesion and fixation are carried out at fixed strength and steel structure is repaired simply, safely and firmly using the permeation typ...
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JP3569194B2 |
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JP3565569B2 |
PURPOSE: To obtain a binder composed of a specified aqueous emulsion and a polyamide-based resin, excellent in mechanical stability and compatibility with various kinds of additives and capable of producing an impregnated paper excellent...
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JP3560542B2 |
To obtain a cloth repairing material for clothing, etc., capable of accurately bonding even a thin linear repair part in a stable state, carrying out a bonding operation in a temporarily fixed state in a repair and properly adjusting an ...
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JP3554323B2 |
This invention provides an adhesion binder for binding fluorinated polymers, for example, PVDF, with incompatible polymers such as polyamides. The binder is a polymer A which has glutarimide, acid, anhydric and acrylate units, and is use...
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JP3555381B2 |
To contrive the enhancement of the adhesiveness of a tape with a bonding agent for semiconductor use while the superior insulation properties of the tape are held by a method wherein a bonding agent layer subsequent to hot setting is pro...
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JP2004197012A |
To provide a polyamide based hot melt adhesive composition excellent in adhesiveness to secure accurate adhesion in a short time by electromagnetic induction heating, especially in heat resistance, and further excellent in blocking resis...
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JP2004176003A |
To provide an epoxy resin composition that has excellent flexibility, adhesion and heat resistance, an adhesion sheet and an bonding sheet using the same and methods of producing thereof.The adhesive sheet or film bears an island-and-sea...
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JP3532749B2 |
To provide sufficient electric conductivity, mechanical strength and heat resistance, and to prevent performance from degrading even if a conductive composition is used for many hours in a high temperature environment when it is used as ...
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JP2004515565A |
Condensation products prepared from cyclic carboxylic anhydrides of dicarboxylic acids, tricarboxylic anhydrides or tetracarboxylic anhydrides and difunctional polyamines, in particular polyoxyalkyleneamines, are suitable as a builder co...
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JP3527125B2 |
To obtain the subject adhesive capable of forming a return blocking material showing high adhesivity, over point bondability, washing resistance and dry cleaning resistance, useful as a clothing padding material by initially reacting a r...
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JP2004514015A |
Two-component polyurethane binding agents based on a polyester polyol with an aliphatic or cycloaliphatic polyisocyanate and a curing-agent component based on polyamine mixtures are suitable as UV-resistant flocking adhesives for the flo...
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JP3523082B2 |
To improve heat resistance, insulating properties and adhesiveness at a high temperature of a resin composition by blending an aromatic polyamide resin having a phenolic hydroxide group and a specific linear polyamide resin. An aromatic ...
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JP2004123874A |
To provide a resin composition yielding a film-like adhesive which is suitably used as an insulating resin layer, etc., in a build-up multilayer printed wiring board, is excellent in thermal cycle reliability, solder heat resistance, ele...
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JP3521743B2 |
To obtain a polyamide solution less colored which exhibits excellent fluidity and does not give rise to a deposit, resulting in excellent transparency even stored at an ordinary temperature or below by compounding a substituted urea deri...
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JP2004107588A |
To provide a thermoplastic resin composition which is a hot-melt adhesive composed mainly of a polyester resin and/or a polyamide resin having high chemical resistance and heat-resistance, enabling the thermal bonding of a bonding part b...
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JP2004510865A |
Polyolefin chain grafted with polyamide units mixed with a flexible copolymer that has a flexural modulus less than 150 MPa at 23 [deg]C : A mixture (M) comprising: (a) 1-100 wt.% of a copolymer grafted with polyamide blocks consisting o...
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JP3503392B2 |
To obtain a product superior in adhesion, chemicals resistance and insulation by using an adhesive layer contg. a thermoplastic resin A and an epoxy resin B which contains an epoxy resin having a skeleton shown by specified formula as a ...
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JP3501810B2 |
PCT No. PCT/EP95/00817 Sec. 371 Date Sep. 11, 1996 Sec. 102(e) Date Sep. 11, 1996 PCT Filed Mar. 6, 1995 PCT Pub. No. WO95/24439 PCT Pub. Date Sep. 14, 1995A composition of matter useful as a hotmelt adhesive is provided. The adhesive co...
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JP3098333U |
Film material (1) with a discontinuous layer of reactive bonding agent on the surface has particles of hot melt adhesive combined with the bonding agent. Independent claims are also included for (a) a laminate in which (1) is bonded with...
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JP2004051841A |
To provide a white adhesive layer free from occurrence of color unevenness, etc., in a lamination step and excellent in an opacifying power also in a thin film.The white adhesive for polyester film laminate metal cans comprises (A) a hyd...
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JP2004503665A |
A polyamide, the enzymatic reaction product of at least one polyamine and diester, and processes for preparing and using the same. In addition, processes for preparing and using the enzymatic reaction product as creping adhesives and wet...
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JP3492235B2 |
To obtain the subject polyamide as a non-migratory substance capable of flexibilizing polyamides, having high flexibilizing effect and having favorable low-temperature behavior and good hydrolysis resistance as well by polymerization (po...
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JP3491836B2 |
Hot melt adhesive compositions containing amine and acid terminated polyamide resins, optionally curable when combined with epoxy resins, wherein the amine component of the polyamide resin contains (i) 1,2-diaminopropane, (ii) a piperazi...
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JP3471809B2 |
Biodegradable polyesteramides as defined in the specification are obtained by reacting a mixture consisting essentially ofa1) a mixture consisting essentially of35 to 95 mol % of adipic acid or ester-forming derivatives thereof,5 to 65 m...
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JP2003336032A |
To provide a heat-resistant adhesive suitable for manufacturing a coil requiring a high-level heat resistance.An alkoxysilane compound in an amount of 5-50 pts.wt. is incorporated with 100 pts.wt. of a base adhesive comprising a polyimid...
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JP2003321655A |
To solve problems such that an adhesive layer having a fairly lower glass transition temperature than that of a substrate film, is melted and attaches to a punching machine by a high frictional heat on punching, for inducing frequent exc...
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JP2003533578A |
Flexible, halogen-free, high frequency-sealable films fabricated from a blend of a copolyamide and a polyolefin having a carboxylic acid or carboxylic acid anhydride functionality have sufficient copolyamide to yield a DLF of at least 0....
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JP2003318354A |
To solve the problem that burrs and foreign materials are produced when a composite film is punched on a lead frame.The composite film has such a structure that an adhesive is stacked on a base film. Elastic coefficients of the composite...
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JP2003532802A |
Handcovering, i.e. glove (72) or mitten, comprising an outer shell (50) and an inner glove insert (52) adhered to the shell (50). The glove insert (52) comprises a lining fabric laminated to a functional layer (42) that is water vapor pe...
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JP2003309009A |
To provide a magnetic core whose shape is maintained after an annealing heat treatment without handling a fragile thin band, having good core loss characteristics and to provide an adhesive resin composition for a magnetic core, which is...
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JP2003286390A |
To provide an epoxy resin composition useful as e.g. an adhesive for an insulating resin layer of a build-up multilayer printed-wiring board, and an adhesive for connecting a semiconductor element to a substrate, a film adhesive, and a c...
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JP2003286467A |
To obtain a hot-melt adhesive composition having excellent adhesiveness and showing reduced residual tackiness after being applied and to provide an adhesive element using the adhesive composition.The hot-melt adhesive composition compri...
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JP2003286468A |
To obtain a hot-melt adhesive composition having excellent adhesiveness and showing reduced residual tackiness after being applied and to provide an adhesive element using the adhesive composition.The hot-melt adhesive composition compri...
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JP2003529664A |
The invention is directed to an adhesive composition comprising a water based component including a film-forming polymer and a particulate thermoplastic component selected from the group consisting of thermoplastic polymers, thermoplasti...
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JP3452582B2 |
PCT No. PCT/EP96/00059 Sec. 371 Date Jul. 3, 1997 Sec. 102(e) Date Jul. 3, 1997 PCT Filed Jan. 9, 1996 PCT Pub. No. WO96/21690 PCT Pub. Date Jul. 18, 1996Biodegradable polyetheresteramides P1 which are obtained by reacting (a1) a mixture...
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JP3451657B2 |
PURPOSE: To obtain the subject composition having excellent adhesion property (reliability), insulating properties (reliability), chemical resistance, conductive material slippage resistance, etc., comprising a polyamide resin and a spec...
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JP2003268342A |
To provide a hot-melt adhesive which comprises a mixture comprising (1) 20-80% of a mixture of (a) 50-100% of a polyamide block-containing graft copolymer (A) comprising a polyolefin trunk polymer bearing at least one polyamide graft gro...
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JP2003253233A |
To obtain a hot-melt adhesive powder dispersion having heat resistance and strong adhesiveness and a product having heat adhesiveness using the dispersion.The hot-melt adhesive powder dispersion is obtained by dispersing powder of a hot-...
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JP3440428B2 |
To produce a glass cloth, undergoing the fraying preventing treatment, favorable for the environmental sanitation and useful for carrying out the production of prepregs of good quality. This glass cloth is obtained by coating the selvedg...
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JP2003213240A |
To obtain an adhesive composition excellent in adhesion and heat resistance.This adhesive composition contains (a) an aromatic polyamide expressed by formula (1) (R1 and R2 are each a divalent aromatic group; R3 is a 2-30C organic group;...
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