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JP2003522206A |
The present invention relates to a moisture or water activatable tape or string useful for reinforcing and/or for tear tape opening systems for various corrugated and cartonstock containers.
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JP3425857B2 |
To obtain an adhesive for a polyamide/polyester multilayer composite material and a compatibilizer for a polymer blend by using a block polyester- amide having a polyamide block and an aromatic polyester block and forming two crystal pha...
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JP2003181993A |
To provide a cover lay film which shows high operating efficiency in that it can be press-bonded in a short time, and also outstanding flame- retardant properties and high-temperature sliding/flexing properties without the generation of ...
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JP2003176471A |
To provide a new adhesive sheet for a semiconductor device excellent in wire bonding properties, adhesive properties and solder heat resistance, and to provide a semiconductor device using the same.An adhesive composition for a semicondu...
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JP2003165894A |
To provide a practical method for producing a flexible printed circuit board exhibiting excellent flame retardance without halogen and having excellent properties required as the flexible printed circuit board, especially high flexural p...
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JP2003165891A |
To provide a practical method for producing a resin composition having good flexibility in spite of high glass transition temperature (Tg) and exhibiting various properties required as a flexible printed circuit board.The resin compositi...
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JP2003154797A |
To provide a transfer sheet which shows excellent surface hardness after transfer or reliable transferability to a porous base material and has an adhesive layer which can be simply formed by a routine coating process and exhibits an out...
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JP3411227B2 |
To obtain a composition excellent in impact resistance, thermostability and water-resistance which shows excellent adhesion to a coated steel plate without needing a pre-treatment process by incorporating a main agent composed of an epox...
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JP3406595B2 |
The present invention provides an adhesive composition that is useful as an energy-curable, one-part adhesive, suitable for bonding electronic components. The adhesive composition, preferably provided as an adhesive film, comprises the r...
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JP3404008B2 |
To provide a graft copolymer which is suitable as a blend component for molding materials and as a hot melt type adhesive. This graft copolymer contains (a) a polyamine which has at least 11 nitrogen atoms and a number-average mol.wt. of...
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JP3396989B2 |
PURPOSE: To realize good bonding property and chemical resistance by incorporating naphthol compound and polyamide resin to an adhesive layer as an essential element. CONSTITUTION: The title tape is constituted of a lamination body havin...
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JP2003096416A |
To provide an oversheet for a card having sufficient adhesive force to ink for offset printing and ink for silk screen printing, capable of corresponding to the variety of card designs, producible with a simplified process and free from ...
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JP2003089783A |
To obtain a solvent adhesive capable of exhibiting a sufficient adhesive strength when nylon resin molded products are mutually bonded.This adhesive for the nylon resin molded products comprises a solvent and a copolymer nylon. Specifica...
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JP2003089781A |
To prepare a new laminated film having an excellent adhesive strength and to provide a semiconductor device using the laminated film.The adhesive composition for the semiconductor device comprises a thermoplastic resin and a phenol resin...
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JP3385726B2 |
PURPOSE: To ensure stabilized adhesion by setting the ratio of (curing reaction heating value of an adhesive layer abutting on a protective film)/(curing reaction heating value of an adhesive layer abutting on a flexible insulating film)...
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JP3384357B2 |
To avoid increase of a linear expansion coefficient of liquid crystal polymer tape and also to avoid generation of air gaps in a bonded part of the tape. Upon mounting a semiconductor chip 5 to a lead frame 1 having a hot melt type liqui...
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JP2003064343A |
To provide an adhering tool capable of being easily handled and applied to an adherend with good controllability and capable of realizing stable adhering power after thermally pressed.In this adhering tool composed of a stick main body 3...
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JP2003041213A |
To provide a double-side adhesive fabric which uniformly adheres to a fabric such as an outer material, exhibits a high adhesive power, can be uniformly coated with a resin when produced, makes the maintenance of production equipment sim...
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JP2003041124A |
To provide a resin composition having excellent preservation stability, intermittently and uniformly applicable to a vertical rotating roll surface and suitable for label bonding. This resin composition is characterized as comprising the...
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JP3375636B2 |
The present invention is an article of manufacture comprising a substrate having a binder composition applied thereon. The binder applied to the substrate comprising a polymeric backbone comprising recurring monomeric units derived from ...
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JP2003034007A |
To provide a structure having a fluoropolymer layer and a piperazine base bonding layer, capable of being formed into a sheet, a film, a profile material or a tube and useful as a gasoline transport tube between the tank and jet device o...
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JP2003020466A |
To provide a belt for a printer having improved electroconductivity at the joint part of a jointed flexible belt.The polyamide-containing adhesive 63 contains electroconductive fillers 61, 62 dispersed or included in the adhesive. The ad...
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JP2002367771A |
To provide an organic electroluminescent element, and its manufacturing method, which can enough and stably restrain enlargement with time of dark spots. With the organic electroluminescent element comprising a first electrode 2 formed o...
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JP2002368043A |
To obtain a conductive paste ensuring stabilized reliability of electrical connection between electrode layers through inner via holes, and to obtain a circuit board including inner via holes using that paste. The conductive paste contai...
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JP2002363527A |
To provide a pressure-sensitive adhesive composition hardenable with the lapse of time which exhibits a high initial tackiness and a high adhesive power with time. This adhesive composition contains a modified tacky silicone resin and a ...
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JP3348919B2 |
PURPOSE: To obtain an adhesive having excellent water-resistant adhesivity and heat-resistance and suitable as an adhesive for paper, woodworking, plastics, etc. CONSTITUTION: This adhesive is composed of (A) an aqueous emulsion obtained...
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JP3348920B2 |
PURPOSE: To obtain an emulsion composition having excellent waterresistant adhesivity, heat-resistance and compressive strength and suitable as an adhesive for woodworking or paper tube manufacture. CONSTITUTION: This emulsion compositio...
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JP2002309224A |
To provide an adhesive system for improving adhesion between rubber and a reinforcing material.An adhesive composition is obtained by reacting a carboxylic acid with a compound having one or more hydroxyl groups or one or more amino grou...
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JP2002533500A |
Hotmelt adhesive compositions based on crude polymeric fatty acids, optionally aliphatic and/or aromatic dicarboxylic acids and an amine component consisting of one or more aliphatic diamines with a number of carbon atoms equal to or gre...
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JP2002275434A |
To provide an inexpensive copper-cladding sheet with adhesive high in adhesivity to copper foil and suitable for use in flexible printed wiring boards.This sheet with adhesive is such that at least one side of an organic insulating sheet...
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JP2002531679A |
An adhesive powder for bonding flat, closed, or porous substrates, the adhesive powder being applied in the first step to a first substrate, an intermediate product that is non-adhesive at room temperature and stable in storage being pro...
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JP2002249754A |
To provide a resin composition for an adhesive having an excellent heat resistance, adhesion and forming property as the adhesive for bonding a thermotropic liquid crystal polymer layer with a polyolefin layer, and a laminated material o...
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JP2002526618A |
Condensation products comprised of carboxylic acid dianhydrides, diamines or polyamines, especially polyoxyalkylene amines and polyphenolene or aminophenolene are suited as structural constituents for epoxide resin compositions. In addit...
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JP2002226817A |
To obtain an adhesive composition having excellent adhesiveness to various kinds of plastic films, adhesiveness to metals such as copper, aluminum, stainless steel, etc., adhesiveness to glass, heat resistance, solvent resistance, etc.Th...
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JP3313331B2 |
To markedly lessen operation man-hours required for manufacturing a resin-sealed semiconductor device by a method wherein inner leads are bonded to a semiconductor chip through the intermediary of a specific coat layer, then the inner le...
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JP3313109B2 |
Described are moisture-setting polyamides containing reactive alkoxysilane groups. These polyamides have a low melt viscosity and can therefore be used, without plasticizers, as jointing compounds, fusion adhesives and/or sealing compoun...
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JP2002212535A |
To provide a tenacious hot-melt polyamide adhesive applicable in low-temperature coating and having high heatproof adhesivity, and a polyamide resin sheet-shaped molded product using the hot-melt polyamide adhesive.The hot-melt polyamide...
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JP2002212538A |
To provide an adhesive having improved initial adhesivity.The adhesive contains (A) 100 pts.wt. of an organic polymer of Si(R1)(OR2)2 (wherein, R1 and R2 are each a (substituted) 1-20C hydrocarbon; and they may be identical to each other...
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JP2002212874A |
To provide a method and an apparatus for forming screen-printing dye hot-melt adhesive film which can extremely save the coating cost, as the back face adhesion is inhibited and the quantity of the application is kept uniform, can add fl...
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JP3309980B2 |
PCT No. PCT/EP93/00145 Sec. 371 Date Jul. 29, 1994 Sec. 102(e) Date Jul. 29, 1994 PCT Filed Jan. 22, 1993 PCT Pub. No. WO93/15121 PCT Pub. Date Aug. 5, 1993.The invention relates to a process for the production of plastics containing ami...
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JP2002201403A |
To provide a preparing process for the subject composition to give an effective reverse-exudation preventing layer, which composition in spite of a less coating amount has the high adhesiveness, the good bond of top dots to the base laye...
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JP2002194282A |
To provide a polyamide resin-containing composition, particularly a composition suited in use for a varnish which is easy to remove a solvent on forming a film and can obtain a film and an adhesive bond with reduced residual solvent.The ...
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JP2002188786A |
To provide a nylon resin molding adhering joint capable of providing sufficient peeling strength when adhering the nylon resin molding with a solvent adhesive agent.This nylon resin molding adhering joint for adhering the nylon resin mol...
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JP2002518544A |
The present invention relates to polyamide compositions useful as hot melt-adhesives having a very long open assembly time. A typical composition of the present invention comprises the condensation product of substantially equimolar quan...
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JP3287566B2 |
Stable aqueous dispersions of finely divided piperazine-containing polyamide resin particles and methods for the manufacture thereof are provided. Dispersions according to this invention find use in hot melt adhesives, coatings, inks, an...
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JP2002138348A |
To provide a loom reed highly durable to alkali washing, thus capable of bearing alkali washing at a high temperature in a short time.This loom reed has such a structure that a plurality of dents 3 nipped by core metals 1 at both sides a...
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JP3280410B2 |
PURPOSE: To obtain the subject curable resin compsn. useful as a hot-melt adhesive by reacting thermoplastic polyamide and a specific amine-containing diluent in a specific ratio. CONSTITUTION: The objective polyamide resin compsn. is a ...
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JP2002129101A |
To provide a polyamide resin varnish which is easy to remove a solvent on forming films and can obtain films and adhesive layers reduced in the remaining solvent.The polyamide resin-containing varnish comprises (A) a phenolic hydroxyl gr...
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JP2002513327A |
(57) [Summary] A device for filtering liquids such as air, oil, and water, including a filter (13) that adheres to a structural support (16, 17) by means of aqueous dispersion of the polyamide resin (14, 15). Dispersion (14, 15) is appli...
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JP3278890B2 |
PURPOSE: To provide the subject composition containing a specific polyamide resin having lowered dielectric constant and a polymaleimide, having excellent heat-resistance and solvent resistance and low dielectric constant and useful as a...
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