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JPH11214604A |
To provide a lead frame with a radiating plate which is superior in adherence to a copper foil and a sealing material, and a semiconductor device using the lead frame which is satisfactory in electrical characteristics and solder resista...
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JP2928223B2 |
To prevent damage of a wafer or a chip caused by temperature and pressure during combination by forming a film of liquid adhesive on a peeling surface of a substrate and making the film non-viscous, removing a substrate from a film by co...
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JP2923499B2 |
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JP2920763B1 |
[wrap up] [Task] It provides an identification tag that can be securely fastened to the garment without damaging it and does not require staple attachment work and thus does not cause occupational diseases. A heat seal layer composed of ...
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JP2917240B2 |
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JP2916192B2 |
Polyamides suitable for use as hot melt adhesives, eg with polyepoxide resins can be prepared from 1. one or more polyoxyalkylene polyamines having an average molecular weight of 148 to 500, 2. a dimer acid having at least 36 carbon atom...
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JP2909203B2 |
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JPH11507089A |
A composition of matter comprises an aromatic cyanate ester silane comprising at least one cyanate ester group and at least one hydrolyzable silyl group. In the presence of a cyanate ester resin the aromatic cyanate ester silane acts as ...
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JPH11152456A |
To obtain a heat-adhesive sheet useful for automotive interiors and the like and improving the coating yield of adhesive powder without staining the periphery of a substrate with the adhesive powder by spraying the surface of the substra...
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JP2890408B2 |
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JPH11124558A |
To obtain a soln. adhesive which has a high liquid stability and can be cured in a short time by reacting an alcohol-soluble nylon resin with an epoxy compd. in a soln. to give a soln. of a partial reaction product having a specified vis...
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JP2889863B2 |
Polyamide-based compositions contains a sufficient amount of carbon black to be simultaneously anti-static and adherent on the binder adhering fluoro-polymers, especially PVDF, to polyamide. Also claimed are: (1) a process for the prepar...
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JPH11121013A |
To suitably use as a mobil power supply by including polyester amide at least in one of a positive electrode and a negative electrode as a binding agent and by setting swelling of the binding agent to a specific range. Swelling of a bind...
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JPH11115090A |
To realize the bonding of a marking film, which is equipped with a film main body, a PET film peelably provided on the top surface of the film main body and an adhesive bond provided on the under surface of the film main body and hot con...
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JPH11116905A |
To provide an end treatment method of an adhesive tape or sheet, wherein a sidestick at the end, generated by cutting an adhesive tape or sheet, is easily and securely prevented without any complicated process. An adhesive layer containi...
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JPH11106715A |
To obtain a sheet which can be unrolled smoothly from a rolled shape while printing heat transfer information on it and gives the resultant printing sheet which is easily stuck to a material-to-be-stuck-to by forming a releasing- layer-t...
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JPH11100553A |
To improve the flatness and the decrease in yield during the fine- processing process of an adhesive tape for TAB(tape automated bonding) by preventing the adhesive from adhering to an organic insulating tape. A roll of a tape with an ad...
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JP2882780B2 |
A lead-on-chip semiconductor device package is formed by attaching a lead frame having a single adhesive layer to a semiconductor chip. Electrode pads of the chip are electrically connected by bonding wires and mechanically connected by ...
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JPH1192733A |
To provide a hot-melt adhesive composition which can bond polyolefin resins to each other or particularly a polyolefin resin to various different materials at a low temperature. This composition consists of 5-60 wt.% polyamide resin (a),...
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JPH1180685A |
To provide a pressure-sensitive adhesive sheet for printing which, even when brought to a roll without a separator for covering a pressure-sensitive adhesive layer and loaded into a thermal printer after standing in a high-temp. atmosphe...
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JPH1180687A |
To obtain adhesive interlining which can improve glossy phenomenon and exhibits excellent appearances after adhered to a face fabric by overlaying to form, onto a non-adhesive resin layer on the surface of a base fabric, an adhesive resi...
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JPH1178268A |
To eliminate bulge-out of a sticky layer by providing a wider ink ribbon than a linerless printing adhesive tape on a surface to be printed of a printing base material, and giving thermal transfer information thereto via a thermal transf...
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JP2870832B2 |
A liquid or spreadable, vulcanisable rubber mixture based on a plurality of polymers, of which at least one is olefinically unsaturated, are prepared in such a manner that they can be cured by two different chemical reaction mechanisms w...
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JPH1159088A |
To provide a thermal transfer sheet in which the generation of blocking and curling is less. In a thermal transfer sheet in which a silicone layer 2 to be peeled off is formed on one side of a backing 1 sheet such as paper and a hot melt...
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JP2859884B2 |
An adhesive composition particularly useful for bonding a heat-recoverable polymeric sleeve around a cable splice to form a cable splice case comprises a polyamide and a copolymer of ethylene and an ester of an ethylenically unsaturated ...
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JP2858419B2 |
A method of environmentally protecting an elongate substrate with a cover and a sealing means comprising a sealing material having an elongation of at least 100 % and a compression set at 70 DEG C of less than 30 %, which comprises posit...
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JP2851888B2 |
An adhesive composite including a layer consisting of a compatibilized composition including at least one polyamide, and at least one propylene polymer which is at least partially modified by a polar monomer and which has a melt flow ind...
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JPH1120327A |
To obtain a printing sheet simply fixed to a material to be covered via an adhesive layer by separating printing sheets in a normal state without deformation, damage of the sheet or transferring lack of thermal transfer information while...
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JPH10335534A |
To improve the reliability of a copper clad laminated board, wherein a tape with a new bonding agent for wire bonding having excellent adhesive power and insulation reliability is used, a semiconductor connection substrate, a semiconduct...
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JP2838401B2 |
To realize a practical post-dyeing method for a shoe, by dyeing an adhesive with a specific composition by a metal-bearing dyestuff and an acidic dyestuff. Tape paste rubber 3 is applied to a rubber base 1 consisting of a general purpose...
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JP2838923B2 |
PURPOSE:To enhance the modulus of elasticity at high temp. and to engage and reinforce the joined part of a seal material by a method wherein a crosslinking promoter is added to and mixed with a polyamide type polymer and the resulting m...
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JPH10330480A |
To obtain a polyamide copolymer improved in processability, compatibility and elastomeric property and useful as an adhesive, etc., by using a specific diamine component and a specific aromatic dicarboxylic acid component. This polyamide...
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JPH10329259A |
To largely strengthen fixability of molding material to an insert, by interposing a film-like adhesive at a boundary between the insert previously set in a mold and the material to be cast therein by injection. A film-like adhesive 6 of ...
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JP2833768B2 |
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JPH10324849A |
To provide a semiconductor device which is excellent in the adhesion of an adhesive film with a semiconductor element and an inner lead and also is free from cracking of a sealing resin during reflow by soldering, by bonding a semiconduc...
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JPH10326801A |
To prevent the occurrence of cracks during solder flow by providing a particular area among the whole volume of a heat-resistant adhesive film between inner lead and semiconductor element. This semiconductor device has 80% or more of the...
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JPH10324802A |
To provide a heat-resistant adhesive film excellent in low-temperature adhesiveness and a semiconductor device using the same and showing excellent reflow crack resistance. There are provided a heat-resistant adhesive film wherein the ad...
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JP2831177B2 |
An epoxy-terminated polyamide having the following structure: +TR where each of R1, R2, and R3 is a divalent organic group, and each of n and m is a natural number, and an adhesive containing the above epoxy-terminated polyamide, an epox...
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JPH10298509A |
To obtain a tape for lead on chip(LOC) having good punching property and dimensional stability and capable of precisely processing by slitting a sheet providing an adhesive layer on both sides of a specific aromatic polyimide film compos...
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JPH10275834A |
To obtain an adhesive-backed tape which is superior in both adhesive properties and warpage preventing properties by a method, wherein a cured adhesive agent layer has a prescribed range of softening temperature and enables a reduction i...
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JP2807191B2 |
Cohesive flexible curable adhesive coatings formed from a dispersion of first and second powdered curing components, preferably reactive at ambient temperatures, in a solution of a binder, the binder content being not more than 15%, pref...
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JPH10264269A |
To firmly bond polyolefin to fiber by treating a resin layer constituting a conveyer belt with an adhesive agent composed of acid anhydride copolymer polyolefin, and fiber canvas with adhesive composed of polyamide resin. A resin layer 2...
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JPH10251608A |
To obtain an adhesive which enables repair work when thermally melted and has remarkably improved resistances to heat and moisture by compounding a polyolefin resin having a specified water absorption with a polyamide resin having a spec...
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JP2797936B2 |
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JPH10222073A |
To obtain a label which can be timely produced at anytime by imparting information with an ink by a heat transfer method or the like and which has scratching resistance and durability against repetition of cleaning at laundry, and to pro...
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JPH10212463A |
To obtain the subject product capable of simply and strongly bonding to a cloth to be bonded with an iron, etc., when used for hems of trousers, etc., and sufficiently retaining the flexibility of a bonded part by arranging many hot-melt...
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JPH10507783A |
The present invention is a novel remoistenable adhesive and an improvement in the bonding method for an envelope, a stamp, a sticker, a packaging tape or a label using a remoistenable adhesive, wherein the remoistenable adhesive is a hot...
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JPH10183082A |
To obtain a hot-melt adhesive compsn. which does not use conventional org. solvents and has a high adhesive strength by compounding a polyamide, a saponified ethylene-vinyl acetate copolymer, a polycarboxylic anhydride, and a plasticizer...
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JPH10183074A |
To obtain an adhesive film which is excellent in handleabililty without causing dusting or cracks and has good heat resistance and adhesiveness by compounding a high-mol.-wt. epoxy resin, a polyamide resin having a polyalkylene glycol re...
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JPH10183075A |
To obtain an adhesive film having good heat resistance, adhesiveness, flexibility, and flame retardance by compounding a halogenated high-mol.-wt. epoxy resin, a polyamide modified with a halogenated epoxy resin, a polyfunctional epoxy r...
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