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JPH10183076A |
To prepare an adhesive film which has a good adhesiveness and is excellent in handleability without causing dusting or cracks by compounding a high-mol.-wt. epoxy resin, a solvent-soluble polyamide resin, and a polyfunctional epoxy resin...
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JPH10183073A |
To obtain an adhesive film having good heat resistance, adhesiveness, chemical resistance, and flexibility by compounding a high-mol.-wt. epoxy resin, a modified polyamide, a polyfunctional epoxy resin, and curative. A high-mol.-wt. epox...
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JPH10178034A |
To improve workability, adhesive property, insulation reliability and durability by a method wherein one or more kinds of resin and thermosetting resin, having an amide group and/or an imide group, are contained as the essential componen...
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JPH10168204A |
To provide an adhesive film used as an adhesive in semiconductor packaging, having an excellent cuttability and forming no burrs or cuttings when cut and to provide a lead frame and a semiconductor device using the same. This invention p...
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JPH10158599A |
To obtain a semiconductor-bonding film to be used as an adhesive for a semiconductor package, excellent in cuttability and producing no burr when cut, and to provide a lead frame and semiconductor device using the same. This semiconducto...
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JP2758270B2 |
Hot melt adhesive masses are provided with a tackless surface by a process which comprises the steps of: a) extruding the hot melt adhesive through an appropriate die orifice; b) spraying the surface of the extruded adhesive with a molte...
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JPH10130400A |
To obtain an adhesive film improve in heat resistance while retaining its adhesivity and capable of sustaining its adhesivity even when it is subjected to long-term exposure at high temperatures, by using an adhesive composition containi...
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JPH10130595A |
To obtain a bundling material composed of a substrate film and an adhesive layer having a softening point lower than that of the substrate film, enabling easy bundling to give a compactly bundled product and useful for the bundling of el...
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JPH10125737A |
To industrially provide an adhesive tape for tab, tab tape and semiconductor device suited for raising the TCP mounting yield for sever dimensional stability requirements against the yield reduction due to the size change of the TAB tape...
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JP2750892B2 |
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JPH10120781A |
To enable to obtain the subject polymer excellent in polymer-binding stability, weather resistance and molecular characteristics and useful for fibers, etc., by adding a specific piperidine compound and a phenol compound as stabilizer co...
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JPH10107090A |
To improve bondability and insulation of a tape with a bonding agent for TAB by a method wherein a bonding agent layer is used as the tape with a bonding agent for TAB containing an epoxy resin having groups, which are shown in a specifi...
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JPH1095180A |
To enable the application of an adhesive consisting of a hot melt polyamide for bookbinding use requiring lay-flat properties by using the hot melt polyamide as a constituent and providing a film with a specific tensile strength and Youn...
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JPH1097076A |
To enhance the adhesive strength of a curable layer to a photosensitive layer in a photosensitive material without adversely affecting the material and image formation and to prevent peeling between the two layers by interposing an adhes...
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JP2731537B2 |
PURPOSE:To produce an org. polymer film having high electrical conductivity and improved adhesion to a substrate by selecting a solvent, controlling the oxidation potential of an oxidizing agent and subjecting an arom. compd. to chemical...
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JP2726279B2 |
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JPH1067972A |
To obtain an unsealing tape excellent in mechanical strength in the longitudinal direction, constant in dimensional change on heating, hardly causing shrinkage wrinkles and excellent in appearance by adhering a hot melt adhesive to a spe...
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JP2724601B2 |
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JP2715853B2 |
PURPOSE: To provide a composition containing a specified aromatic polyamide oligomer, a maleimide compound and an epoxy resin, excellent in adhesion, heat resistance and electric characteristics and useful, e.g. in the fields of electric...
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JP2715236B2 |
PURPOSE: To prevent the permeation of a resin into a padding and the clogging of a screen and improve the hand, dot shape, adhesion to a surface fabric, resistance to cleaning, etc., of the padding by compounding a water-sol. temp.- sens...
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JP2712057B2 |
PCT No. PCT/SE93/00541 Sec. 371 Date Jan. 6, 1995 Sec. 102(e) Date Jan. 6, 1995 PCT Filed Jun. 17, 1993 PCT Pub. No. WO94/01619 PCT Pub. Date Jan. 20, 1994The present invention provides a paper sizing composition which comprises a sizing...
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JP2702032B2 |
PURPOSE: To prepare the compositions excellent in flexibility and shock resistance and useful for hot-melt adhesives or the like by melting respectively specific polyamide resin, a diluent and epoxy resin in a specific ratio thereby lowe...
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JP2699465B2 |
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JPH09324161A |
To obtain the subject adhesive, comprising a specific polyamide and a specified modified ethylene vinyl acetate copolymer, excellent in durability in heat cycles, oil resistance, processability and adhesiveness and useful for producing a...
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JPH09321094A |
To obtain an object excellent in insulation property by making an adhesive layer contain alicyclic epoxy resin and polyamide resin as mandatory components. This tape is constituted of a laminate which has an adhesive layer 2 and a protec...
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JP2689994B2 |
Epoxy adhesives for bonding automotive parts, particularly those made of BMC of SMC, are improved by incorporating in the adhesive a Mannich Base having more than one primary or secondary amino groups.
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JPH09511772A |
PCT No. PCT/GB95/00731 Sec. 371 Date Jan. 9, 1997 Sec. 102(e) Date Jan. 9, 1997 PCT Filed Mar. 30, 1995 PCT Pub. No. WO95/27764 PCT Pub. Date Oct. 19, 1995Two-component curable adhesive for blocking automotive wiring bundles, the respect...
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JPH09289232A |
To obtain a product superior in adhesion, chemicals resistance and insulation by using an adhesive layer contg. an org. coupling agent. A tape with adhesive for TAB is composed of a laminate of an adhesive layer 2 and protective film lay...
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JPH09509978A |
The disclosed hot-melt-type adhesive is characterised in that the amine value of the polyamide is higher than its acid number and in that it contains a carbonate as filler. Chalk with grains of 0.05 to 50 mu m size is preferably used as ...
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JPH09237809A |
To improve the adhesion property and insulation reliability by stacking an adhesive layer and protective film layer on an org. flexible insulative film; the adhesive layer contg. a polyamide resin and at least one heterocyclic aromatic c...
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JPH09237808A |
To improve the adhesion property and insulation reliability by stacking an adhesive layer and protective film layer on an org. flexible insulative film; the adhesive layer contg. a polyamide resin and at least one cross linked poly mer g...
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JPH09507875A |
Disclosed is a water-dissipatable or dispersible adhesive composition that is useful in forming paper articles and other products that can be recycled through repulping in both neutral and alkaline media. The water-dispersible adhesive c...
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JPH09194815A |
To provide a polyamide adhesion improver to firmly joint a thermoplastically processable fluoropolymer, esp. that based on TFE, HFP, and VDF, and polyamides, and also provide a multi-layer composite, esp. a multi-layer pipe, using the ma...
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JPH09165568A |
To obtain an adhesive having characteristics of both surely bonding an element to be mounted to a circuit board, electrically connecting the element and readily removing the bonded element from the board. This adhesive is obtained by mix...
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JP2605156B2 |
An adhesive composition comprising a polymer, a tackifier, and a plasticizing amount in the range of 5-40% by weight, 1,4-cyclohexane dimethanol dibenzoate.
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JPH09503019A |
Disclosed are degradable materials including molded products, laminates, foams, pellets, nonwoven materials, adhesives, coatings and films, and particularly packaging films. The materials are made using polydioxaneone polymers comprising...
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JPH0978035A |
To obtain a nylon-based repairing agent long in pot-life, coatable with a brush or roll, developing no cracks or debonding, thus useful for repairing cracks of concrete or ordinary plasters, by mixing a nylon-based copolymer solution wit...
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JPH0959573A |
To obtain a new type tape for tape automated bonding(TAB) excellent in both adhesiveness and electrical insulation properties. This tape is obtained by laminating a flexible electrical insulation organic film with an adhesive layer and a...
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JP2561608B2 |
PURPOSE: To obtain the subject resin of good hue, excellent in pot life as a virtually primary amino group-free cationic electrodeposition coating or moisture-curable coating, by ketimination of a specific polyamide resin with a specific...
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JPH08305240A |
PURPOSE: To manufacture a cleaning blade excellent in economy and high in bonding strength for use in an electrophotographic device by melting and applying a hot-melt adhesive having a specific melt viscosity to a support member, bringin...
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JP2544640B2 |
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JP2542752B2 |
Alkyl- or aryl-terminated polyamide compositions and polyamide rheological additives that function as a sag/slump control agent and provide superior shear-thinning and viscosity recovery properties in systems that react with or are sensi...
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JPH08259906A |
To obtain a plane-formed body, esp. a interlining material for clothing, having a high adhesion stability and an excellent resistance to washing and cleaning by using a melt-adhesive material comprising a thermoplastic melt adhesive and ...
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JPH08259905A |
To obtain a plane formed body exhibiting a high adhesion stability and an excellent resistance to washing and cleaning even at a reduced coating wt. by using a melt-adhesive material comprising a thermoplastic adhesive and an epoxide and...
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JP2533841B2 |
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JPH08218055A |
PURPOSE: To obtain a decorative sheet capable of preventing curl and paper breakage, capable of being strongly and uniformly adhered to particle boards, and having high adhesive forces even under high temperatures by forming a heat-sensi...
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JPH08209097A |
PURPOSE: To obtain a reactive hot-melt adhesive composition composed of an epoxy-modified block copolymer and a polyamide resin and having excellent initial adhesive force, heat-resistant adhesive force, etc. CONSTITUTION: This reactive ...
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JPH08199127A |
PURPOSE: To prepare an adhesive tape for knotting a flat cable obtained by parallel arranging many cables obtained by insulating and coating electric wires with polyvinyl chloride, etc., side by side. CONSTITUTION: This tape is prepared ...
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JPH08188753A |
PURPOSE: To obtain the subject sheet easy to correct its application site owing to its initial adhesive force, and presenting high adhesive force after bonded, by providing one side of a colored synthetic resin film with a heat-sensitive...
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JPH08181174A |
PURPOSE: To obtain a tape for TAB excellent in adhesion and resistance to chemicals, by making an adhesive agent layer contain xylene resin and polyamide resin as inevitable components which layer forms a laminate together with a protect...
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