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JP2002114956A |
To provide a puncture-preventing agent, which can prevent a puncture hole at the moment of puncture and maintain an air pressure of a tire over a long period of time, to over come the problem that conventional puncture- preventing agents...
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JP2002103856A |
To provide a pseudo-adhesive sheet in which when an information communication body is manufactured, a required pseudo-adhesion can be obtained without generating inferiority of adhesion and blocking even when a processing condition is no...
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JP2002100695A |
To provide an adhesive sheet for a semiconductor device, which is new and has excellent adhesion, wire bonding properties and blanking characteristic, and to provide a semiconductor device using it.An adhesive sheet for a semiconductor d...
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JP2002096950A |
To neatly cut edges.The fixed label for a flying splice has an adhesive front surface, a non-adhesive back surface and two long sides. The label has backing paper covered on one side of its front surface with an adhesive composition, and...
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JP2002080814A |
To overcome the lack of toughness in the adhesive property caused by the large difference between the yield value and the lower yield value appearing after the yield value, which is a severe disadvantage of a polyamide resin showing an e...
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JP3264379B2 |
PURPOSE: To provide a strong ordinary temperature adhesiveness relative to a wide variety of substances capable of being glued at a low temperature and low adhesive forces as low as possible by press bonding forces by the use of a multi-...
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JP2002064126A |
To provide a tape with a bonding agent for a semiconductor device, which has an excellently high bondability and an excellently low warpage property, and to provide a semiconductor substrate for connection using that tape and a semicondu...
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JP2002060718A |
To provide a method for coating a nonconductive molded part, capable of solving problems caused by conventional methods where a polyurethane dispersion, a moisture-curing polyurethane or a copolyamide hot-melt adhesive comprising coarse ...
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JP3259182B2 |
PURPOSE: To obtain a new thermoplastic polyamide and a polyesteramide based on a distillation residue containing trimer or higher fatty acids in a high proportion. CONSTITUTION: The polyamide and the polyesteramide contain (A) 20 to 60 e...
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JP2002504177A |
The invention provides a monolayered thermoplastic hot-melt adhesive film without a separating layer which can be rolled up and unrolled without the additional use of a separating layer and in which the polymer matrix of copolyamides and...
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JP2002033354A |
To provide a new TAB tape which is superior in adhesion, wire- bonding characteristics, and punching-out characteristics, together with a semiconductor device using it.An adhesive sheet for a semiconductor device is provided which compri...
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JP2002028550A |
To provide an extrusion apparatus for a hot melt adhesive capable of enhancing workability, keeping the cost and reducing the quantity of waste by smoothly applying the hot melt adhesive always heated to a proper temperature even if the ...
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JP3251695B2 |
PURPOSE: To provide a fusible interlining which has high bonding strength and improved aging resistance and steam does not break through and to provide a fusible drapery including the fusible interlining. CONSTITUTION: This fusible inter...
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JP3249983B2 |
PURPOSE: To provide an adhesive which has good initial pressure-sensitive adhesiveness and cohesive strength and which, after being cured, exhibits high bonding strength and cohesive strength and has good water resistance, heat resistanc...
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JP2002020721A |
To provide an adhesive for semiconductor packages, used for bonding integrated circuit chips to lead frames or other substrates, capable of meeting all the requirements, such as adhesive strength and flexibility, making it possible to be...
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JP3248007B2 |
PURPOSE: To obtain a film excellent in heat resistance by reacting a hydrolyzable organosilicon compd. having an isocyanate group with a polyamide film in a solvent which swells the polyamide film. CONSTITUTION: A moisture-curable reacti...
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JP2002012844A |
To provide an adhesive composition for laminate not containing a compound with the fear of having hormone-disrupting activities.This adhesive composition for the laminate is obtained by using a polymer having 10-90 wt.% constituent compo...
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JP2002003601A |
To provide a polyesteramide copolymer and an adhesive composition for laminate using it which is useful for adhesion of polyester film for laminate serviceable for metal cans such as beverage cans and is free of compounds suspected of en...
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JP2001527594A |
A process is provided for preparing a dispersion of a polyamide in water, said process comprising: forming a solution of a polyamide having an acid value of greater than about 2 in an organic solvent to form a solution of said polyamide ...
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JP2001527596A |
A process is provided for preparing a dispersion of a polyamide in water, said process comprising: dissolving a polyamide having an amine value of greater than about 2 in an organic solvent to form a solution of said polyamide in said so...
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JP2001354938A |
To obtain an adhesive composition for semiconductors, which, while retaining excellent insulation properties, can achieve excellent adhesiveness, warpage prevention, and temperature cycle endurance, and to prepare an adhesive sheet and t...
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JP3231814B2 |
PURPOSE: To provide an anisotropic conductive film forming composition having very rapid hardness, and excellent in heat resistance, moisture resistance, preservative stability, repairableness, and a surface stickiness; and an anisotropi...
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JP2001323248A |
To obtain a moisture-curing adhesive composition causing little shift of a board, or the like, bonded to a wall with the adhesive.This moisture-curing adhesive composition is produced by compounding a moisture-curing liquid adhesive with...
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JP2001323232A |
To obtain a hot-melt adhesive suitable for adhesion of various kinds of plastics in a wide range and metals, comprising a saponified ethylene/vinyl acetate copolymer, a dimer acid polyamide, having improved water resistance at a normal t...
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JP2001323060A |
To provide a polyamide copolymer usable for producing mono- and multifilament, fiber, sheets and nets.This polyamide copolymer comprises a condensation polymer made from 10-45 mol% caprolactam, 30-55 mol% laurolactam, 20-50 mol% at least...
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JP3229945B2 |
PURPOSE: To obtain an acid-modified polyolefin resin composition modified with an unsaturated carboxylic acid, having good adhesion to polyolefin resins or polyamide resins. CONSTITUTION: An acid-modified polyolefin resin is melt-blended...
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JP3229946B2 |
PURPOSE: To provide a packing film (wrapping film) excellent in cutting properties, transparency, heat resistance, interlaminar adhesion, steam barrier properties, heat non-shrinkability, food safety and productivity. CONSTITUTION: A pac...
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JP3223378B2 |
PURPOSE: To provide the subject composition excellent in workability and quick laminating suitability, useful for water-resistant corrugated fiberboards, etc., comprising starch and a specific one-pack water resistance-imparting agent at...
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JP2001518544A |
(57) [Summary] Provided is a polyamide composition for welding having excellent weldability, heat resistance and hydrolysis resistance. The polyamide composition for welding contains (A) an aromatic polyamide in which the molar content o...
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JP2001288428A |
To provide a tape for hemming which is caused to strongly adhere to outer garments such as slacks, skirts and the like. A coating layer 2 is formed on one surface of a tape main body 1 consisting of a woven structure using tricot yarn an...
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JP2001288432A |
To provide a hemming tape which is suitable for hemming the bottom of an elastic outer wear such as slacks and a skirt. The tape comprises a low melting point of a hot melt type adhesive agent 2 coated in a mesh pattern on the one surfac...
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JP2001279220A |
To obtain a cold-seal adhesive relieving at least one of problems of conventional cold-seal adhesive containing a natural rubber resin and further exhibiting excellent antiblocking property, cold-seal adhesivity and printability. The adh...
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JP2001271052A |
To provide an adhesive for fiber having excellent adhesivity and durability against various fiber materials. An adhesive composition for fiber comprising a main component of a thermoplastic polyamide urea which is composed of a polyamide...
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JP2001262085A |
To provide an induction heating adhesive sheet adapted so that a bonding method using high-frequency induction heating may be applicable also to an adherend otherwise difficultly submissive to high-frequency induction heating.An inductio...
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JP2001250848A |
To provide a tape with an adhesive for a semiconductor device having excellent laminate and bonding characteristics, a copper-clad laminate using the tape, a substrate for semiconductor connection, and a semiconductor device.In this tape...
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JP2001514308A |
The present invention relates to a fast setting water sensitive polyamide composition which is the reaction product of at least one reactant which is a dicarboxylic acid, ester or anhydride thereof and at least one reactant is a diamine ...
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JP2001513719A |
The present invention relates to a multilayer structure comprising a material covered with a copolymer having polyamide blocks and hydrophilic blocks where the copolymer has a melting point of less than 135° C.
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JP2001513115A |
(57) [Summary] Contains acid-terminated high molecular weight polyamide resins, epoxies, high molecular weight polyester components and thermosets with silane and aziridine hardeners to form extremely high temperature resistant, flexible...
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JP2001220509A |
To provide a good adhesive property to a substrate such as a metal or a plastic by heating a t a relatively low temperature and for a short time.The hardening composition comprises (A) a fluorine-containing amide compound, (B) a fluorine...
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JP2001214146A |
To obtain an adhesive interlining fabric showing a greatly improved initial bond strength, resistance to washing and stream resistance using a hot- melt adhesive aqueous dispersion.This adhesive interlining fabric is obtained by coating ...
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JP2001207144A |
To obtain a hot-melt adhesive composition excellent in light resistance and adhesive performance without the need of any shield packaging or the like for protecting adhesive-coated adherends from sunlight exposure. This hot-melt adhesive...
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JP2001192638A |
To provide a polyamide hot-melt adhesive that has excellent viscosity stability and high skinning resistance and provide a hot-melt adhesive for book binding that can manifest excellent performance, for example, printing ink resistance, ...
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JP3186822B2 |
PURPOSE: To provide poly(etheresteramide) suitable for a hot melt adhesive for a fabric excellent in adhesiveness at a low bonding temp. and handling properties. CONSTITUTION: 60-80 wt.% of a polyamide forming monomer mixture (A) consist...
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JP3176061B2 |
PCT No. PCT/GB91/00175 Sec. 371 Date Aug. 6, 1992 Sec. 102(e) Date Aug. 6, 1992 PCT Filed Feb. 6, 1991 PCT Pub. No. WO91/12638 PCT Pub. Date Aug. 22, 1991.An assembly for forming a semi-permanent electrical connection between a pair of w...
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JP2001150883A |
To provide a transfer sheet having extremely high fastness of a toner pattern when the toner pattern is transferred onto a body to be transferred.A transfer sheet is formed of a base sheet on which a release layer, a toner layer, a ureth...
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JP2001139911A |
To obtain a new-type hot-melt adhesive composition having high adhesivity to polyolefins as well as high heat-resistance. The objective adhesive composition contains (1) a polyolefin- based hot-melt adhesive containing a thermoplastic po...
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JP2001135152A |
To provide a thermally fusible wire having an adhesive layer to which a high-polarity polyvinyl chloride or low-polarity polyolefin or others can be adhered, independently of high or low polarity. The thermally fusible wire 1 has an adhe...
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JP2001131524A |
To obtain at reduced cost a polyesteramide-based adhesive sheet capable of improving bonding operability involved therein and excellent in adhesivity and heat resistance. This adhesive sheet is obtained by providing one side or both side...
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JP2001123132A |
To obtain an epoxy resin composition adhesive sheet since a conventional used epoxy resin has a problem that it is difficult for the epoxy resin to make a sheetlike material in a semicured state, its film is brittle and inferior in self-...
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JP2001098249A |
To provide a low-emission water-soluble adhesive which, while having excellent adhesive properties, has a biodegradability and has no problem with toxicity. An adhesive mixture of the invention is based on polyaspartic acid or its salt a...
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