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JP4409024B2 |
To provide an adhesive applied conductor-polyimide laminated sheet susceptible to heat and pressure bonding even after receiving heat history up to 270 deg.C and excellent in the adhesion with a silicon chip or wiring board conductor and...
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JP4404576B2 |
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JP4400609B2 |
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JP2010006929A |
To provide an adhesive composition excellent in not only adhesiveness but embedding performance and heat resistance, and to provide an adhesive sheet and a dicing die attach film using the above adhesive composition.The adhesive composit...
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JP2010500419A |
In one aspect, the invention provides a method of applying an adhesive to a paper substrate, the method comprising applying a liquid, water-soluble adhesive composition to the paper substrate, said liquid, water-soluble adhesive composit...
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JP2010001387A |
To provide an epoxy adhesive resin composition nearly free from reduction of an elastic modulus during high temperature and having excellent elasticity and electric insulation properties.The epoxy adhesive resin composition includes a ba...
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JP4395350B2 |
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JP2009302426A |
To provide a manufacturing method for a circuit board, using an adhesive layer formed so as to cover the periphery of a patterned conductor, and heating and pressing the adhesive layer onto the board formed with a separately manufactured...
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JP4389503B2 |
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JPWO2008015759A1 |
An object of the present invention is to provide a film-like adhesive capable of achieving both process characteristics and reflow resistance. The film-like adhesive of the present invention is a film-like adhesive used for adhering a se...
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JP4387518B2 |
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JP2009286996A |
To provide an adhesive film and an adhesive sheet capable of adhering to a member such as a semiconductor wafer at low temperature and causing no bubble between a support member and the adhesive film when the adhesive film is stuck to th...
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JP2009286868A |
To provide a polyimide having excellent solubility in an organic solvent and thermoplasticity, and also having high adhesive force to a copper foil and a non-thermoplastic polyimide film, a high glass transition temperature and high toug...
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JP4380115B2 |
To obtain a heat resistant adhesive having sufficient adhesive strength even when laminated with metal foil at a low temperature below 200 deg.C and good reflow soldering properties in a moisturized state, a heat resistant laminate film ...
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JP4378577B2 |
To obtain a resin composition excellent in adhesiveness and heat resistance by including a siloxane-modified polyamide imide resin with a rubbery elastomer, and a thermosetting resin. This composition contains 100 pts.wt. (A) siloxane-mo...
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JPWO2008004615A1 |
Provided are a polyimide resin having good solvent solubility and heat resistance, low water absorption, and excellent adhesiveness, a method for producing the same, a film containing the polyimide resin, and a metal-clad laminate contai...
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JP4369898B2 |
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JP4372065B2 |
A solvent-free polyimide silicone resin composition comprising (a) a polyimide silicone resin having repeating units represented by the following formula (1-1) and repeating units represented by the following formula (1-2), a film of sai...
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JP4371234B2 |
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JP4367404B2 |
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JP2009538959A |
The invention relates to an adhesive system comprising a protein and one or more polymers containing primary, secondary, or tertiary amino groups, or pendant amide groups. It also relates to a method of producing a laminated wood based p...
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JP2009260232A |
To provide a film-like adhesive for sealing a semiconductor that is fully superb in working efficiency when used for sealing a semiconductor apparatus, fully suppresses the occurrence of a void even by heating to not less than 300C, and ...
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JP4359242B2 |
The present invention is to provide an adhesive resin composition for use in preparing an adhesive in the form of a film which is excellent in the adhesiveness at a low temperature and in the heat resistance, an adhesive in the form of a...
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JP4347941B2 |
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JP4341813B2 |
To provide an adhesive applied optical member with an adhesive layer stacked on at least one surface of an optical member, wherein the adhesion of the adhesive layer to the optical member is good even after long-term storage under severe...
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JP2009229507A |
To provide a durable sealing film of stable quality, enhancing easily a light taking-out efficiency at low cost.This sealing film comprises an optical film the glass transition temperature of which is 60C or more, and an adhesive film th...
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JP4337038B2 |
To obtain a polyelectrolyte membrane which can be formed by a simple membrane forming process, which exhibits high ionic conduction characteristics while suppressing the membrane swelling under a high temperature and high humidity, and w...
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JP4325008B2 |
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JP4314554B2 |
To provide an adhesive sheet which acts as a dicing tape in a dicing step and exhibits excellent bonding reliability in the step of bonding a semiconductor element to a supporting member. The adhesive sheet is a thermally polymerizable a...
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JP2009172996A |
To provide a high flexible copper clad laminate having a resistance increasing rate of not higher than 10% at 300,000 times of bending, and its manufacturing method.The flexible copper clad laminate is comprised of a polyimide type resin...
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JPWO2007108284A1 |
Provided is an adhesive film that has slipperiness and can be used satisfactorily as an FPC substrate even when a dense circuit pattern is created. An adhesive film in which a thermoplastic polyimide layer is provided on both sides of a ...
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JP2009527631A |
The present invention relates to a polyphosphate-containing halogen-free adhesive, primarily used as an adhesive. The composition comprising the polyphosphate group compounds which effectively meets the needs for environmental protection...
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JP4303623B2 |
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JP2009155407A |
To provide a curable resin composition of enhanced water-proofness, of utilizing a reaction of a five-membered ring carbonate group with an amino group.This curable resin composition comprises a compound A having the five-membered ring c...
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JP2009155354A |
To provide a resin composition suitable for forming an insulating layer of a multilayered printed wiring board or the like, excellent in heat resistance, mechanical strength and laminating performance, and having low thermal expansion co...
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JP2009141008A |
To make a semiconductor device thinner and to decrease the number of processes of manufacturing the semiconductor device.A method is provided for manufacturing the semiconductor device having a semiconductor element 8a and a support memb...
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JP4284922B2 |
To prepare an adhesive sheet acting as a dicing tape in a dicing process, and excellent in the reliability of joining in a joining process of a semiconductor element with a support member. The adhesive sheet is equipped with an adhesive ...
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JP2009132830A |
To provide an adhesive composition causing no migration to a viscous layer and excellently following a minute pattern on a substrate to produce a cured product having no void.The adhesive composition is used for constructing an adhesive ...
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JP2009132929A |
To provide a resin primer which can adhere sufficiently strongly an insulator layer and an electroconductor foil with relatively small coarseness, and to provide an electroconductor foil with a resin, a laminated plate and a method for p...
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JP4277614B2 |
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JP4272471B2 |
To provide a film-shaped adhesive excellent in heat resistance, capable of keeping adhesiveness and an embedding property to uneven surface of a base material even when wire bond time is long and not causing release in reflow by moisture...
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JP4272401B2 |
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JP4272468B2 |
To provide a safe and stable production process of a polyimide resin having a silicone backbone structure with a high molecular weight, and also to provide a polyimide resin obtained by the same. The production process of a polyimide res...
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JP2009114307A |
To provide a thermosetting adhesive composition for ceramics substrates having excellent adhesiveness to the ceramics substrates while ensuring sufficient heat resistance, and to provide an adhesive film using the composition.The thermos...
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JP2009114295A |
To provide an adhesive composition affording a cured product having heat-resistant stress properties and low water absorbency.The adhesive composition includes (A) at least one resin and (D) a catalytic amount of an epoxy resin curing ca...
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JP4266980B2 |
There are provided an adhesive sheet, exhibiting a specific peel strength and shear peel strength and being composed of a base material (A) comprising a fully aromatic polyimide film having a glass transition temperature of 200 DEG C or ...
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JP4258589B2 |
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JP2009084563A |
To provide an adhesive composition that can give excellent reliability to semiconductor devices by keeping the hot fluidity enough to retain the filling properties (potting) to adherends, process characteristics demanded on the productio...
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JP2009084463A |
To provide an adhesive exhibiting excellent adhesiveness to a metal, and allowing large variety of operation after being coated, while having excellent initial adhesive force.The bonding is carried out by coating the first liquid contain...
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JP2009086058A |
To provide a photoelectric composite substrate which has high adhesion between a polyimide film with metal wiring formed thereon and an optical waveguide.This photoelectric composite substrate 1 contains a film-like optical waveguide 4 c...
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