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JP2010238852A |
To provide a tape for manufacturing a semiconductor, which has excellent balance between low-temperature adhesion and solubility into an alkaline solvent, and to provide a method for manufacturing a semiconductor device.The tape 1 for ma...
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JP2010229274A |
To provide a resin composition having low thermal expansion, high heat resistance, low-temperature melting property and flexibility in a film state, and to provide an adhesive for electronic parts.The resin composition contains at least ...
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JP4562821B2 |
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JP2010222507A |
To provide a conductive copolymer containing a conductive polyaniline for achieving adhesivity with various materials to be bonded, heat resistance, moisture heat resistance and transparency and excellent conductivity, and to provide a p...
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JP4557303B2 |
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JP4557515B2 |
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JP4547988B2 |
To obtain a resin composition having sufficient low stress properties even in use for application of large-area adhesion and exhibiting excellent adhesiveness, and to provide a semiconductor apparatus having excellent reliability by usin...
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JP4549007B2 |
To provide a composition useful as a polymer electrolyte film capable of maintaining its ion-conductive characteristics at a high temperature for a long period by incorporating only a small amount of an acidic compound to a polybenzimida...
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JP4551094B2 |
To provide an adhesive film for use in a flexible metal-clad laminate with dimensional stability suppressed when manufactured by a lamination method, the flexible metal-clad laminate obtained by sticking metal foil on the film, and a met...
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JP4543456B2 |
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JP2010195887A |
To provide a non-halogen-based adhesive composition excellent in adhesiveness, solder heat resistance, flame retardancy as well as flow characteristics, and to provide a laminate and a flexible printed wiring board using the composition....
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JP4540875B2 |
A curable and carbonaceous cement paste composition comprises catalyst, carbon filler, a polymerizable monomeric system (a) and a furan derivative solvent (b). (a) comprises a dialkyl ester of an aromatic tetracarboxylic acid or an aroma...
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JP4540964B2 |
The present invention relates to a polyimide adhesive composition having a polyimide derived from an aromatic dianhydride and a diamine component, where the diamine component is preferably about 50 to 90 mole % of an aliphatic diamine an...
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JP4534410B2 |
To prepare an adhesive film having low stress and low-temperature adhesiveness not only used for 42 alloy lead frames as a die bond for semiconductor elements, but also usable for copper lead frames and further usable for insulating supp...
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JP4534418B2 |
To provide an adhesive film for die bonding exhibiting good adhesive force under heat, high reflow resistance, high reliability and also low-temperature sticking property, and a semiconductor device obtained using the same. The adhesive ...
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JP4530126B2 |
To provide an adhesive composition comprising (A) a polyimide resin having a phenolic hydroxy group in a polymer skeleton and an organopolysiloxane bond having a phenyl group as an organic substituent in the main chain, (B) an epoxy comp...
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JP4530125B2 |
To provide an adhesive composition; to provide an adhesive film obtained by using the composition, having low modulus, excellent adhesiveness and excellent heat resistance, and suitably usable for production of various kinds of electroni...
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JP4528093B2 |
The present invention relates to a multi-layer laminate having a low glass transition temperature polyimide layer, a high glass transition temperature polyimide layer, and a conductive layer. The low glass transition temperature poly...
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JP4527687B2 |
The present invention provides a polyimide resin, which is prepared by epolycondensing a dianhydride monomer including at least a dianhydride represented by formula (I) wherein R is O or O(CH2)nO, n is an integer of 1 to 2 and a diamine ...
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JP4522604B2 |
As an anisotropic conductive film capable of firmly adhering to an electronic component and a circuit board and achieving good electrical continuity by thermal compression bonding at a low temperature at which the circuit board is not de...
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JP4520416B2 |
The present invention relates to thin adhesive composite films formed from fluoropolymers imbibed with adhesives and containing a filler at least within the infra-structure of the polymer to provide the film with a high dielectric consta...
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JPWO2008133293A1 |
The base material 3 and the adhesive resin layer 4 formed on one surface of the base material 3 are provided, and the adhesive resin layer 4 has a glass transition temperature of 170 to 200 ° C. and is after curing. An adhesive sheet, w...
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JPWO2008126717A1 |
Provided is an adhesive film for a semiconductor, which can be attached to a semiconductor wafer at a low temperature and enables a semiconductor chip to be obtained from the semiconductor wafer at a high yield while sufficiently suppres...
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JP4509032B2 |
It is an object of the present invention to provide an adhesive film which is used for producing, by a laminating method, a flexible metal-clad laminate in which the change in dimensions is suppressed, a flexible metal-clad laminate incl...
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JP2010155975A |
To provide an adhesive composition having heat resistance, low-temperature adhesiveness, and insulation reliability at the same time, in particular, an adhesive composition useful for a printed circuit board, a sheet of the adhesive comp...
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JP4500569B2 |
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JP4504087B2 |
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JP4491852B2 |
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JP4486333B2 |
To provide an adhesive film for use in obtaining a flexible metal clad laminated sheet excellent in hygroscopic solder resistance, and the flexible metal clad laminated sheet obtained by laminating a metal foil to the adhesive film. The ...
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JP4474841B2 |
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JP4470099B2 |
To provide a compound having excellent processability by solubility in organic solvents compatible with high proton conductive characteristics in an acidic group-containing polybenzimidazole compound expectable as a polyelectrolyte membr...
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JP4471334B2 |
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JP4467662B2 |
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JPWO2008096441A1 |
Provided is a cured product having excellent mechanical properties such as heat resistance, elastic modulus, and tensile strength by lowering the curing temperature of a resin composition containing a compound having a phenylethynyl grou...
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JP2010513087A |
The present invention relates to a method of producing a wood based product comprising applying a water-based adhesive composition comprising non-gelatinised starch, the composition further comprises from 0.1 to 50 weight % of one or mor...
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JP4445274B2 |
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JP4441833B2 |
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JP4435919B2 |
To provide an adhesive composition having high adhesive strength to an adherend and also excellent in preservation stability and resistance of adhesive strength to moist heat. This adhesive composition comprises both of polycarbodiimide ...
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JP2010059387A |
To provide an adhesive composition highly satisfying low-temperature adhesiveness, thermal fluidity in the B stage, and reflow resistance.The adhesive composition, which is used for bonding a semiconductor element to an adherend, compris...
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JP2010508424A |
The adhesion between a low surface energy (i.e., nonpolar) material, e.g., a polyolefin such as polyethylene, and a high surface energy (i.e., polar) material, e.g., a polyester, polyurethane, polycarbonate or polylactic acid, is promote...
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JP4432316B2 |
To provide an adhesive tape simplifying a pasting process until a dicing process, not only improving working property but also solving a problem such as the bending of wafer which becomes to have a larger diameter and thinner film thickn...
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JP4433693B2 |
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JP4433689B2 |
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JP2010507688A |
The invention relates to and their preparation and the production of Silicon-Isocyanates from Silicon-Urea-Azolides.
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JP4426089B2 |
The adhesive composition (34) in accordance with the invention for the hot bonding of substrates (32, 33), polymers or metals, comprises at least one polymer material, at least one plasticiser and wetting agent, and, possibly, at least o...
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JP4423694B2 |
To provide an adhesive for cover lay films capable of being laminated at relatively low temperatures with a flexible printed circuit board (FPC) formed with a circuit pattern and having adhesive power, heat resistance and solvent resista...
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JP2010045382A |
To provide a thick film bonding member ensuring proper stress relaxation and a package height, in a BGA structure, and to provide a bonding member ensuring proper chip lamination properties and proper wire bondability in an stacked CSP.T...
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JP4421422B2 |
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JP2010037489A |
To provide an adhesive film having excellent crack resistance and breakage resistance, and performances required for uses such as the multilayer wiring boards, and to provide a metal foil with a resin.The adhesive film comprises: (a) a p...
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JP4418084B2 |
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