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WO/2023/046812A1 |
The invention relates to an adhesion-promoter formulation for forming a polyurethane-based adhesion-promoter film, wherein the formulation comprises as components: 20 to 30 mass percent of an aromatic isocyanate; 10 to 20 mass percent of...
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WO/2023/040386A1 |
Disclosed are a rework adhesive tape and a peeling method therefor. The rework adhesive tape comprises a base material layer, and a first rework adhesive layer and a second rework adhesive layer attached to two opposite sides of the base...
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WO/2023/031484A1 |
The invention is directed to a method for bonding of a sealing element (1) to a substrate (6) using a cementitious adhesive composition comprising at least one synthetic organic polymer and at least one hydraulic binder. The invention al...
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WO/2023/032690A1 |
Provided are: a two-component curable adhesive exhibiting excellent adhesion to a metal foil or a metal deposition layer; and a laminate and a packaging material that are obtained by using said adhesive. The present invention provides ...
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WO/2023/023082A1 |
This invention relates to cyanoacrylate-containing compositions, which when cured provide improved bonding performance on aluminum substrates.
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WO/2023/017831A1 |
The present invention relates to a method for expanding a pressure-sensitive adhesive sheet which comprises a substrate and a pressure-sensitive adhesive layer, wherein at least one layer included in the pressure-sensitive adhesive sheet...
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WO/2023/017832A1 |
The present invention relates to a method for manufacturing a semiconductor device using an adhesive sheet for semiconductor processing having a base material, an intermediate layer, and an adhesive layer in that order, one or more layer...
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WO/2023/016701A1 |
The invention relates to a projection exposure system (1, 101) for semiconductor lithography, comprising two materially bonded components (31, 32); wherein the material bond is produced by an adhesive layer (35); wherein the adhesive lay...
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WO/2023/018457A1 |
A two-part epoxy and delivery system having at least one tube containing one component of a two-part epoxy, the tube having an enlarged opening for dispensing strengthening fibers through the enlarged opening mixed with the one component...
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WO/2023/013387A1 |
A composition for bonding that comprises component (A), which is a first polymerizable monomer, component (B), which is a rubber component, component (C), which is a polymer component having a first reactive functional group, and compone...
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WO/2023/013651A1 |
A bonding method for bonding an adherend (120) with an adhesive (11) for high-frequency dielectric heating, the bonding method comprising a placement step in which the electrodes of a dielectric heater (50), the adherend (120), and a spa...
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WO/2023/008747A1 |
The present invention relates to an adhesive sheet and, more specifically, to an adhesive sheet comprising a substrate film having a predetermined range of water contact angle and an adhesive layer disposed on the substrate film. The pre...
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WO/2023/008204A1 |
This layered body manufacturing method includes: a step in which a first adhesive coating layer is formed on a surface of a support substrate; a step in which a second adhesive coating layer is formed on a surface of a semiconductor subs...
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WO/2023/008207A1 |
This layered body manufacturing method includes: a step in which a first adhesive coating layer is formed on a surface of a release agent coating layer formed on a surface of a support substrate; a step in which a second adhesive coating...
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WO/2023/281101A1 |
The invention relates to a method for determining the state of the mechanical properties of a bonded assembly of materials by applying a local heat source that excites particles comprised within the adhesive and investigating the effect ...
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WO/2023/275795A1 |
To provide a double-sided adhesive tape with both high adhesive force and excellent ease of disassembly. A double-sided adhesive tape including a first adhesive layer; a separation layer containing a pigment, the separation layer being p...
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WO/2022/270502A1 |
The present invention provides an optical multilayer body which is obtained by stacking a reflective polarizer and an absorptive polarizer, and which has high image sharpness in a virtual reality display device to which this optical mult...
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WO/2022/269426A1 |
Dispensed adhesive compositions including a core-sheath filament comprising a non-tacky sheath and an adhesive core comprising a polymer, where the dispensed adhesive composition is a product resulting from compounding the core-sheath fi...
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WO/2022/270613A1 |
A method for manufacturing a bonded body, having: a pre-bonding step in which a substrate A, a solid bonding agent, and a substrate B are positioned in this order to prepare a layered body, said solid bonding agent having, as the primary...
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WO/2022/271781A1 |
The present teachings generally relate to an adhesive or adhesive component for multi-material hot melt adhesive bonding. The adhesive or adhesive component comprises a reaction product of two or more monomers or prepolymers, wherein the...
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WO/2022/263128A1 |
The invention relates to a contact device (1) comprising an electrically conductive substrate (2) and at least one electrically conductive, deformable, preferably permeable, contact means (3, 3'), wherein the substrate (2) and the contac...
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WO/2022/255382A1 |
The present invention provides a single component composition for temporary fixing of thin layer glass. The composition exhibits excellent photocuring properties and enables thin layer glasses to be strongly temporarily fixed to each oth...
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WO/2022/250981A1 |
In one example, a method of preparing a fluidic channel includes covalently coupling a first region of a substrate to a first region of a cover using first moieties covalently coupled to the first region of the substrate and second moiet...
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WO/2022/246336A1 |
Photocurable compositions are provided herein, which provide a balance of fast curing properties at exposure to radiation in the electromagnetic spectrum and impressive cure through depth.
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WO/2022/245573A1 |
Bonding dissimilar materials of medical device components can be carried out by applying an adhesive on at least one surface of two components which are composed of dissimilar materials and contacting the surfaces and exposing the contac...
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WO/2022/230199A1 |
This substrate bonding apparatus comprises a first holding mechanism that holds a first substrate, a second holding mechanism that holds a second substrate and can change the distance between the first substrate and the second substrate,...
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WO/2022/226796A1 |
A silicone pressure sensitive adhesive is prepared by curing a hydrosilylation reaction curable composition. The silicone pressure sensitive adhesive adheres to silicone elastomers and is useful in preparation of components of flexible d...
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WO/2022/230928A1 |
A heat releasable adhesive which contains a (meth)acrylic polymer having, in a side chain and/or at an end, a kinetic covalent bond that is capable of reversibly making a dissociation and a bond by means of heating and cooling. An articl...
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WO/2022/225152A1 |
The present invention relates to a dual curable hybrid resin composition and a display adhesive using same, and, more specifically, has excellent initial adhesive strength after UV curing since a moisture curable component and a radiatio...
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WO/2022/221780A2 |
The present disclosure is generally directed to solvent mixtures for swelling and bonding polymeric substances for use in facilitating the connection of polymeric substances to other parts. A swelling solvent solution according to the pr...
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WO/2022/218630A1 |
The present application is directed to a bonded structure comprising: a first substrate having an electrically conductive surface; and, a second substrate having an electrically conductive surface; wherein an electrochemically-debondable...
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WO/2022/216904A1 |
Curable heat-expanding debondable coating compositions for use as a pre-coating or surface preparation in conjunction with adhesive composition. The debondable coating compositions include heat-expandable microspheres which are designed ...
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WO/2022/215040A1 |
Various embodiments of an adhesive prediction system are disclosed. The system can include a non-transitory computer-readable medium including instructions that, when implemented on a processor, cause the processor to perform operations ...
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WO/2022/215039A1 |
Various embodiments of a hand tape applicator and system including such applicator are disclosed. The hand tape applicator includes a body, a spindle connected to the body that is configured to receive a tape roll that includes tape, and...
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WO/2022/215041A1 |
Various embodiments of a module or apparatus for characterization of surface quality of a surface of a substrate and a system that includes such apparatus are disclosed. The apparatus includes a sensor configured to detect at least one p...
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WO/2022/207300A1 |
The present invention is directed to a curable and electrochemically debondable two-component (2K) adhesive composition comprising: a first component comprising: i) at least one polyol selected from the group consisting of fatty alcohols...
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WO/2022/210413A1 |
An aspect of the present invention relates to a bonded object or a method for producing the bonded object, the bonded object comprising substrates bonded to each other by an adhesive layer obtained from a fluororubber composition compris...
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WO/2022/208316A1 |
The present disclosure provides an adhesive precursor composition, comprising a polyfunctional acrylate oligomer, a reactive diluent including an acrylate monomer; a photoinitiator; and heat-expandable microspheres which are capable of e...
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WO/2022/207392A1 |
Provided is a method for forming a bond between two substrates of a device, comprising the steps of: providing a first substrate and a second substrate of a device; providing a first functionalized polyelectrolyte polymer (A) comprising ...
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WO/2022/209222A1 |
The present invention addresses the problem of providing: adhesive tape in which adhesive force with respect to an adherend can be adequately reduced and which can easily be detached and removed, without damaging or dirtying the adherend...
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WO/2022/213078A1 |
A system for attaching a phenolic panel to a metal part includes a phenolic laminate panel having (i) a phenolic panel, (ii) a ferromagnetic susceptor bonded at an inner side of the phenolic panel via higher melting point adhesive and (i...
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WO/2022/210068A1 |
Provided is an adhesive composition, wherein: an adhesive-coated layer obtained by applying the adhesive composition has a complex viscosity of 10-10,000 Pa∙s at 25-100ºC; and the viscosity reduction rate of the adhesive-coated layer,...
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WO/2022/200199A1 |
The invention relates to a method for preparing an adhered article by conducting single-sided gluing, an adhered article, and the use of an adhered article in the production of footwear. The method comprises: a. applying a cleaning agent...
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WO/2022/201613A1 |
An adhesive sheet 1 is for bonding two rigid sheets together. At least one of the two rigid sheets has a contoured surface on a side to be bonded to the other rigid sheet. The adhesive sheet is provided with: a composite adhesive layer 1...
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WO/2022/202153A1 |
Provided is an adhesive composition which is suitable for temporarily bonding a bumped semiconductor substrate to a supporting substrate and which gives an adhesion layer that can inhibit or reduce bump deformation caused by an external ...
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WO/2022/203033A1 |
Provided is an ink-jet adhesive which, when a transparent member is used as an adherent member, can inhibit a component of the adhesive from adhering to areas of the transparent member which are not intended to be bonded. This ink-jet ...
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WO/2022/202160A1 |
A temperature-sensitive adhesive according to the present invention contains an ultraviolet curable side-chain crystalline polymer which is a reaction product of side-chain crystalline polymer and a compound having an ultraviolet curable...
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WO/2022/200974A1 |
The present invention relates to adhesive mixtures. In particular, the invention concerns the use of lignin in biobased hot-melt (non-pressure sensitive) and pressure sensitive adhesives, as well as novel adhesive mixtures suitable for u...
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WO/2022/202659A1 |
Provided is a workpiece processing method in which a workpiece such as a wafer is processed in a state of a layered body obtained by fixing the workpiece to a support body via a temporary fixing material, wherein the workpiece such as a ...
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WO/2022/202822A1 |
This adhesive composition contains a modified polyolefin resin. The polyolefin resin is obtained by modifying a polyolefin resin with an unsaturated carboxylic acid and a radically reactive aromatic compound. The heat of fusion of the po...
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