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WO/2024/082921A1 |
A method for preparing a steel for a high-Ti pipeline submerged-arc welding wire, comprising converter smelting, LF refining, continuous casting, rolling and cooling; in LF refining, refining slag components by weight percentage are: 40-...
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WO/2024/084777A1 |
The present invention addresses the problem of providing: a novel brazing material which is a molded body; and a method for improving a brazing treatment for a finned tube type heat exchanger using the brazing material. A metal powder pr...
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WO/2024/083471A1 |
A Nickel base Brazing Filler Metal (BFM) consisting essentially of; about 12 to 16wt% Chromium (Cr); up to about 5wt% Fe; up to about 2 wt% Mo; about 1 to 5wt% Tungsten (W); about 3 to 6 wt% Aluminum (Al), about 3 to 6 wt% Tantalum (Ta);...
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WO/2024/081323A1 |
Disclosed are methods for coating aluminum alloy heat exchangers that include the use of a waterborne top coating. By using a waterborne top coating, relative to a solvent borne, useful advantages can be achieved, such as improved penetr...
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WO/2024/068182A1 |
The invention relates to a component for an electrically operated arc torch, in particular a plasma burner or plasma cutting torch, characterised in that the component or at least a part or a region of the component consists of a materia...
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WO/2024/068214A1 |
The invention relates to a method for producing a component having a core made from pure copper or a copper alloy by means of powder nozzle laser deposition welding. The method comprises the steps of: providing a core component made from...
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WO/2024/070192A1 |
Provided is a weld joint having relatively thin high-strength steel plates as a base material and excellent room-temperature fracture toughness. In the present invention, the plate thickness of the base-material steel plates is 0.8-10 mm...
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WO/2024/069866A1 |
Provided is a bonding member (1) that bonds a first object (2) and a second object (3). The bonding member (1) includes: metal particles (11) containing Ni as a main component; a low-melting-point phase (12) including Sn as a main compon...
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WO/2024/070191A1 |
Provided is a welded joint which excels in normal temperature toughness and the matrixes of which are relatively thin and high-strength steel sheets. The thickness of each of the matrix steel sheets is 0.8-10 mm. Among the matrix steel s...
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WO/2024/069983A1 |
Provided is a solid wire for submerged arc welding, wherein: the chemical composition of the solid wire, in terms of mass% with respect to the total mass of the solid wire is 0-0.650% C, 0.03-0.50% Si, 4.1-30.0% Mn, 0-0.050% P, 0-0.050% ...
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WO/2024/069985A1 |
This flux cored wire comprises a steel exterior skin and flux, where the chemical composition of the steel exterior skin is: 0 to 0.650% of C; 0.03-0.50% of Is; 3.1-30.0% of Mn; 0-0.050% of P; 0-0.050% of S; 0-5.0% of Cu; 1.0-30.0% of Ni...
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WO/2024/069986A1 |
Provided is a weld metal comprising: 0.030-1.000% of C; 0.03-0.50% of Si; 4.1-30.0% of Mn; 0-0.050% of P; 0-0.050% of S; 0-5.0% of Cu; 1.0-30.0% of Ni; 0-20.0% of Cr; 0-10.0% of Mo; 0-1.000% of Nb; 0-1.00% of V; 0-1.00% of Co; 0-1.00% of...
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WO/2024/069984A1 |
The present invention provides a coated arc welding rod comprising a steel core wire and flux coating the core wire, wherein the chemical composition of the core wire is as follows: C: 0% to 0.650%, Si: 0.03% to 0.50%, Mn: 2.1% to 30.0%,...
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WO/2024/071018A1 |
A brazing material for joining according to the present invention is for joining ceramics and metal and includes 31% by weight or more and less than 60% by weight of antimony (Sb) and 1% by weight to 5% by weight of titanium (Ti), the re...
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WO/2024/068530A1 |
A bonding element suitable for diffusion bonding two components comprises: a sealing structure for locating between the two components; and a heating element connected to the sealing structure and configured to provide local heating to t...
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WO/2024/062951A1 |
The flux according to the present invention is intended to be used for soldering, and comprises at least one carboxylic acid selected from the group consisting of a dicarboxylic acid having a cyclic structure and a tricarboxylic acid hav...
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WO/2024/057534A1 |
A baked flux according to an embodiment of the present invention contains, in terms of mass%, 0.50-10.00% metallic Al, 0-12.00% TiO2, 2.00-30.00% CaCO3, 5.00-18.00% CaF2, 0-50.00% CaO, 10.00-30.00% Al2O3, 3.00-35.00% MgO, 0-1.00% B2O3, 0...
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WO/2024/056510A1 |
The invention relates to a structural element (11) for a security structure, having a hollow part (10) that has a receiving region (15) that is delimited, at least in some regions, by means of one or more wall elements (12, 13, 14) of th...
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WO/2024/057765A1 |
[Problem] To provide a solder wire which has a structure wherein: a resin is coated on a flux layer that is coated on the surface of a solder part for the purpose of preventing adhesion of the flux layer, while taking hygiene and health ...
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WO/2024/058443A1 |
The present invention relates to a gel-type filler material, which may comprise: 80 to 90 wt% of a metal powder; 5 to 20 wt% of a solvent; and 1 (inclusive) to 5 (exclusive) wt% of a binder. The gel-type filler material may also comprise...
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WO/2024/051897A1 |
The invention relates to a main body (1) comprising a coating system (2), the coating system (2) comprising at least one layer (3, 4) having a matrix alloy (5), at least one of the layers (3, 4) comprising at least the following elements...
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WO/2024/051599A1 |
A rare earth rotary target and a preparation method therefor. The rare earth rotary target comprises a back tube (1) and at least one rare earth target tube (A) welded outside the back tube (1). The back tube (1) and the rare earth targe...
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WO/2024/053280A1 |
A solid wire is provided with which a penetration bead having an excellent appearance can be obtained without using any back-shielding gas and a weld metal having excellent mechanical performance can be obtained. The solid wire is for us...
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WO/2024/052805A1 |
The present invention concerns the use of a special steel for making containers, for example reservoirs or tanks, for the storage and transport of liquid ammonia.
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WO/2024/053160A1 |
Provided are: a laser welding method to prevent cracks and obtain welded joints having excellent weld metal toughness; and a laser welded joint. This laser welding method comprises: butting steel material members together; coating the su...
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WO/2024/054538A1 |
The disclosed technology generally relates welding electrodes, and more particularly to consumable welding electrodes having functional coatings. In one aspect, a welding electrode comprises a core wire having a base metal composition an...
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WO/2024/048723A1 |
The present invention is an aluminum alloy brazing sheet comprising a core material, a brazing material, and a sacrificial positive electrode material. The core material is composed of an aluminum alloy containing, in terms of mass%, 1.3...
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WO/2024/043223A1 |
Provided is a flux which is suitable for use in mounting indium sheets, has high wetting properties even in relatively low-temperature bonding, and is more inhibited from forming voids. The flux comprises a rosin, one or more organic aci...
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WO/2024/042663A1 |
This solder alloy can provide a joint part having heat cycle resistance and drop impact resistance, the solder alloy containing 45%-63% by mass of Bi, 0.1% by mass or more and less than 0.7% by mass of Sb, 0.05%-1% by mass of In, and the...
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WO/2024/043231A1 |
Provided is a flux that can suppress the generation of voids when an indium alloy sheet is used to perform a continuous reflow under different temperature conditions. The present invention employs a flux that contains a rosin ester, an o...
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WO/2024/041463A1 |
A spot-welded joint and a manufacturing method therefor. The spot-welded joint comprises a first workpiece (1), a second workpiece (2), and a weld nugget used for fixedly connecting the first workpiece (1) and the second workpiece (2). A...
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WO/2024/037760A1 |
Silver sintering paste consisting of: (A) 5 to 40 wt.% of silver flakes with a particle size D90 in the range from 5 to 20 µm, (B) 50 to 85 wt.% of silver particles with a particle size D90 in the range from 300 to 1,000 nm, (C) 10 to 2...
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WO/2024/038665A1 |
This electronic device comprises: a first electronic component that has an Ni-based electrode; and a second electronic component that is joined to the Ni-based electrode via Sn-based solder, wherein a (Cu, Ni, Pd)6Sn5 compound layer is p...
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WO/2024/034689A1 |
Provided are a solder alloy, a solder paste, and a solder joint, which exhibit a suitable melting temperature, are excellent in terms of wettability, have high tensile strength and shear strength, and have excellent drop impact resistanc...
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WO/2024/034516A1 |
Provided is an electroconductive paste that makes it possible to improve screen printability, maintain tacking properties, and efficiently dispose solder particles on an electrode. The electroconductive paste according to the present i...
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WO/2024/034789A1 |
Solder particles having an active coating formed thereon according to the present invention comprise: a low-melting-point solder particle including tin and bismuth; and an active coating which is formed by pressing an active agent on the...
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WO/2024/029436A1 |
A metal according to the present invention comprises gallium and bismuth, and may be a liquid metal or comprise a liquid metal and a solid metal at 35°C. The metal may comprise 0.01-30 mass% bismuth. The metal may also comprise one or m...
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WO/2024/026971A1 |
An insulated container and a manufacturing method therefor. The insulated container comprises an inner cavity (1) made from titanium, and an outer casing. The outer casing comprises a cup opening portion (2) made from titanium, a stainle...
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WO/2024/028438A1 |
The present invention relates to a filler metal for joint welding of dissimilar welds of fully austenitic stainless steels in combination with low and unalloyed steels. The invention relates to solid wire electrodes as well as flux cored...
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WO/2024/029258A1 |
Provided are a semiconductor module and a method for manufacturing the semiconductor module that make it possible to prevent voids from occurring by means of a joining layer formed of solder. The semiconductor module comprises a laminate...
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WO/2024/022523A1 |
An active solder paste composition for cladding ceramic with copper, a method for cladding ceramic with copper, and copper-clad ceramic. The active solder paste composition comprises, on the basis of the total weight of the active solder...
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WO/2024/024676A1 |
This flux contains a first solvent and a thixotropic agent. The first solvent either has a viscosity of 10 Pa•s or more at 30°C or is a solid at 30°C, has a boiling point of 200°C or more, and has a weight loss rate of less than 96 ...
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WO/2024/022784A1 |
The invention relates to a method for the autogenous processing of metals, in which a hydrogen as a fuel gas from a fuel gas source and oxygen as an oxidising agent from an oxidising agent source are brought together in a processing tool...
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WO/2024/022669A1 |
The invention relates to a method for melting a solder material for joining and/or releasing a soldered joint, wherein nanoparticles incorporated in the solder material dissipate magnetic energy from an alternating magnetic field, substa...
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WO/2024/018729A1 |
This semiconductor device is provided with: an electronic component and a substrate, which are arranged so as to face each other in a first direction; and a solder which connects the electronic component and the substrate to each other. ...
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WO/2024/019147A1 |
Flux according to the present invention is characterized by containing rosin, a solvent, a thixo agent, an amine hydriodide, and an active agent (other than the amine hydriodide), the amine hydriodide including a complex alicyclic amine ...
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WO/2024/019149A1 |
A flux according to the present invention contains a rosin, a solvent, a thixo agent, a thiol compound, and an activator, and is characterized in that the thiol compound includes a compound (Tp) having a benzenethiol backbone in which at...
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WO/2024/018255A1 |
A process for welding at least two steel sheets comprising the following successive steps: providing at least one steel sheet having a composition comprising the following elements, expressed by weight percent: 0.01% ≤ C ≤ 0.2%, 2.5%...
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WO/2024/011492A1 |
A solder paste consisting of 40 to 60 wt. -%of a solder powder with an absolute particle size of the powder particles in the range of 2 to 25 μm, and 40 to 60 wt. -%of a flux.
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WO/2024/009594A1 |
The present invention provides a nickel-based alloy that has excellent aging resistance and in which hardening and embrittlement due to thermal aging are not prone to occur in a high-temperature environment. This nickel-based alloy conta...
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