| Document |
Document Title |
|
JP2024511275A |
The present invention relates to a method for manufacturing a disk from a cylindrical rod made of semiconductor material with an axis and an identification groove on the side of the rod, parallel to the axis. The method comprises, in a p...
|
|
JP7447828B2 |
To provide a cutting method of a work-piece using a wave shaped wire which is excellent in cutting efficiency, and excellent in form accuracy of a cut wafer.A cutting method of a work-piece is given in which a wire row is formed by windi...
|
|
JP7446873B2 |
To provide a cutting blade management system capable of managing a use state of a cutting blade.A cutting blade management system 1 used for a machining device includes at least code memory portions 110A, 110B, 110C that store codes of c...
|
|
JP7446667B2 |
To provide a cutting blade which can highly maintain accuracy of processing.A cutting blade that is mounted on a spindle so as to be sandwiched between a first flange fixed to a spindle and a second flange corresponding to the first flan...
|
|
JP7446683B2 |
The present invention aims to provide a cutting apparatus which is able to definitely replace a cutting blade and prevent the occurrence of a processing fault. The cutting apparatus comprises: a cutting means which has a rotatable cuttin...
|
|
JP7446067B2 |
The present invention provides a flange mechanism for preventing cutting debris as a contamination from entering and sticking to a screwed portion, which will be a concern that a fixating tool for fixating a cutting blade cannot be dismo...
|
|
JP7445852B2 |
To provide a dicing device and a dicing method capable of stabilizing the dicing quality without being affected by the waviness of a work table surface and the variation in the thickness of a dicing tape.A dicing device (10, 10A) for dic...
|
|
JP3245967U |
An object of the present invention is to provide a construction material polishing machine that is easy to operate and improves the dust removal effect. A construction material polishing machine includes a base plate 1 and further has a ...
|
|
JP2024030018A |
An object of the present invention is to easily and reliably diagnose the deterioration (normal or abnormal) of a suction cup in a conveyance mechanism and accurately determine the appropriate time to replace the suction cup. In a cuttin...
|
|
JP7445421B2 |
To efficiently clean a surface and bearing surface of a bolt of a bolt fastening part in cleaning the bolt fastening part of a structure.An attachment for cleaning is for cleaning a bolt fastening part of a structure, and includes a hold...
|
|
JP2024030826A |
An object of the present invention is to provide a cutting device capable of suppressing the movement of a sliding door from being hindered by the accumulation of unnecessary materials scattered during cutting of an object to be cut. [So...
|
|
JP7443808B2 |
To provide a method for manufacturing a piezoelectric oxide single crystal substrate, capable of improving a reduction degree (the efficiency of a reduction reaction) in reduction treatment served as a post step and capable of increasing...
|
|
JP7442927B2 |
To provide a new manufacturing method of a chip, capable of manufacturing a plurality of chips by appropriately dividing a plate-like processed material in which a film containing a metal is provided on a back surface side.A manufacturin...
|
|
JP2024027260A |
The present invention provides a cutting device that prevents cutting fluid containing cutting waste from adhering to a workpiece. [Solution] A holding table (12) that holds a workpiece (1) on a holding surface (13), a rotatable cutting ...
|
|
JP7441779B2 |
To provide a method of cutting a workpiece that restrains the occurrence of fragments, chipping and cracks in a slice plate made by cutting of a workpiece.A workpiece 1 is cut by a multi-wire saw 14 toward one surface from the other surf...
|
|
JP2024027026A |
An object of the present invention is to suppress damage to a cutting edge portion when replacing a cutting blade. A blade holding jig 1 includes a cylindrical cutting blade surrounding part 2 that is formed surrounding a cutting blade p...
|
|
JP7440361B2 |
To provide a device which efficiently polishes an outer periphery of a steel pipe while moving in a circumferential direction.A polishing device 1 comprises a polishing unit 2 and a carrier unit 3, and polishes an outer circumference of ...
|
|
JP7439614B2 |
To provide a method for producing an R-T-B based sintered magnet capable of increasing the utilization efficiency of a diffusion material for a sintered body.There is provided a method for producing an R-T-B based sintered magnet which c...
|
|
JP7440360B2 |
To provide a device which can efficiently polish a mountain side face of an angle steel material with a relatively small force while moving in a longer direction thereof.A polishing device 1 comprises a travel body 2, and a main body 3 s...
|
|
JP7439827B2 |
This method for manufacturing a glass article involves: affixing a glass sheet having a curved-surface shape to a fixture at a position that is further inward than a planned-cutting line corresponding to the outer peripheral shape of a m...
|
|
JP7439613B2 |
To provide a method for producing a novel R-T-B-based sintered magnet capable of further increasing a yield.There is provide a method for producing an R-T-B based sintered magnet which comprises: a step of preparing a workpiece of a powd...
|
|
JP2024025383A |
An object of the present invention is to provide a processing device and a method for processing a workpiece that can prevent cleaning liquid from entering the loading/unloading area and spray from scattering. [Solution] A holding table ...
|
|
JP2024025598A |
[Problem] Processing technology using a wire mesh grindstone that enables a variety of cutting processes such as straight groove machining, arbitrary groove width processing, and straight line cutting to arbitrary curve cutting on workpi...
|
|
JP2024025394A |
An object of the present invention is to automatically adjust the interval between frame guides to eliminate manual positioning and adjustment work of a frame unit by an operator. [Solution] A cutting device that includes a cassette stag...
|
|
JP2024024198A |
An object of the present invention is to provide an orientation detection device that can improve the visibility of the outer periphery of a workpiece. [Solution] An orientation detection device that detects the orientation of a non-circ...
|
|
JP2024024364A |
The present invention provides a cutting device that can provide a worker with information that contributes to improving the quality of manufactured cut products, and a method of manufacturing cut products that can improve the quality of...
|
|
JP2024021976A |
The present invention provides an automatic exchange device that can reliably exchange a cutting blade mounted on a cutting device with a desired cutting blade. An automatic exchange device 2 includes a cutting blade storage means 4 for ...
|
|
JP2024020834A |
The present invention provides a method for shaping a cutting blade that can suppress the length of time required for shaping the cutting blade. [Solution] When the maximum value of the current supplied to a predetermined motor that chan...
|
|
JP2024019804A |
An object of the present invention is to provide an automatic exchange device that can improve the operating rate. [Solution] An automatic exchange device 2 includes a cutting blade storage means 4 that stores a plurality of cutting blad...
|
|
JP7430444B2 |
To provide a cutting blade which enables a user to check information on the cutting blade, and to provide a blade mount which enables the user to check the information on the cutting blade.A cutting blade 30 is attached to a mount flange...
|
|
JP7430451B2 |
A cutting apparatus includes a table including a support plate transparent in a visible region, a cutting unit, a first feeding mechanism that includes a first moving section for supporting the table and a first motor, a second feeding m...
|
|
JP7430450B2 |
The present invention provides a dresser board capable of preventing scattering of particles. The dresser board for dressing a cutting blade of the present invention comprises: a dressing layer comprising abrasive grains fixed by a bindi...
|
|
JP7430449B2 |
A processing apparatus includes a chuck table including a plate-shaped holding component having a predetermined region transparent from one surface to the other surface, a processing unit that processes a workpiece, a first imaging unit ...
|
|
JP7430452B2 |
A cutting apparatus cuts a workpiece by a cutting blade. The cutting apparatus includes a mount flange on which the cutting blade is mounted and a replacement apparatus that replaces the cutting blade mounted on the mount flange with the...
|
|
JP7430108B2 |
(Objective) The present invention provides a method of processing a wafer and a holding table which can suppress the deterioration of production efficiency and a device damage. (Solution) A method of processing a wafer includes: a prepar...
|
|
JP2024017083A |
An object of the present invention is to provide an automatic changing device that does not require management of cutting blades based on visual inspection by an operator. [Solution] An automatic exchange device 2 includes a cutting blad...
|
|
JP7429354B2 |
To provide a processing device which can accurately detect a position of processing means in an axial direction of a spindle.A dicing device 10 that is one example of a processing device of the invention includes: a heat expansion member...
|
|
JP2024017384A |
An object of the present invention is to provide a holding member that can suppress or prevent scattering of scraps generated by cutting an object. [Solution] A holding member 2X for holding an object W to be cut, The holding member 2X i...
|
|
JP2024016543A |
An object of the present invention is to reduce the amount of burrs that are formed to protrude from the side surface of a workpiece. [Solution] A rotating cutting blade is relatively moved in a predetermined direction from one end of a ...
|
|
JP7428519B2 |
To provide a new technique that enables cutting liquid to be optimally supplied to a cutting blade.A cutting device comprises: a cutting unit 34 having a cutting blade 38; a holding table 8 including a holding surface for holding a work-...
|
|
JP7427921B2 |
To provide a new method for determining a slicing processing condition of a semiconductor ingot.A determining method of a processing condition of slicing processing in which a semiconductor ingot is cut with a wire saw includes determini...
|
|
JP2024014944A |
The present invention provides a blade diagnostic method and a blade diagnostic device that can accurately diagnose a blade. [Solution] A groove forming process in which groove processing is performed to form grooves (kerfs 86, 87) on th...
|
|
JP2024014904A |
The present invention provides an alignment device and method that can prevent workpiece alignment errors from occurring. [Solution] The alignment method detects a part of the outer edge of the workpiece based on the measurement results ...
|
|
JP2024014234A |
An object of the present invention is to reduce the number of man-hours required by a worker and to align the orientation of an image in a predetermined direction with high precision. [Solution] An angular deviation adjustment method for...
|
|
JP2024504746A |
The present invention relates to a wire saw with a wire drive and a wire storage for the saw wire, in which an actuating device for tensioning the saw wire is arranged on the drive and storage unit of the wire saw. In a second aspect, th...
|
|
JP7424896B2 |
To protect a device on a wafer periphery from being damaged without restricting a device region and make it possible to eliminate the need to correspond to a top surface shape of a chuck table to a back surface shape of a wafer having an...
|
|
JP7423161B2 |
An objective of the present invention is to provide a chuck table capable of cutting a work piece with high accuracy while suppressing wear of a cutting blade even when dividing the work piece into small chips. The chuck table, which is ...
|
|
JP2024011641A |
The present invention provides a cutting device that realizes automatic control of moving work and stopping work of moving a pulley on a guide rail. [Solution] A cutting device 1 includes a guide rail 30, a movable body 5 provided movabl...
|
|
JP7420571B2 |
A cutting machine includes a monitoring unit that monitors a cutting edge of a cutting blade. The monitoring unit includes an imaging unit that images the cutting edge of the cutting blade, a pulse light source that emits a pulse light t...
|
|
JP7418916B2 |
A cutting blade position detecting method using a cutting apparatus including a holding table that holds a workpiece, and a cutting unit in which a cutting blade for cutting the workpiece held by the holding table is mounted in a rotatab...
|
