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WO/2016/098500A1 |
The objective of the present invention is to provide a method of stably producing, in large volume, a light transmitting region that has a desired light transmissivity in a desired wavelength. This manufacturing method of a light transmi...
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WO/2016/095668A1 |
Provided is a cylindrical-component grinding device, comprising a workpiece advancing apparatus (2) and a grinding disc apparatus (1); the grinding disc apparatus comprises first and second grinding discs (11, 12); the two grinding discs...
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WO/2016/095667A1 |
Provided is a double-disc straight groove cylindrical-component surface grinding disc, comprising a first grinding disc (11) and a second grinding disc (12); the two grinding discs rotate relative to each other; the working face (111) of...
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WO/2016/093504A1 |
Provided is a retainer ring for a carrier head for a chemical polishing apparatus, the retainer ring comprising: a first retainer ring member which comes in contact with the outer lateral side of a wafer; a second retainer ring member wh...
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WO/2016/088444A1 |
A vacuum chuck (11) equipped with a vacuum chuck stage (111) having a round vacuum surface (111A), and also equipped with a vacuum protection pad (112) provided on the vacuum surface (111A), the vacuum chuck (11) being characterized in t...
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WO/2016/084561A1 |
A silicon carbide substrate which is formed of silicon carbide and has a main surface wherein the total length of linear etch pits observed therein is not longer than the diameter of the silicon carbide substrate if the main surface is e...
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WO/2016/084321A1 |
Provided is a polishing-layer molded body: which is non-porous; which contains a thermoplastic polyurethane that is a polymer of monomers including a polymer diol, an organic diisocyanate, a first chain extender containing a diol having ...
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WO/2016/084682A1 |
Provided is an aqueous dispersion for chemical mechanical polishing, which can achieve high speed polishing of a group III-V metal film or group IV metal film and can reduce the number of scratches on the group III-V metal film or group ...
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WO/2016/081272A1 |
Coated compressive subpads for polishing pad stacks and methods of fabricating coated compressive subpads for polishing pad stacks are described. In an example, a polishing pad stack for polishing a substrate includes a polishing pad hav...
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WO/2016/079923A1 |
The present invention is a workpiece processing apparatus comprising: an upper surface plate support mechanism for supporting an upper surface plate from above so as to allow vertical movement using a cylinder that extends along the dire...
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WO/2016/075880A1 |
Provided is a polishing composition capable of polishing a subject to be polished which has a crystalline metal compound in the surface thereof, with higher polishing efficiency. The polishing composition, used for the purpose of polishi...
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WO/2016/077272A2 |
A sample grinder includes a base having a bowl and a rotating drive plate to operably support a grinding wheel. A head is configured to support a specimen holder and has a first drive for rotational drive of the specimen holder and a sec...
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WO/2016/076404A1 |
A method for manufacturing a magnetic disk substrate includes a polishing process for polishing both principal surfaces of the substrate by sandwiching the substrate between a pair of suede-type polishing pads, supplying a slurry contain...
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WO/2016/072371A1 |
Provided is a polishing composition for polishing materials to be polished having a Vickers hardness of 1,500 Hv or higher. With this polishing composition, the relationship between the oxidation-reduction potential ORPx [mV] of the poli...
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WO/2016/072370A1 |
Provided is a method for polishing a material that has a Vickers hardness of 1,500 Hv or more. This polishing method comprises: a step for performing preliminary polishing with use of a composition for preliminary polishing, which contai...
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WO/2016/073181A1 |
An adaptive feedback control method is provided for a chemical mechanical polish process to minimize a dielectric layer clearing time difference between two annular regions on a substrate. An optical system with an optical window passes ...
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WO/2016/068327A1 |
The present invention pertains to a chemical mechanical polishing (CMP) device for polishing a work piece such as a metal case to provide the same with a mirroring finish. The chemical mechanical polishing device is provided with the fol...
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WO/2016/067588A1 |
Provided is a nonporous molded article for a polishing layer which is a nonporous molded article of a thermoplastic polyurethane, wherein the thermoplastic polyurethane has a maximum loss tangent (tanδ) within a range of -70 to -50˚C o...
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WO/2016/067923A1 |
Provided are: an aqueous dispersion for chemical mechanical polishing, which contains silica particles and is capable of polishing a silicon oxide film at a higher rate than conventional aqueous dispersions for chemical mechanical polish...
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WO/2016/067518A1 |
The present invention is a polishing device equipped with multiple polishing heads for holding wafers, a rotatable surface plate on which a polishing cloth for polishing the wafers is affixed, a surface plate-driving mechanism for rotati...
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WO/2016/063505A1 |
Provided is a polishing composition with which a satisfactory polishing rate can be stably maintained. The polishing composition comprises silica particles as abrasive grains and a basic compound as a polishing accelerator. The silica pa...
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WO/2016/063464A1 |
The present invention is a surface plate transport dolly that is for transporting a surface plate that has been removed from a polishing device or a surface plate that is to be installed on the polishing device. The surface plate transpo...
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WO/2016/063457A1 |
The present invention is an index-type polishing device that is provided with a polishing head that is for holding a wafer, with a plurality of surface plates to which are stuck a polishing cloth that is for polishing the wafer, and with...
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WO/2016/060113A1 |
This polishing liquid composition for a sapphire plate contains: silica particles; at least one type of inorganic phosphate compound selected from the group consisting of orthophosphate, phosphite, and hypophosphite; and a water-based so...
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WO/2016/060872A2 |
A polishing head assembly for single side polishing of silicon wafers is provided. The polishing head assembly includes a polishing head and a cap. The polishing head has a recess along a bottom portion, the recess having a recessed surf...
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WO/2016/056165A1 |
The present invention is a CMP polishing agent that contains polishing particles, a protective agent, and water, wherein CMP polishing agent is characterized in that the protective agent is a silsesquioxane polymer having a polar group. ...
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WO/2016/052161A1 |
Provided are abrasive grains that are to be supplied to a polishing table for polishing a hard metal material at a higher efficiency. The abrasive grains have an average grain size of 2-10 μm and show a holding rate to the polishing tab...
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WO/2016/054514A1 |
Polishing pad for use with high-speed mechanical buffers or for use by hand. More specifically, a sloped polishing pad and methods of use for the polishing pad, the sloped polishing pad having a sloped foam pad, and having a cloth, a foa...
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WO/2016/052408A1 |
The present invention provides a polishing composition: that is suitable for polishing objects to be polished having a layer that includes a high-mobility material having a carrier mobility higher than Si; inhibits excessive dissolution ...
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WO/2016/052155A1 |
This abrasive pad is provided with an abrasive layer having an abrasive area and a light-transmissive area, wherein the light-transmissive area has a curved surface of convex shape towards the surface side of the abrasive area, the apica...
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WO/2016/051636A1 |
Provided is a polishing composition whereby a polishing object such as simple silicon, a silicon compound, or a metal, particularly a polishing object including tungsten, can be polished at a high polishing speed. The polishing compositi...
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WO/2016/051659A1 |
For the polishing of polysilicon-containing substrates, provided are a polishing composition and a polishing method capable of suppressing the rate of polishing polysilicon and selectively polishing silicon compounds other than polysilic...
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WO/2016/054487A1 |
Polishing pad for use with high-speed mechanical buffers or for use by hand. More specifically, a polishing pad and methods of use for the polishing pad, the polishing pad having a foam pad, and having a cloth, a foam, or both attached t...
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WO/2016/052281A1 |
The present invention provides a polishing composition capable of adequately limiting dishing phenomena in polishing steps and of more reliably eliminating level differences. The present invention is a polishing composition: which contai...
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WO/2016/051796A1 |
The present invention provides a polishing pad capable of uniformly polishing the whole wafer. The present invention relates to a polishing pad that is characterized in that: the polishing pad is provided with at least (A) a surface poli...
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WO/2016/047802A1 |
The present invention provides a polishing pad with which it is possible to improve polishing accuracy and minimize polishing unevenness when the surface of a to-be-polished object of varying thickness is polished. A polishing pad (1) is...
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WO/2016/047452A1 |
The purpose of the present invention is to provide a layered polishing pad capable of, in spite of a structure such that a back surface of a window (light-transmitting region) is adhered to double-side tape, performing accurate optical e...
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WO/2016/047210A1 |
Invented are: a supporting substrate which is able to contribute to density increase of a semiconductor package; and a laminate which uses this supporting substrate. A supporting glass substrate according to the present invention is char...
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WO/2016/048043A1 |
Disclosed are a device for measuring a groove of a polishing pad for chemical and mechanical polishing (CMP) and a chemical and mechanical polishing device comprising same. The device for measuring a groove and a chemical and mechanical ...
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WO/2016/047451A1 |
The purpose of the present invention is to provide a grinding pad that, although being structured such that the back surface of a window is adhered to an adhesive member, is capable of performing high-accuracy optical final point sensing...
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WO/2016/047725A1 |
Provided is a polishing liquid composition for a silicon oxide film with which it is possible to improve the polishing rate. In one or a plurality of embodiments, a polishing liquid composition for a silicon oxide film is provided, the p...
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WO/2016/047714A1 |
[Problem] The purpose of this invention is to provide a polishing composition that can sufficiently control the polishing rate of a material containing Si. [Solution] Provided is a polishing composition that contains a pH adjusting agent...
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WO/2016/042744A1 |
Provided are: a polishing material which is capable of removing rolling of the outer surface of a resin coating film by polishing and is not susceptible to the formation of polishing scratches; a composition for polishing; and a polishin...
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WO/2016/043088A1 |
Provided is a sapphire substrate polishing agent composition with which a high-precision polished surface free from surface defects such as scratches can be obtained at a high polishing speed. The sapphire substrate polishing agent compo...
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WO/2016/043089A1 |
Provided is a polishing agent composition for a sapphire substrate with which a polishing surface devoid of surface defects such as scratches can be obtained with a high polishing speed and high polishing accuracy. The present invention ...
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WO/2016/037683A1 |
A tool (1) for surface finish machining, having a cushion (6) made of an elastic plastics foam, on the underside of which there is formed a working medium face (2) having working media or adhesives (8, 11, 12, 13) for the releasable atta...
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WO/2016/038995A1 |
The present invention provides a polishing composition which can achieve a high polishing rate against a copper-containing layer and can simultaneously prevent the dissolution of a cobalt-containing layer during the polishing of an objec...
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WO/2016/039265A1 |
A polishing composition for polishing a work including an oxide film and a nitride film, the composition having a pH of 2.0 or higher and containing silica that shows a positive zeta potential.
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WO/2016/038752A1 |
The present invention relates to a holding pad for holding a member to be polished. A holding pad according to the present invention comprises a holding layer. This holding pad is characterized in that: the holding layer has a template f...
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WO/2016/039334A1 |
Provided is a polishing pad which is capable of achieving sufficient polishing accuracy if used for mirror finish polishing. This polishing pad 1 is obtained by bonding a polishing film 9 to the outer circumferential surface of a circula...
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