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WO/2021/006423A1 |
The present invention relates to a polyurethane foam prepared by controlling, when manufacturing the polyurethane foam, an NCO index in a range of 450-550 and, simultaneously, mixing two types of flame retardants, and can implement excel...
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WO/2021/006085A1 |
This phenolic resin composition for a rubber composition contains a phenolic resin having an unsaturated bond, and a tetrazine compound represented by general formula (1) or a salt thereof. [In formula (1), X1 and X2 are the same as or d...
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WO/2021/002097A1 |
To provide a resin composition for manufacturing a phenolic foam, said resin composition enabling the profitable production of a phenolic foam that exerts an excellent heat insulation performance over a medium-to-long term from immediate...
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WO/2021/003363A1 |
An alkylphenol copolymer, such as for use in a petroleum composition, is provided. The alkylphenol copolymer has at least the following repeating unit (I), wherein: A is a direct bond or an alkylene; X is –C(O)O–, –OC(O)–, –C(O...
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WO/2020/218600A1 |
A composition for forming optical components which contains a compound represented by formula (0). (In formula (0), X represents an oxygen or sulfur atom or represents a non-bridged state, the R0 moieties are each independently an option...
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WO/2020/213559A1 |
[Problem] To provide a highly cost-effective method for producing an activated carbon adsorbent, wherein, in activated carbon derived from a phenolic resin, an activated carbon adsorbent capable of quickly adsorbing nitrogen-containing l...
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WO/2020/213992A1 |
The present invention provides amorphous fluorene-based epoxy resin and a method for effectively preparing same, wherein the amorphous fluorene-based epoxy resin has improved workability, storage stability, flow, and leveling while secur...
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WO/2020/195496A1 |
Provided is a composition for forming a heat conducting material, said composition being capable of providing a heat conducting material having excellent heat conduction properties. Also provided is a heat conducting material. The compos...
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WO/2020/186188A1 |
Described herein are polyoxymethylene (POM) compositions comprising polyoxymethylene and styrene maleic anhydride (SMA) copolymers or modified SMA copolymers, said POM compositions exhibiting improved physical properties such as heat def...
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WO/2020/183336A1 |
The present relates to organic compound(s) [i.e. compound of formula I] and/or a composition comprising said organic compound(s) useful for utilization of non-coking coal in a blend comprising coking coal without deterioration of propert...
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WO/2020/184642A1 |
Provided is a composition for forming a resist underlayer film that is insoluble in resist solvents, has favorable optical constants, and has a high etching rate. The composition has excellent ability to fill and flatten stepped substrat...
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WO/2020/169702A1 |
The present invention relates to a composition comprising; components a) b) and d); wherein, component a) is a metal compound having the structure (I), component b) is a spin on high carbon polymer, having a polymer backbone comprising m...
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WO/2020/162621A1 |
Provided are: a method for producing a polyphenol derivative, the method having a step for reacting a polyphenol-containing composition and an aromatic compound having an ortho-para aligning group in a solvent; a polyphenol derivative pr...
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WO/2020/158931A1 |
The purpose of the present invention is to provide: a novel compound which is useful as a film forming material for lithography or as a material for forming an optical component; a resin which contains a constituent unit that is derived ...
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WO/2020/153048A1 |
The present invention addresses the problem of providing a phenolic hydroxyl group-containing resin having superior heat resistance and, when being used as a resist material, exhibits excellent alkali developing properties. Provided is a...
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WO/2020/137309A1 |
The purpose of the present invention is to provide a resist composition which exhibits high heat resistance and can be used in types of lithography that use electron beams and extreme ultraviolet radiation. Specifically, the present inve...
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WO/2020/137310A1 |
The purpose of the present invention is to provide a thermosetting resin composition from which it is possible to obtain a cured product having high heat resistance and high stress relaxation properties. Specifically, this thermosetting ...
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WO/2020/132738A1 |
The present invention relates to processes of synthesis of resole phenolic resins using lignin, to resole phenolic resins comprising an aldehyde, lignin, a base, urea and, optionally, phenol, and also to the use of said phenolic resins a...
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WO/2020/138147A1 |
The present invention provides a compound which has a condensed skeleton of an aromatic compound represented by formula (1-1) and an aromatic aldehyde represented by formula (2-1). (In formula (1-1), A represents an aromatic ring; each R...
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WO/2020/121005A1 |
The present invention relates to an improved phenolic furan resin composition with reduced flammability and to a pre-impregnated fiber-reinforced composite material. The invention also relates to the use of pre-impregnated fiber-reinforc...
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WO/2020/103505A1 |
The present invention provides a 4-tert-alkylphenol-(morpholinyl)formaldehyde resin, a preparation method therefor and use thereof. The 4-tert-alkylphenol-(morpholinyl)formaldehyde resin is prepared by means of condensation and polyconde...
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WO/2020/085282A1 |
[Problem] To provide a method for producing a phenolic resin, said phenolic resin being to be used for the formation of an activated carbon adsorbent, whereby the ratio of macropores in pores formed in a resin carbide is increased by imp...
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WO/2020/077882A1 |
The purpose of the present invention is to provide a binder used for sand casting 3D printing and a preparation method therefor, the binding used for sand casting 3D printing being composed of the following components in part by weight: ...
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WO/2020/070531A1 |
Provided is a curable resin composition which has excellent reactivity that makes low-temperature curing possible and which has excellent flowability during molding and, upon curing, can give cured objects having excellent heat resistanc...
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WO/2020/069999A1 |
The invention relates to a composition comprising: a) at least one supramolecular polymer obtained by reacting a first polymer comprising a polyoxyalkylene chain and having two chain ends, each end comprising at least two ionisable acid ...
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WO/2020/071326A1 |
Provided is a novel fluorescent polymer that can be in the form of fluorescent fine particles or the like. A fluorescent polymer having structural units derived from a first monomer and structural units derived from a crosslinking agent,...
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WO/2020/041954A1 |
Disclosed is a process for preparing a resorcinol formaldehyde resin with a high adhesive strength. The process comprises preparing a resin by using resorcinol and formaldehyde as raw materials and ethylvinyl benzene as a modifying agent...
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WO/2020/040161A1 |
Provided is a composition containing a polyphenol compound (B), wherein the polyphenol compound (B) is one or more resins selected from the group consisting of resins having the structure represented by formula (1) and resins having the ...
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WO/2020/040162A1 |
Provided is a composition containing a polyphenol compound (B), wherein the polyphenol compound (B) is one or more substances selected from the group consisting of compounds having the structure represented by formula (1) and resins havi...
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WO/2020/027206A1 |
This composition includes a polyphenol compound (B) and a solvent, wherein the polyphenol compound (B) is at least one selected from among a compound represented by formula (1) and a resin having a structure represented by formula (2). (...
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WO/2020/026879A1 |
The present invention addresses the problem of providing a useful underlayer film-forming composition. The problem can be solved by the underlayer film-forming composition below. The underlayer film-forming composition contains a solvent...
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WO/2020/017626A1 |
The present invention includes polymers to which groups represented by formula (1) have been added. (In formula (1): Rx, Sy, and Sz are each independently a hydrogen atom or a monovalent organic group; Ry and Rz are each independently ...
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WO/2019/239784A1 |
The purpose of this invention is to provide: a phenolic novolac resin that is suitable for use as a resist material having excellent sensitivity, resolution, and heat resistance; a method for manufacturing the resin; and a photosensitive...
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WO/2019/195355A9 |
A composition includes n-acyl ethanolamine, at least one cannabinoid, and at least one terpene. The composition may be in the form of a tablet.
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WO/2019/229437A1 |
The present invention relates tophenolic-based metamaterials and methods for preparing phenolic-based materials. The present invention also relates to composites formed from phenolic-based metamaterials. More specifically, the present in...
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WO/2019/232147A1 |
A solid RF (novolac) resin comprises reacting a resorcinolic compound and an aldehyde or ketone in the presence of an organic solvent, such as methyl isobutyl ketone, and water. The resultant solid RF resin may be characterized as having...
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WO/2019/230639A1 |
The purpose of the present invention is to provide a novel compound and the like that are useful for a lithography film forming material and the like. The purpose can be achieved by a compound represented by formula (1).
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WO/2019/229436A1 |
The present invention relates to specially formulated adhesives and methods for preparing such adhesives. The present invention also relates to composites and materials formed from such adhesives. More specifically, the present invention...
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WO/2019/225615A1 |
Provided is a resist lower layer film formation composition that exhibits a high etching resistance and a good dry-etching rate ratio and optical constant, exhibits good coating performance even on a so-called stepped substrate, produces...
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WO/2019/225614A1 |
Provided is a resist underlayer film-forming composition capable of being formed into a flat film which can exhibit high etching resistance, a good dry etching velocity ratio and a good optical constant, has a good covering property even...
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WO/2019/222009A1 |
Processes for making polymer gels and carbon materials therefrom. In some examples, the process can include reacting a first mixture that can include a first phenolic monomer, a first aldehyde monomer, and a first catalyst to produce a f...
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WO/2019/208322A1 |
Provided are: a binder that shows excellent discharge properties at an inkjet nozzle head and can provide an uncured sand mold having good handling properties, when used in manufacturing a casting sand mold by an inkjet-type lamination s...
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WO/2019/203241A1 |
The present invention addresses the problem of providing a novel catalyst composition that has excellent catalytic activity and is highly reusable. Provided are a meta-phenolsulfonic acid resin that comprises a structural unit represente...
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WO/2019/203015A1 |
Provided are: a rubber composition containing a butyl rubber, a resol type phenol-formaldehyde co-condensed resin, and a phenol, wherein the rubber composition contains, as the phenol, at least one phenol chosen from the group consisting...
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WO/2019/202914A1 |
The titanate-modified phenolic resin composition production method according to the present invention includes a mixing step for heating and mixing a titanate compound in a phenolic resin and hexamethylene tetramine in a heated mixing st...
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WO/2019/187364A1 |
A photosensitive transfer material which sequentially comprises a temporary support body, an intermediate layer and a positive photosensitive resin layer in this order, and which is configured such that the temporary support body and the...
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WO/2019/189811A1 |
Provided are: a thermosetting resin composition that makes it possible to form a prepreg that has low elasticity, high heat resistance, high extensibility at both room temperature and high temperatures, highly reliable electrical insulat...
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WO/2019/189023A1 |
A phenolic resin according to the present invention is an o-position substitution-type phenolic resin represented by general formula (1), and has a melt viscosity of 0.20 Pa·s or less at 150°C. A substituent R in general formula (1) is...
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WO/2019/188645A1 |
Bis-propylcatechol having a structure represented by formula (1). In the formula, R1 is a C2 or higher divalent aliphatic hydrocarbon group or a divalent aromatic hydrocarbon group.
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WO/2019/180235A1 |
Monocomponent adhesive composition, comprising a formaldehyde-based resin and at least one compound selected from resorcinol, alkylresorcinol and/or tannin, which are not condensed with the resin. The monocomponent adhesive composition a...
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