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WO/2024/070728A1 |
The purpose of the present invention is to provide: a method for producing a semiconductor substrate using a composition which is capable of forming a film that has excellent bending resistance; a composition; and a polymer. This method ...
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WO/2024/065107A1 |
Provided herein are novel compositions comprising oil@HA-derivative particles with high potential for the use in the stimulation of immune response. Methods to produce such compositions and methods of uses thereof in treating or preventi...
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WO/2024/059937A1 |
The present disclosure relates to an electroactive material for use as a secondary battery electrode material and a secondary battery device including the same. Particularly, the present disclosure relates to the use of pre-metallated ca...
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WO/2024/047556A1 |
The present disclosure relates to an organic polymer of Formula I, a method of its synthesis, a blend comprising the organic polymer of formula I, and a method of improving the coking potential of coal using the organic polymer of Formul...
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WO/2024/048369A1 |
A resin composition for sealing a stator according to the present invention is used for forming a sealing member in a stator provided with a stator core which has a plurality of teeth sections and a plurality of slots which are formed al...
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WO/2024/032065A1 |
The present invention belongs to the field of bio-based polymer materials. Disclosed are a daidzein bio-based phenolic resin, a preparation method therefor, and an application thereof. The present invention utilizes daidzin, a low-cost n...
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WO/2024/011789A1 |
A preparation method for phenol phenolic resin and a product obtained thereby, belonging to the technical field of preparation of phenolic resin. The preparation method for phenol phenolic resin comprises the following steps: 1) mixing p...
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WO/2023/234199A1 |
A method for producing a lignin-modified resol-type phenol resin, the method comprising: a step for obtaining a first mixture containing a phenol, water, and a lignin such that the mass ratio of phenol:water between the phenol and the wa...
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WO/2023/227672A1 |
The present invention relates to a method for solubilising a lignin material and controlling its molecular weight, in order to prevent the potential decrease in its reactivity, and thereby controlling the viscosity of both the lignin mat...
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WO/2023/223996A1 |
A resin composition for resin coated sand, the resin composition containing a lignin-modified novolac phenolic resin, wherein the content of free phenols in the lignin-modified novolac phenolic resin is 2% by mass or less.
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WO/2023/209354A1 |
A method of making a modified wood product is provided. The method (1) comprises heating (500) a resin-impregnated wood product, thereby reducing the moisture content of the resin-impregnated wood product but not curing said resin, at a ...
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WO/2023/204283A1 |
A foamed phenolic-resin object containing a hydrofluoroether represented by (formula 1) in an amount of 0.03-4.3 mass%. (Formula 1): CaHbFc-O-CxHyFz (where a, b, c, x, y, and z are integers, and 2≤a≤7, 0≤b≤3, c=2a+1-b, b≤2a+1, ...
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WO/2023/204169A1 |
A thermosetting resin which is decomposable after being cured is obtained. A thermosetting resin according to one embodiment of the present invention has, in a main chain, a benzoxazine ring structure which is represented by a specific f...
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WO/2023/204316A1 |
The present invention provides activated carbon for virus inactivation, constituted of, for example, activated carbon or the like containing nitrogen atoms and having as a carbon source a phenol resin composition containing a phenol resi...
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WO/2023/173367A1 |
The present disclosure provides a tetrabromophthalic anhydride diamine siloxane. In an embodiment, a tetrabromophthalic anhydride diamine siloxane (TDS) is provided with the structure of Formula (1) Formula (1) wherein n is an integer fr...
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WO/2023/169974A1 |
The present invention relates to a method for preparing a stable lignin-phenol blend and a stable lignin-phenol blend obtained by said method.
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WO/2023/154154A1 |
A photocurable composition can comprise a polymerizable material, at least one non-reactive polymer, and a photoinitiator, wherein the non-reactive polymer can have a carbon content of at least 80% based on the total weight of the non-re...
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WO/2023/149553A1 |
[Problem] An objective of the present invention is to provide: a method for improving the hardness of a fired product that is to serve as a resist underlayer film for use in a lithography process for semiconductor device manufacturing us...
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WO/2023/145923A1 |
The present invention provides a resist underlayer film forming composition for nanoimprinting, the resist underlayer film forming composition being capable of forming a film which exhibits good planarization properties, while achieving ...
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WO/2023/147248A1 |
A method of reducing phenol-formaldehyde in a resin and producing laminates therefrom, including the steps of extracting eugenol from a biomass source, mixing the extracted eugenol with a first quantity of curing agent and a second quant...
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WO/2023/095640A1 |
Provided is a phenolic resin composition which is a liquid and which is used for impregnating or coating an organic fiber base material, and which is obtained by means of: a step for reacting a phenol compound that is a starting substanc...
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WO/2023/092608A1 |
Disclosed in the present invention are a calixarene porous polymer with a ultra-high removal rate and a ultra-high adsorption capacity and an application thereof in the selective separation of dyes. According to the present invention, oc...
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WO/2023/080486A1 |
The present invention relates to a phenolic resin for refractories and a method for manufacturing same, the phenolic resin comprising: repeating units (a) derived from a phenolic compound; repeating units (b) derived from an aldehyde-typ...
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WO/2023/080072A1 |
This resin curing agent comprises at least one compound selected from the group consisting of: an ester compound which includes, in a molecular structure, a partial structure represented by -C(CF3)H-, and at least two aromatic ester part...
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WO/2023/077146A1 |
The present invention provides a method of treating or mitigating seizures or epilepsy comprising compounds as described herein.
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WO/2023/066403A1 |
The use of a heteropoly acid and a heteropoly acid salt as a catalyst in the catalytic preparation of an o-cresol phenolic resin, which belongs to the technical field of the preparation of a phenolic resin. In the use of a heteropoly aci...
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WO/2023/058301A1 |
The present invention addresses the problem of providing a method for producing trisphenolmethane that has excellent productivity and with which it is possible to obtain a high purity trisphenolmethane that exhibits excellent transparenc...
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WO/2023/055303A1 |
The subject of the invention is a novel process for the preparation of resole resin with activated Kraft lignin, wherein the lignin activation reaction is carried out in a first step and the synthesis of a new lignin-containing resole re...
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WO/2023/040819A1 |
Disclosed in the present invention are polyetheretherketone and a preparation method therefor. The method of the present invention comprises: introducing argon into a container containing a bisphenol compound to obtain a complex of the b...
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WO/2023/039948A1 |
A method for using a tannic acid coating to assist in the in-situ reduction of a surface of a phenolic resin microsphere to form an ultra-small-size and high-density nano-silver particle, relating to biomass-based nano material preparati...
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WO/2023/044288A1 |
Anion exchange polymers having high OH" conductivity, chemical stability, and mechanical stability have been developed for use in AEMs. The anion exchange polymers have stable hydrophobic polymer backbones, stable hydrophilic quaternary ...
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WO/2023/032803A1 |
The present invention addresses the problem of providing a resin composition which has excellent long-term reliability, does not cause luminous brightness or pixel shrinkage, and does not cause a reduced pixel luminous area ratio even ov...
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WO/2023/013901A1 |
The present invention relates to a method for preparation of an alkyl phenol resin, an alkyl phenol resin composition, and a rubber composition comprising an alkyl phenol resin. The alkyl phenol resin of the present application has impro...
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WO/2022/270484A1 |
The purpose of the present invention is to provide a method for producing a semiconductor substrate using a composition from which a film having excellent etching resistance, heat resistance, and bending resistance can be formed, and a c...
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WO/2022/265084A1 |
The present invention provides a compound represented by formula (1A) (wherein the symbols are as defined in the description).
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WO/2022/263454A1 |
The invention relates to the use of a photopolymerizable composition comprising a phenol-formaldehyde resin, a curing agent and a photoinitiator in an additive manufacturing method for production of three-dimensional articles by means of...
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WO/2022/260295A1 |
The present invention relates to a lignin-modified phenolic resin, a method for preparing a lignin-modified phenolic resin, and a molded body comprising same, wherein the lignin-modified phenolic resin can be more appropriately used in a...
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WO/2022/239597A1 |
Provided is a curable material that can be formed into a thick film and has flexibility and developing properties. More specifically provided is a resin containing a phenolic hydroxyl group, the resin comprising a structural unit A repre...
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WO/2022/238346A1 |
This invention relates to a resin made from an aldehyde component which comprises 5-hydroxymethyl furfural, and a reactive aromatic compound which comprises lignin, characterised in that the aldehyde component comprises monomeric 5-hydro...
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WO/2022/219227A1 |
A method for producing a binder composition without using a compound selected from the class of phenols, is disclosed. The method comprises: (i) heating an aqueous composition comprising lignin and lignin oligomer in the presence of a ca...
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WO/2022/215553A1 |
This lignin-modified novolac-type phenol resin has a weight-average molecular weight of 5,500 or more.
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WO/2022/215554A1 |
A heat-curable resin composition for friction materials which comprises a lignin-modified novolak-type phenolic resin having a weight-average molecular weight of 6,000 or higher and a hardener.
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WO/2022/195971A1 |
The purpose of the present invention is to provide: a method for fractionating a phenolic resin by using a solvent that is easier to handle; a method for producing a phenolic resin; and a solvent for fractionating a phenolic resin. A met...
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WO/2022/197704A1 |
A substantially homogeneous composition comprising cellulose nanocrystals (CNC) and carboxymethyl cellulose (CMC), wherein said CNC and CMC provide 85-95% of and 5-15% of total dry weight percentage of said CNC and CMC, respectively; a m...
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WO/2022/191037A1 |
The purpose of the present invention is to provide: a method for manufacturing a semiconductor substrate using a composition from which a film having excellent etching resistance, heat resistance, and bending resistance can be formed; a ...
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WO/2022/191062A1 |
The purpose of the present invention is to provide: a method for producing a semiconductor substrate, the method using a composition which is capable of forming a film that exhibits excellent etching resistance, heat resistance and bendi...
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WO/2022/176571A1 |
The present invention addresses the problem of providing a novel resin or the like that is particularly useful as a film-forming material for lithography. Said problem can be solved by a resin including a structural unit represented by f...
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WO/2022/170032A1 |
The disclosure relates to adhesive compositions, including non-crosslinked resins and crosslinked/cured adhesives joining substrates, as well as related methods for making the compositions and articles. Compared to a conventional phenol ...
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WO/2022/167450A1 |
The invention relates to a method for producing a carbon-containing molded body using a sol gel process, having the following steps: - providing a suspension of a two-dimensional and/or three-dimensional polymer template in an organic so...
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WO/2022/140641A1 |
This invention relates to a modified phenolic resin and a process of modifying a phenolic resin by an ethylenically unsaturated carboxylate compound. The ethylenically unsaturated carboxylate compound contains a thermally polymerizable o...
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