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WO/2017/209108A1 |
A thermosetting resin composition containing: (A) an adduct of (a1) a maleimide compound having at least two N-substituted maleimide groups per molecule and (a2) an amine compound having at least two primary amino groups per molecule; (B...
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WO/2017/207298A1 |
A bifunctional polymer is functionalized at one end with an azlactone end group to conjugate biomolecules of interest, and is functionalized at another end with an azide anchor group to attach the polymer to a substrate. Methods of makin...
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WO/2017/208773A1 |
The heat-resistant composition according to the present invention is characterized by including one or more repeating units that each comprise both an (un)saturated hydrocarbon and an aliphatic hydrocarbon having ion pairs at both termin...
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WO/2017/209384A1 |
The present invention relates to an organic electronic element and a method for manufacturing same, the organic electronic element comprising: a cathode; an anode provided so as to face the cathode; an organic active layer provided betwe...
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WO/2017/204182A1 |
Provided is a detachable layer-forming composition which, for example, contains an organic solvent and a polyamic acid, both ends of which are derived from tetracarboxylic acid and sealed with an aromatic monoamine, such as the polyamic ...
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WO/2017/202596A1 |
The invention relates to a molding compound (100) for electronic components, comprising a plastic main matrix (10) into which polypropylene particles (11) having a beta crystallite structure are introduced.
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WO/2017/204531A1 |
The present invention relates to a self-humidifying ion exchange composite membrane, comprising an aromatic hydrocarbon-based polymer ion exchange membrane formed on a porous polymer support, and a hydrophobic thin film coating layer hav...
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WO/2017/204462A1 |
The present invention provides polyamide-imide, a method for preparing same, and a polyamide-imide film using same. The polyamide-imide film exhibits excellent transparency, heat resistance, mechanical strength and flexibility, and thus ...
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WO/2017/204178A1 |
Provided is a detachable layer-forming composition which, for example, contains an organic solvent and a polyamic acid such as that which is represented by formula (1). (In the formula, X represents an aromatic group represented by formu...
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WO/2017/204186A1 |
Provided is a detachable layer-forming composition which, for example, contains an organic solvent and a polyamic acid, both ends of which are derived from a diamine and sealed with an aromatic dicarboxylic acid, such as the polyamic aci...
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WO/2017/204165A1 |
The present invention provides a resin composition which can be used to obtain a cured film having chemical resistance, low stress properties, and high stretchability even in a low-temperature heating process. (a) The resin composition c...
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WO/2017/205569A1 |
Disclosed are electrically conductive polymer compositions, and their use in organic electronic devices. The electrically conductive polymer compositions include an intrinsically electrically conductive polymer having Formula II: In Form...
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WO/2017/201847A1 |
A heat-insulating polyimide composite film used in an electric heating film substrate. The polyimide composite thin film comprises: a polyimide resin, and modified SiO2 hollow spheres uniformly distributed in the polyimide resin. The mod...
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WO/2017/199220A1 |
A coating layer includes a composite of a fluoropolymer and a high heat thermoplastic polyimide, the thermoplastic polyimide having 5 to 1000 units of the formula (I): wherein each V is the same or different, and is a substituted or unsu...
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WO/2017/199222A1 |
A composite includes a fluoroelastomer, 0.1 to 5.0 parts by weight of a vulcanizing agent, based on 100 parts by weight of the fluoroelastomer, 5 to 50 parts by weight of a polyimide, based on 100 parts by weight of the fluoroelastomer, ...
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WO/2017/199499A1 |
A resin composition (10) as this thermoplastic resin composition includes a polyamide-imide resin (11) and nanodiamond particles (12). The 10% thermal decomposition temperature of the nanodiamond particles (12) is, for example, 400°C or...
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WO/2017/195574A1 |
A polyimide resin including a structural unit A derived from a tetracarboxylic acid dianhydride and a structural unit B derived from a diamine compound, wherein, structural unit A includes a structural unit (A-1) derived from a compound ...
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WO/2017/194397A1 |
The invention relates to an impregnating resin composition containing a) a melanin formaldehyde resin, b) a nonionic wetting agent, c) a nonionic separating agent, d) a curing agent, and e) polyhexamethylene guanidine (PHMG). The inventi...
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WO/2017/191931A1 |
The present invention relates to a method for preparing a perfluorinated acid-treated conductive polymer thin film and the use of same and, more particularly, to a method for preparing a conductive polymer thin film which enables long-te...
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WO/2017/192306A1 |
Compositions include a compound preparable by reaction of components comprising an optionally crosslinked polyethylenimine and at least one an amine-reactive hydrolyzable organosilane represented by the formula R-Z-SiY3. R represents an ...
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WO/2017/191830A1 |
The present invention relates to the following: a polyimide resin having a constituent unit A derived from a tetracarboxylic acid dianhydride and a constituent unit B derived from a diamine, wherein the constituent unit A includes a cons...
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WO/2017/191528A1 |
A method of making a solvent cast polymer composite film comprising (a) contacting barium titanate, a titanate coupling agent (TCA) and a mixing solvent to form a barium titanate and TCA solution; (b) dispersing at least a portion of the...
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WO/2017/187783A1 |
The present invention provides a heat-curable resin composition which is capable of giving cured objects excellent in terms of toughness and adhesiveness, without considerably lowering the mechanical strength or heat resistance. The pres...
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WO/2017/189314A1 |
A method for producing an aromatic bisimide includes reacting a dialkali metal salt of a dihydroxy aromatic compound with a reactive substituted phthalimide under conditions effective to form a product mixture, introducing the product mi...
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WO/2017/186921A1 |
Ahigh-flowpolymer compositionincludes a polyetherimide(PEI), a PEEK-PEDEK copolymer, and optionally a poly(aryletherketone) (PAEK) other than the PEEK-PEDEK copolymer.The polymer composition surprisingly exhibits improved toughness and c...
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WO/2017/188630A1 |
Provided in the present invention is a polyamide-imide film having significantly enhanced mechanical physical properties and heat resistance while maintaining transparency. The polyamide-imide has excellent transparency, heat resistance,...
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WO/2017/186922A1 |
A high-flowpolymer compositionincludes a polyphenylsulfone(PPSU)and a PEEK-PEDEK copolymer. The polymer composition surprisingly exhibits improved toughness while maintaining chemical resistance, making it suitable for the manufacture of...
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WO/2017/186926A1 |
A polymer composition includes at least two different polymers independently selected from a poly(aryl ether ketone) (PAEK), a poly(aryl ether sulfone) (PAES), a polyarylene sulfide (PAS) and a polyetherimide (PEI), and about 0.05 to abo...
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WO/2017/188604A1 |
The present invention relates to: a resin composition comprising a mercaptosilane coupling agent, a hydrolysis resistant additive, a filler, and a polyarylene sulfide having a chlorine content of 300 ppm or less; and a molded product man...
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WO/2017/183226A1 |
Provided are a thermosetting resin composition capable of forming a cured film having high hardness, high transparency, and adhesion to glass or ITO, and an application for the same. The thermosetting resin composition according to the p...
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WO/2017/182536A1 |
The invention relates to thermoplastic molding compounds M comprising an antimicrobially active polymer component A containing 0.2 to 25 wt% polyguanidine A1 and one or more polymers A2 which carry one or more functional groups that can ...
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WO/2017/183461A1 |
Provided are: a novel polymer having a high glass transition temperature and an exceptional performance balance of heat resistance, high refractive index, and mechanical properties; and a composition and a molded article in which this po...
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WO/2017/179877A1 |
The present invention relates to: a polyamide-imide film having transparency and, simultaneously, having characteristics of implementing surface hardness and mechanical properties; and a manufacturing method therefor. According to the pr...
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WO/2017/176767A1 |
The present invention provides benzamidazole compounds and methods of using the compounds as galectin-1 inhibitors.
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WO/2017/175614A1 |
The present invention provides a resin composition including a reaction product (P) obtained by reacting an amino-modified silicone (A), a maleimide compound (B), and one or more selected from the group consisting of carboxylic acids (C)...
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WO/2017/176000A1 |
The present invention can provide a method for manufacturing a polyimide with improved thermal stability that has no contraction even at a high temperature, by adjusting the amount of an acid anhydride in the preparation of a polyimide p...
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WO/2017/175679A1 |
The present invention provides a polyimide resin composition which contains an alicyclic polyimide resin having a structural unit represented by general formula (1) and at least one type of inorganic particle selected from among titanium...
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WO/2017/171368A1 |
The present invention relates to a liquid crystal aligning agent for use as an aligning film for a liquid crystal display and, more particularly, to a liquid crystal aligning agent with an improved imidization ratio capable of exhibiting...
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WO/2017/173195A1 |
The present disclosure provides a resin blend containing a blend of a first phthalonitrile resin, a filler, and a bisphenol M diphthalonitrile ether resin. Suitable fillers include at least one of nanoparticles, microparticles, or fibers...
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WO/2017/169880A1 |
A resin composition for insulating coating materials, which contains a polyimide resin and/or a precursor thereof and a polymer having a heterocyclic ring in a side chain, and which contains 0.1-7 parts by weight of the polymer having a ...
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WO/2017/169009A1 |
The purpose of the present invention is to provide a resin composition whereby surface roughness in a thin-film formation part can be suppressed and insulation reliability of the thin-film formation part can be maintained, a cured relief...
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WO/2017/169651A1 |
The present invention addresses the problem of providing: a display device surface member containing a polyimide film having an improved close adhesion with a cured resin layer; and a manufacturing method for the display device surface m...
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WO/2017/172477A1 |
A process includes contacting a metallic acrylic salt with a polyolefin, forming a polyolefin composition. The process includes extruding the polyolefin composition, and pelletizing the extruded polyolefin composition. A production rate ...
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WO/2017/168732A1 |
This resin composition contains a carbodiimide compound that has at least one carbodiimide group in each molecule, a curing agent and an inorganic filler. It is preferable that an aromatic carbodiimide compound is contained as the carbod...
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WO/2017/170681A1 |
The present invention provides a polymer composition for producing a liquid crystal alignment film, with which a high-quality liquid crystal alignment film can be efficiently produced by expanding the range of light irradiation level at ...
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WO/2017/161843A1 |
The present invention provides a halogen-free thermosetting resin composition, a prepreg containing same, a laminate, and a printed circuit board. The halogen-free thermosetting resin composition comprises, based on 100 parts by weight o...
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WO/2017/163698A1 |
The present invention addresses the problem of: providing a polyimide film that has satisfactory transportability and has little plane-direction unevenness in haze; and providing a process for producing the polyimide film. The process of...
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WO/2017/160014A1 |
Provided in the present invention are an ion channel pressure sensor and a method for manufacturing same. The ion channel pressure sensor comprises: a lower storing portion including a lower accommodating space for accommodating an elect...
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WO/2017/150231A1 |
This resin sheet is used for a solder resist, and is provided with: a carrier base; and a resin layer that is arranged on the carrier base and is formed from a resin composition for solder resists. The resin layer has a film thickness of...
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WO/2017/150377A1 |
The main purpose of the present invention is to provide a resin film having improved stiffness and bending resistance, and reduced optical distortion. The polyimide film contains a polyimide having an aromatic ring, and inorganic particl...
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