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WO/2008/101553A1 |
A dispersion comprising cerium oxide particles and colloidal silicon dioxide particles, where - the zeta potential of the silicon dioxide particles is negative and that of the cerium oxide particles is positive or equal to zero, and the ...
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WO/2008/101562A1 |
A dispersion comprising cerium oxide particles and particles of one or more sheet silicates, where the zeta potential of the sheet silicate particles is negative and that of the cerium oxide particles is positive or equal to zero, and th...
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WO/2008/092853A1 |
The invention relates to a method for coating surfaces by treating them with a substantially paraffin-free aqueous formulation, made of (A) at least one copolymer having a melt flow rate (MRF) in the range from 1 to 50 g/10 min, which co...
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WO/2008/094702A1 |
The invention provides a method of chemically-mechanically polishing a substrate comprising tungsten through use of a composition comprising a tungsten etchant, an inhibitor of tungsten etching, and water, wherein the inhibitor of tungst...
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WO/2008/087898A1 |
A wiping-up type gloss agent which imparts a gloss to an article surface through a simple wiping-up operation without the need of any physical polishing treatment or any special treatment device. The gloss imparted is highly durable and ...
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WO/2008/085187A2 |
A method and system is provided for improved polishing or planariziπg of aluminum oxide and/or aluminum oxyrπtride substrates. Specifically, the composition comprises an abrasive, a liquid carrier, and a phosphorus-type mono-acid. Pref...
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WO/2008/080958A2 |
A composition for polishing surfaces, the composition comprising the following components: a) at least one inorganic abrasive component (S), comprising a lanthanide oxide, b) at least one organic dispersant component made of polymer (P),...
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WO/2008/080096A2 |
Compositions useful for the selective removal of silicon nitride materials relative to poly-silicon, silicon oxide materials and/or silicide materials from a microelectronic device having same thereon. The removal compositions include fl...
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WO/2008/075212A2 |
A polish having improved properties is generally disclosed. In one embodiment, the polish can include a preservative that resists the growth of organisms, such as mold, fungus, bacteria, and the like, even after extended periods of nonus...
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WO/2008/072207A1 |
Compositions and methods suitable for the electrochemical mechanical planarization of a conductive material layer on a semiconductor workpiece. Compositions contain a phosphonic acid based electrolyte, a corrosion inhibitor, a chelating ...
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WO/2008/067731A1 |
The present invention discloses the application of polymers which comprise repeating units containing -(RO)- or -(RCOO)- groups in production of chemical mechanical polishing liquid of self-etch-stop of polysilicon and usage of the same,...
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WO/2008/069781A1 |
The present invention provides CMP abrasive slurry that is substantially free of aluminum oxide and comprises liquid and solids wherein the solids comprises: (a) in an amount of at least about 90 weight percent based on the solids, at le...
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WO/2008/058894A1 |
The invention relates to a method for the production of pyrogenic silica having a specific surface area of 30 to 500 mˇ/g and an average aggregate particle size of 100 to 500 nm and a relative thickening effect of greater than 2.0 relat...
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WO/2008/058196A2 |
The present invention relates to compositions for chemical mechanical polishing (CMP - also referred to as chemical mechanical planarization) for fabrication of an advanced optical, photonic, or microelectronic device, wherein the compos...
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WO/2008/052423A1 |
A chemical-mechanical polishing liquid for polishing polysilicon is disclosed, which comprises abrasive particles and water, and is characterized in that further comprises one or more kind of quaternary ammonium-type cationic surfactants...
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WO/2008/052216A2 |
Organic-inorganic composites were prepared as colloidal particles of a cross-linked, thermally responsive polymer. Hybrid PNIPAM-polysiloxane particles and composite polymeric particles with embedded nanoparticles of an inorganic metal-o...
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WO/2008/043481A1 |
The invention relates to gliding material for winter sports equipment, preferably ski waxes, which contain nanocorundum to improve tribologic characteristics, said nanocorundum being preferably modified on the surface with a silane or si...
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WO/2008/043703A2 |
The invention relates to a suspension of cerium oxide particles in which the particles (secondary particles) have an average size not exceeding 200 nm, said secondary particles being comprised of primary particles having an average size ...
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WO/2008/040183A1 |
A chemical-mechanical polishing liquid for polishing low-dielectric material is disclosed, which comprises abrasive particles, corrosion inhibitor, oxidizer and water, and the characteristic of the liquid is in that further comprises at ...
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WO/2008/040182A1 |
A chemical-mechanical polishing liquid for polishing polysilicon is disclosed, which comprises abrasive particles and water, and further comprises one or more kind of polylol-type nonionic surfactants. The polishing liquid is a novel CMP...
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WO/2008/040158A1 |
A chemical-mechanical polishing liquid for polishing polysilicon is disclosed, which comprises abrasive particles and water, and further comprises one or more kind of oxidizing agent. Under basic condition, the polishing liquid may signi...
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WO2008011020B1 |
An aqueous floor care composition comprising water, polymer particles wherein the polymer particles include units derived from a conjugated diene monomer, units derived from an acidic monomer, and units derived from a hard, non-acidic mo...
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WO/2008/028615A1 |
The invention relates to leather care products which contain as the solvent a compound of formula (1), wherein A is (CH2)a or phenylene, R1, R2, R3 and R4 are the same or independently represent C1 to C22-n- and/or iso-alkyl, C5-or C6 cy...
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WO/2008/025209A1 |
A polishing slurry for low dielectric material is disclosed. It includes abrasive and water, and is characterized in that, it further contains one or more kinds of metal chelating agents, azole-species as film-forming agent and oxidizing...
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WO/2008/025208A1 |
A polishing slurry containing blended abrasives for low dielectric material is disclosed, which includes two or more kinds of polishing abrasives, wherein, one of the abrasives is Al-doped silica, and the second abrasive is the one selec...
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WO/2008/027373A1 |
Concentrated slurry compositions for use in loose-abrasive machining processes, particularly concentrated abrasive slurries for use in wire saw processes. These concentrated slurry compositions comprise abrasive particles uniformly and s...
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WO/2008/012085A1 |
Leather-surface repair set consisting at least of a degreaser and of a composition comprising an emulsion of polyurethane and at least one pigment component and further comprising at least one further component which allows to relatively...
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WO/2007/146018A1 |
A product for treating the surfaces of vehicles comprising a silanol-containing composition used to enhance gloss and aid in protecting substrates. More particularly, a product for treating vehicles comprising silanols and catalysts that...
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WO/2007/141475A2 |
The present invention relates to emulsion compositions comprising mineral oil, an oil-soluble polymer and water, to their use as polishes, and to aerosol products comprising these compositions.
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WO/2007/143127A1 |
A composition comprising a solution of potassium monopersulfate having an active oxygen content of from about 3.4% to about 6.8% and a process for its preparation including neutralization with an alkaline material is disclosed.
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WO/2007/142815A1 |
The invention provides a cyanide-free chemical-mechanical polishing (CMP) composition useful for polishing a gold-containing surface of a substrate. The CMP composition comprises an abrasive, a gold-oxidizing agent, a cyanide-free gold-s...
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WO/2007/139442A1 |
The aim of the invention is to develop a concentrate for a lapping paste whose composition makes it possible to substitute a traditional finishing lapping, consisting in carrying out preliminary rough and subsequent final (fine) processi...
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WO/2007/137508A1 |
A polishing slurry for subtle surface planarization and its using method are disclosed. The present polishing slurry for subtle surface planarization includes abrasive and water, it is characterized in that the abrasive is a colloidal Al...
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WO/2007/128037A1 |
The invention relates to coating compositions, in particular anti-slip floor coating compositions that contain a crystalline polymeric material in solution that crystallises as the coating cures leading to the formation of hard polymeric...
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WO/2007/126773A2 |
A liquid polishing composition of the invention suitable for polishing an automobile and the like comprises about 0.01 to about 3 percent by weight of at least one silicone-based wax, about 0.20 to about 10 percent by weight of poly(alph...
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WO/2007/122585A2 |
The invention relates to a method of manufacturing a semiconductor device (10) with a substrate (11) and a semiconductor body (2) which is provided with at least one semiconductor element and the surface of which is provided with an alum...
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WO/2007/114814A1 |
The invention provides a chemical-mechanical polishing system comprising a polishing component, a surfactant, and a liquid carrier. The invention further provides a method of chemically-mechanically polishing a substrate with the polishi...
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WO/2007/111855A2 |
The inventive chemical-mechanical polishing system comprises a polishing component, a liquid carrier, an oxidizing agent, and a halogen anion. The inventive method comprises chemically-mechanically polishing a substrate with the polishin...
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WO/2007/111813A2 |
The invention provides compositions and methods for planarizing or polishing a substrate. The composition comprises an abrasive, iodate ion, a nitrogen-containing compound selected from the group consisting of a nitrogen-containing C4-20...
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WO/2007/108926A2 |
The inventive chemical-mechanical polishing composition comprises, and has a pH of 1 to 6. The inventive method of polishing a substrate involves the use of the aforesaid polishing composition and is particularly useful in polishing a su...
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WO2007070713A9 |
The present invention provides a liquid protectant composition composed of a cationic microemulsion of a natural wax (carnauba wax) nanometer sized particles and zinc oxide nanometer sized particles in combination with a quaternary silox...
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WO/2007/108925A2 |
The present invention provides a chemical-mechanical polishing (CMP) composition comprising an amino compound, a radical-forming oxidizing agent, a radical trapping agent capable of inhibiting radical-induced oxidation of the amino compo...
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WO/2007/104089A1 |
A composition for application to a surface where the composition includes a base carrier substance and a plurality of magnetically permeable particles suspended therein. The magnetically permeable particles are removable from the base ca...
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WO/2007/102138A2 |
A new barrier slurry composition enables metal and barrier layer material (as well as cap layer material, if necessary) to be removed at a practical rate whilst eliminating, or significantly reducing, the removal of underlying low-k or u...
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WO/2007/097977A1 |
In an aerosol spray composition suitable for coating automobile exteriors, where the aerosol composition is pressurized in a container with propellant and includes water and a polyvinyl alcohol composition, the improvement being that sai...
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WO/2007/087831A1 |
During processing of a semiconductor wafer bearing a structure including a low-k dielectric layer (120), a cap layer (130) and the metal-diffusion barrier layer (140), a chemical mechanical polishing method applied to remove the metal-di...
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WO2007070716A9 |
A water in oil emulsion wax composition composed of natural and synthetic waxes, surfactants, suspending agents, aluminum oxide particles of high purity having an average particle diameter of less than 300 nanometers, typically from 0.20...
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WO/2007/070714A2 |
A water based spray wax composition containing a microemulsion of a cationic wax nanoparticles, a quaternary silicone compound and zinc oxide nanoparticles providing long lasting protection of paint, glass, and metal, plastic, rubber, or...
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WO/2007/067294A2 |
The invention provides a chemical-mechanical polishing composition comprising a cationic abrasive, a cationic polymer, an inorganic halide salt, and an aqueous carrier. The invention further provides a method of chemically-mechanically p...
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WO2007028898B1 |
The invention concerns a mechanochemical polishing composition comprising abrasive particles including molecules of a metal oxide, a metal oxidizing agent, a first chemical attack agent of metals, a pH regulating agent, optionally a seco...
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