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WO/2024/078801A1 |
The present invention relates to a curable and electrochemically debondable one-component (1K) structural adhesive composition comprising a) a (meth)acrylate monomer selected from the group consisting of hydroxypropyl acrylate, hydroxypr...
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WO/2024/071265A1 |
This bonding sheet (1) contains a resin component and solder particles (5). The average primary particle diameter of the solder particles (5) and the average secondary particle diameter of the solder particles (5) are both 7 µm or less.
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WO/2024/070680A1 |
An adhesive electrode for acquiring biosignals according to the present invention which contains a conductive polymer, an aqueous emulsion thickener and a nitrogen-containing additive, wherein the content of the nitrogen-containing addit...
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WO/2024/068274A1 |
The invention relates to a curable adhesive comprising: a) one or more (co)polymers, b) one or more polymerizable epoxide compounds, c) one or more cationic initiators, and d) one or more pH colour indicators with at least one pH-depende...
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WO/2024/071400A1 |
The present invention provides an electroconductive adhesive layer which is capable of exhibiting sufficient adhesion strength to various adherends even if compression bonding is performed at low temperatures for a short period of time.ã...
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WO/2024/070317A1 |
A connection structure 1 in which an electrode 11 of an electronic component 10 and an electrode 21 of a substrate 20 are connected by a connecting material 2' derived from a conductive particle-containing layer in which conductive parti...
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WO/2024/052121A1 |
The present invention relates to a debondable solvent-borne pressure sensitive adhesive composition comprising a) a (meth)acrylate co-polymer formed from the monomers selected from the group consisting of ethyl (meth)acrylate, methyl acr...
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WO/2024/048156A1 |
The present invention provides: a resin composition which is curable at a relatively low temperature and which has a long pot life; a cured product; and a semiconductor device and an electronic component which include the cured product.ã...
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WO/2024/047472A1 |
Color absorbing adhesive compositions include an optically clear pressure sensitive adhesive and at least one light absorbing component dispersed within the pressure sensitive adhesive. The light absorbing component is a dye that has a p...
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WO/2024/048088A1 |
Provided are an anisotropic conductive film, a connection structure, and a method for producing a connection structure, that, in the case of high-pressure mounting, suppress increases in the continuity resistance value, avoid the generat...
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WO/2024/040582A1 |
Conductive adhesives include a pressure sensitive adhesive composition, electrically conductive particles dispersed within the pressure sensitive adhesive composition, and at least one nanoparticle additive dispersed within the pressure ...
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WO/2024/042720A1 |
An adhesive film for circuit connection comprising a first adhesive layer having thermosettability, conductive particles partially embedded in one side of the first adhesive layer, and a second adhesive layer that has thermosettability a...
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WO/2024/040583A1 |
Conductive adhesives include a pressure sensitive adhesive matrix and electrically conductive particles. The matrix includes at least one non-linear block copolymer with aromatic end blocks and aliphatic elastomeric blocks, at least one ...
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WO/2024/034516A1 |
Provided is an electroconductive paste that makes it possible to improve screen printability, maintain tacking properties, and efficiently dispose solder particles on an electrode.　The electroconductive paste according to the present i...
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WO/2024/034464A1 |
Disclosed is an adhesive film for circuit connection. This adhesive film for circuit connection comprises: a first adhesive layer containing conductive particles and a thermoplastic resin; and a second adhesive layer provided on the firs...
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WO/2024/034246A1 |
The present invention provides an adhesive base material with a wiring line, the adhesive base material being capable of suppressing the occurrence of a crack or buckling in a wiring pattern that is formed on an adhesive layer. An adhesi...
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WO/2024/029541A1 |
The present disclosure provides a means which is capable of suppressing the connection resistance to a low level in cases where base metals, or a base metal and another material are electrically connected to each other with use of a cond...
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WO/2024/029513A1 |
Provided is an electroconductive adhesive which has both a high creep resistance at high temperatures and high adhesivity. This electroconductive adhesive is a sheet-type electroconductive adhesive comprising: electroconductive particles...
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WO/2024/025367A1 |
The present invention relates to a battery cell assembly and a manufacturing method therefor, the battery cell assembly comprising: a cylindrical battery cell; a PCB disposed on top of the cylindrical battery cell; and a thermistor for m...
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WO/2024/025476A1 |
Disclosed herein is an ionic conducting gel that comprises a polymeric adhesive material in an amount of from 5 to 20 wt% of the gel, a metal salt in the amount of from 2 to 10 wt% of the gel, and the balance being a hydrophilic polymeri...
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WO/2024/015165A1 |
Provided herein is a two-component, thermally-conductive acrylic-epoxy adhesive composition.
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WO/2024/010060A1 |
The present invention provides a conductive paste which is capable of increasing bondability and is also capable of increasing conduction reliability.　A conductive paste according to the present invention contains a curable compound, a...
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WO/2024/006425A1 |
Described herein are magnetic adhesive compositions. The adhesive compositions can comprise a curable matrix comprising one or more reactive precursor molecules, and a population of magnetic particles dispersed within the curable matrix....
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WO/2024/006429A1 |
Described herein are shelf-stable adhesive compositions as well as methods of using thereof.
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WO/2024/000448A1 |
The present invention provides silver pastes used for manufacturing a printed antenna, kit-of-parts for preparing a printed antenna for an electronic device comprising three kinds of the silver pastes, use of the silver paste as a via fi...
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WO/2023/248337A1 |
This film comprises: an elongated release film; a plurality of adhesive film strips disposed on the release film; and grooves that are formed on the surface on the side of the plurality of adhesive film strips of the release film, and th...
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WO/2023/241875A1 |
The present invention is directed to a curable and debondable two-part (2K) adhesive composition comprising: i) a first part comprising: (meth)acrylate monomer; co-polymerizable acid; and, an electrolyte; and, ii) a second part comprisin...
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WO/2023/239292A2 |
A high efficiency configuration for a solar cell module comprises solar cells arranged in an overlapping shingled manner and conductively bonded to each other in their overlapping regions to form super cells, which may be arranged to eff...
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WO/2023/234519A1 |
An electronic apparatus according to an embodiment comprises: a display; a housing that includes a base and a sidewall structure disposed on the edges of the base, wherein the sidewall structure includes a support surface for supporting ...
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WO/2023/228729A1 |
This adhesive composition contains a thermoplastic resin (a), a radical-polymerizable compound (b), and a radical polymerization initiator (c). A polyurethane resin (a-1) and a phenoxy resin (a-2) are contained as the thermoplastic resin...
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WO/2023/224174A1 |
The present invention relates to an electrically conductive low-temperature-curable adhesive composition. Specifically, the present invention relates to an electrically conductive thermosetting silicone adhesive composition for LED packa...
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WO/2023/214522A1 |
A laminate 1 comprising a first base material 2, an adhesive film 3 for circuit connection provided on the first base material 2, and a second base material 4 provided on the adhesive film 3, where, when the adhesive strength of the firs...
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WO/2023/204253A1 |
The present disclosure provides: a conductive sheet having a conductive composition which has outstanding metal recycling properties and good adhesive power and conductivity, prevents sticking to protective sheets during storage, and has...
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WO/2023/195398A1 |
An adhesive film for circuit connection comprises: a resin composition containing a thermoplastic resin, a radically polymerizable compound, and a radical polymerization initiator; and conductive particles, wherein a cyclopolymerizable m...
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WO/2023/189000A1 |
This connection structure is suitable for high-density mounting and is obtained by connecting a first electronic component and a second electronic component via conductive particles and an insulating adhesive agent disposed between an el...
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WO/2023/184815A1 |
The present application belongs to the technical field of super-elastic adhesives, and particularly relates to a super-elastic adhesive, a preparation method and the use. The present application provides a super-elastic adhesive, which c...
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WO/2023/188206A1 |
Provided are: a metal sheet bonding agent that has excellent adhesive strength and solder reflow tolerance and that reduces adhesive residues generated during detachment from metal sheets and the like; a reinforcement member that is for ...
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WO/2023/189711A1 |
A connection structure in which an electrode of a first electronic component and an electrode of a second electronic component are aligned so as to face each other, and the first electronic component and the second electronic component a...
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WO/2023/180858A1 |
An adhesive structure includes: an adhesive portion to adhere to a contact object; and a low elastic portion having an elastic modulus lower than an elastic modulus of the adhesive portion. At least one of the adhesive portion and the lo...
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WO/2023/152912A1 |
The present invention addresses the problem of providing an electrically peelable adhesive product which has excellent electrical peelability even under such conditions that the electrically peelable adhesive product is exposed to high t...
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WO/2023/152838A1 |
A member 1 for forming wiring comprises an adhesive layer 10 and a metal layer 20. The adhesive layer 10 is composed of an adhesive composition that contains conductive particles 12, a thermosetting resin, and a maleimide compound. The m...
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WO/2023/153512A1 |
An adhesive film 1 is provided with a release film 2, and an adhesive layer 3 laminated on one surface 2a side of the release film 2. The adhesive layer 3 comprises a body portion 3A, and a strip-shaped micro piece 3B protruding from the...
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WO/2023/152911A1 |
The present invention addresses the problem of providing an electrically peelable pressure-sensitive adhesive product that exhibits excellent electrical peeling properties even under conditions where the product is exposed to high temper...
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WO/2023/152913A1 |
The present invention addresses the problem of providing an electrically removable pressure-sensitive adhesive sheet which is thin and is easy to apply to adherends. The electrically removable pressure-sensitive adhesive sheet comprises ...
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WO/2023/152840A1 |
A member 1 for forming wiring comprises an adhesive layer 10 and a metal layer 20. The adhesive layer 10 is composed of an adhesive composition that contains conductive particles 12 and a thermosetting component. The metal layer 20 is di...
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WO/2023/136501A1 |
An electronic device according to one embodiment comprises: a support member, a battery arranged on the support member, and an adhesive tape a portion of which is arranged to cross an area between the battery and the support member, whil...
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WO/2023/136272A1 |
This adhesive composition contains (A) an epoxy resin, (B) a curing agent, and (C) a film-forming component, wherein component (A) includes more than 90 mass% of an aromatic epoxy resin with respect to the total amount of component (A), ...
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WO/2023/136666A1 |
The present invention relates to an adhesion-strengthening composition capable of providing a positive electrode having excellent scratch resistance and adhesiveness and low interfacial resistance, a current collector comprising same, a ...
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WO/2023/136274A1 |
Provided is an adhesive agent composition containing (A) an epoxy resin and (B) a curing agent, wherein, for the (A) ingredient, a xylene-novolac based glycidyl ether is included. Further provided is an adhesive agent film for circuit co...
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WO/2023/136273A1 |
An adhesive composition comprising (A) an epoxy resin and (B) a curing agent, said adhesive composition containing a multifunctional epoxy resin as the component (A) and a pyridinium salt as the component (B), wherein the pyridinium salt...
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