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WO/1999/040238A2 |
The invention relates to a method for electrically regenerating rhodium solutions, designed especially for regenerating rhodium solutions containing sulphuric acid and/or phosphoric acid or rhodium chloride solutions. The solution to be ...
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WO/1999/034035A2 |
The invention concerns the field of microplasma-electrochemical processing of the surface of metallic objects, and especially the methods and devices for microplasma oxidation of valve metals and their alloys. The invention can be applie...
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WO/1999/031304A1 |
There are provided an electrical contact sensing means for sensing the electrical contact of current feed contacts with a current feed part of a substrate to be plated, and a plating device for forming a plating film with a uniform thick...
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WO/1999/029933A1 |
Defects in metal strips in a continuous electroplating process caused by surface anomalies in the conductor roll are reduced and/or eliminated by spraying a large volume water on the electroplated surface before it contacts the conductor...
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WO1999014401A9 |
A cathode current control system employing a current thief (95) for use in electroplating a wafer (55) is set forth. The current thief (95) comprises a plurality of conductive segments (130) disposed to substantially surround a periphera...
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WO/1999/019544A1 |
A plating system (10) and method are provided for electroplating silicon wafers with copper using an insoluble anode (13) wherein the electrolyte is agitated or preferably circulated through an electroplating tank (11) of the system and ...
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WO/1999/017344A1 |
An apparatus (10) for use in processing a workpiece (W) to fabricate a microelectronic component is set forth. The apparatus comprises a process container (14) having a process fluid (38) therein for processing the workpiece and a workpi...
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WO/1999/016936A1 |
A system for electroplating a semiconductor wafer which comprises a first electrode in electrical contact with the semiconductor wafer (55) and a second electrode. The first electrode and semiconductor wafer (55) form a cathode. The seco...
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WO/1999/010564A2 |
The invention relates to a method and device for regulating the concentration of metal ions in electrolytic fluid for depositing metal using insoluble anodes. Said electrolytic metal also contains compounds of an electrochemically revers...
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WO/1999/010562A2 |
Maintenance of a continuous electroplating plant with a horizontal conveyor track for goods to be treated requires frequent cleaning of the anode baskets which contain soluble anode material consisting of metal which is to be deposited. ...
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WO/1999/010563A2 |
The energy relates to a device and a method for energy saving simultaneous electrolytic treatment of several workpieces connected in the form of electrodes, each having the same electrolysis current. The inventive device comprises at lea...
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WO/1998/045504A1 |
An electroplating method that includes: a) contacting a first substrate (2) with a first electroplating article (4), which includes a support and a conformable mask disposed in a pattern on the support; b) electroplating a first metal fr...
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WO/1998/041676A2 |
A surface-treatment plant, particularly for galvanic treatments, comprises at least one tank (3) for holding a bath (B) for treating the pieces (P) to be treated by immersion therein, and a continuous conveyor device (5) having an active...
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WO/1998/038355A2 |
The invention relates to a method for coating a metal strip with metal, especially for coating a steel strip with zinc or a zinc-nickel compound by means of at least one current-carrying galvanic cell containing an electrolyte, through w...
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WO/1998/038357A1 |
The invention relates to circuitry and a method for supplying electrolytic cells with a pulse current for use in electroplating plants. Two galvano-rectifiers (5,32) and a change-over switch (12) with two respective separate switches (23...
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WO/1998/038356A2 |
The invention relates to a method and device for making layer electrodes. The initial idea is to accurately regulate, at any time of an electrolytic precipitation process, the concentration of electrolytic components and addition agents ...
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WO/1998/038354A2 |
The invention relates to a method for coating a metal strip with metal, especially for coating a steel strip with zinc or a zinc-nickel compound by means of at least one current-carrying galvanic cell containing an electrolyte, through w...
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WO/1998/032901A1 |
The upper part of a sheet-like rectangular product (A) is held and suspended by a jig (2). An engaging claw (6) which engages with an engaging protrusion (4) formed on the top part of the jig (2) is moved horizontally along a cathode bar...
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WO/1998/029581A1 |
The present invention includes an electroforming apparatus (10) and method for continuously adjusting the anode (17)/cathode head (40) distance for controlling uniformity of deposition. The entire cathode head is mounted on a lead screw ...
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WO/1998/028468A1 |
The invention concerns a method for the precise electrolytic deposition and etching of metals into the edge region of circuit boards and conductor foil panels in a continuous system. In continuous systems, the panels are gripped at least...
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WO/1998/000585A1 |
Disclosed is a method for reducing metal acid or salt evolved from electrolytic baths housed in electrolytic tanks during electrolytic operations. This method involves covering all of the surface of the electrolytic bath with a layer of ...
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WO/1997/035051A1 |
An electrolytic process for simultaneously cleaning and metal-coating the surface of a workpiece of an electrically conducting material, which process comprises: (i) providing an electrolytic cell with a cathode comprising the surface of...
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WO/1997/035052A1 |
An electrolytic process for cleaning the surface of a workpiece of an electrically conducting material, which process comprises: i) providing an electrolytic cell with a cathode comprising the surface of the workpiece and an inert anode;...
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WO/1997/035050A1 |
The proposed method of treating surfaces and a suitable device relate to the metallurgical industry and can be used for removing impurities from and/or applying various coatings, including protective coatings, to metal surfaces. The devi...
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WO/1997/027349A1 |
Hexavalent chromium baths are regenerated by a succession of electrochemical and chemical steps in electrolysis apparatus having compartments which are separated by a diaphragm limiting the masse transfer. The treatment is carried out by...
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WO/1997/025456A1 |
A process is disclosed for maintaining a constant concentration of substances in an electroplating bath, preferably a bath with aqueous solutions. According to known processes, substance concentrates are added to the bath to compensate f...
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WO/1997/023665A1 |
A process is disclosed for generating short, cyclically repeated unipolar or bipolar electroplating pulse-shaped currents IG, IE, as well as an electroplating circuitry with which such pulse-shaped currents IG, IE can be generated. Such ...
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WO/1997/021852A1 |
The invention concerns a method of forming an alloy layer, in particular of bronze, on a workpiece surface, in which the surface to be coated is connected as the cathode and is contacted by an adjacent anode via an electrolyte. The objec...
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WO/1997/016866A2 |
A plurality of free-standing spring elements (512) are mounted to a surface (510a) of a carrier substrate (510). The carrier substrate (510) is mounted to a surface (502a) of a semiconductor device (502). Bond pads (504) of the semicondu...
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WO/1997/015704A2 |
The invention concerns an electroplating plant comprising an electroplating container and a supply container between which the electrolyte circulates. In the supply container the metal content of the electrolyte is supplemented by a solu...
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WO/1997/015702A2 |
A device for the chemical or electrolytic surface treatment of plate-like objects takes the form of a flow cell and has first feed elements in the form of tubes with outlet apertures for directing a process fluid onto the objects being t...
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WO/1997/012077A1 |
A method of efficiently and economically discharging solid particles, which settle on a bottom of a vessel, outside the vessel, and an equipment therefor. A liquid is jetted from an injector provided in the vessel to move the settling so...
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WO/1997/011211A1 |
The invention concerns a method of removing, by oxidation at the anode, the acid formed during the deposition of the paint coating in cathodic electro-dip coating, the anodes used being coated with a layer of ruthenium oxide, irridium ox...
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WO/1997/003230A1 |
A fixture assembly (200) for electrolytic plating of a substrate (44) is securable on the hub (204) of a powered rotary drive shaft (206) that is mounted for rotation about a first axis (210) within a plating tank. The fixture assembly i...
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WO/1997/002724A1 |
The invention pertains to a procedure for the rapid and high-precision chemical and electrolytic treatment and scouring of printed circuit boards and films, using a treatment fluid through which the printed circuit boards and films are c...
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WO/1996/038858A2 |
A plurality of contact elements, such as contact bumps or free-standing spring contacts including both monolithic and composite interconnection elements, are mounted to relatively small tile substrates which, in turn, are mounted and con...
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WO/1996/037334A1 |
Interconnection elements for electronic components, exhibiting desirable mechanical characteristics (such as resiliency) for making pressure contacts are formed by using a shaping tool (512) to shape an elongate core element (502) of a s...
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WO/1996/037333A1 |
Interconnection elements (550) for electronic components (556), exhibiting desirable mechanical characteristics (such as resiliency), for making pressure contact(s) are formed by shaping a ribbon-like core element (552) of a soft materia...
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WO/1996/037331A1 |
The efficacy of electrical discharges for severing bond wires (102, 202) and/or for forming balls (234, 236) at the ends of bond wires (including bond wires (202) already severed by alternative mechanisms) is improved by performing the e...
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WO/1996/037332A1 |
Interconnection elements (752) and/or tip structures (770) for interconnection elements (752) may first be fabricated upon sacrificial substrates (702) for subsequent mounting to electronic components (784). In this manner, the electroni...
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WO/1996/037931A1 |
Spring elements (540) for use as electrical contacts are fabricated by shaping a relatively soft core (112, 122) and overcoating the shaped core (702) with a relatively hard material (114, 124). Additional overcoat layers may be applied ...
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WO/1996/034993A1 |
An aluminum-alloy article such as a fastener or rivet (40) is prepared by providing an aluminum-alloy article precursor that is not in its final heat-treated state, and in one form is in its solution treated/annealed state. A curable org...
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WO/1996/024707A1 |
The invention concerns a method and device for galvanizing plate-shaped products (4), in particular printed boards, in horizontal continuous plants through which the products pass in any order. Circulating contacting means are used to co...
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WO/1996/022831A2 |
Apparatus for delivering electromagnetic energy into a solution, comprising: a first tubular housing having closed ends defining a first water-tight chamber; coil means contained within said first chamber; said coil means delivering a ma...
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WO/1996/021341A1 |
The treatment of plate-shaped workpieces (3), in particular circuit boards, with small holes (2) by means of liquid or gaseous agents has been found to be difficult since the fluid flows through the holes (2) only at very low speeds, par...
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WO/1996/017378A1 |
Contact structures exhibiting resilience or compliance for a variety of electronic components are formed by bonding a free end of a wire (502) to a substrate (508), configuring the wire (530) into a wire stem (530) having a springable sh...
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WO/1996/016440A1 |
Interconnection elements (210) for electronic components, exhibiting desirable mechanical characteristics (such as resiliency, for making pressure contacts) are formed by shaping an elongate element (core) (216) of a soft material (such ...
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WO/1996/015551A1 |
Resilient contact structures extend from a top surface of a support substrate and solder-ball (or other suitable) contact structures are disposed on a bottom surface of the support substrate. Interconnection elements (110) are used as th...
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WO/1996/015459A1 |
Resilient contact structures (430) are mounted directly to bond pads (410) on semiconductor dies (402a, 402b), prior to the dies (402a, 402b) being singulated (separated) from a semiconductor wafer. This enables the semiconductor dies (4...
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WO/1996/015458A1 |
A probe card assembly (500) includes a probe card (502), a space transformer (506) having resilient contact structures (probe elements) (524) mounted directly to and extending from terminals (522) on a surface thereof, and an interposer ...
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