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JP2023158573A |
To provide a method capable of manufacturing a steel sheet including a beautiful plating layer and an easily oxidizable element, especially, a high tensile steel sheet without having quality defects such as non-plating and a pickup or th...
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JP2023154913A |
To provide a deposition apparatus of a metallic film with a simpler configuration.A deposition apparatus 1 comprises: an anode 11; a solid electrolyte membrane 13; a power supply unit 14; and an insulating container 15 for covering an ap...
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JP2023148994A |
To provide a mounting stand and a surface treatment device, capable of shortening a treatment time required for surface treatment and improving the accuracy of the surface treatment.The mounting stand for use in surface treatment of an o...
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JP2023147012A |
To provide a plating apparatus for producing an electroformed article having many independent through-holes that enables variations in the thickness of a plating layer formed on a surface to be plated of an electroforming matrix, that is...
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JP7358238B2 |
The disclosure provides a method comprising inducing a first current between a source of a countercharge and a first electrode, the first current being through an electrolyte. A second current is induced across the first electrode, the s...
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JP7358251B2 |
A plating support system is provided and includes a simulator that predicts an in-plane uniformity value of a plating film formed on a substrate based on assumed conditions for an electroplating treatment of the substrate; a numerical an...
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JP7357824B1 |
A plurality of bumps are formed on a substrate at uniform heights. A plating apparatus is provided for forming bumps on a substrate. The plating apparatus includes a substrate holder configured to hold the substrate, a plating tank confi...
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JP2023143281A |
To provide a leaked liquid suppression seal mechanism for suppressing the leakage amount of a treatment liquid from a vertically long slit part of a treatment tank, which can greatly reduce the leakage amount outside the tank and can smo...
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JP2023139630A |
To provide a deposition method in which an air residue between a porous film and a workpiece can be prevented, and the film deposition quality is improved.A deposition method includes: a porous film wetting step for wetting a porous film...
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JP7356368B2 |
An aspect of the disclosure provides a substrate drying apparatus. The substrate drying apparatus includes: a gripping part, gripping an outer periphery part of a substrate that is square; a substrate nozzle, ejecting gas to the substrat...
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JP7356047B2 |
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JP7355566B2 |
To provide: a pretreatment tank and pretreatment method for a plating treatment that can suppress defects; a plating treatment tank and plating treatment method that can suppress the dispersion of a plating solution; and a plating appara...
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JP7354484B1 |
To provide a technology that can improve the stirring power of a plating solution using a paddle. The plating apparatus 1000 is arranged between the anode 11 and the substrate Wf, and is configured to stir the plating solution Ps by reci...
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JP2023540836A |
An electroplating system according to embodiments of the present technology can include a plating chamber configured to deposit a metal material onto a substrate disposed within the plating chamber. The plating chamber can include a roto...
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JP2023133728A |
To provide a plating current shielding jig capable of improving controllability of a thickness of a plating film formed on a surface of a plated material.A plating current shielding jib 2 comprises a first plate 31 and a projection membe...
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JP2023540838A |
A method of controlling a headroom voltage of a transistor stage of an electroplating system to maintain target power dissipation across the transistor stage may include maintaining a headroom voltage of the transistor stage for a load o...
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JP2023540837A |
The electroplating system can include an electroplating chamber. The system can further include a replenishment assembly fluidly coupled to the electroplating chamber. The supply assembly can include a first compartment containing anode ...
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JP7346738B2 |
An electroplated cobalt deposit and a method of electrodepositing cobalt on a surface to produce a level deposit across the surface of the substrate. The cobalt electrolyte contains (1) a source of cobalt ions; (2) boric acid; (3) a pH a...
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JP7340795B1 |
[assignment]To provide a portable chrome plating solution purification device that does not require large-scale installation space or piping work, and can process a large amount of chrome plating solution. A portable refining apparatus 1...
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JP7340719B1 |
[assignment]Provided are a substrate condition measuring device, a plating device, and a substrate condition measuring method for measuring the condition of a substrate as a plating target. In a substrate condition measuring device, a co...
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JP2023120930A |
To efficiently perform a prescribed electrolytic treatment to an object to be treated using ions to be treated in a treatment solution.A direct electrode 20 and a counter electrode 22 are arranged in a plating solution M, and an indirect...
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JP2023536273A |
The present invention relates to a method for forming a multidimensional structure comprising the steps of providing electrodes and substrates in a fluid, the fluid comprising an electrolyte and a precursor agent dispersed therein; apply...
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JP7329268B2 |
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JP2023112036A |
To provide aspects that involve electrochemistry, and particularly materials bonding, surface repair, electroplating, corrosion and electrocatalysis.The disclosure provides a method comprising inducing a first current between a source of...
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JP7322678B2 |
To provide a method of producing a copper-clad laminate having an intended rate of dimensional change.A copper clad laminate 1 is obtained by forming a copper plating film 20 on the surface of a substrate 10 by alternately carrying out e...
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JP2023109175A |
To provide a system and method for plating a workpiece.In one aspect, an apparatus includes a deposition chamber, a workpiece holder adapted for insertion into and removal from the deposition chamber, a shield with patterns of apertures ...
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JP7321369B2 |
The invention relates to a distribution body for a process fluid for chemical and/or electrolytic surface treatment of a substrate, a distribution system for chemical and/or electrolytic surface treatment of a substrate in a process flui...
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JP7318620B2 |
It is determined whether an imaginary component at a predetermined frequency of an alternating current impedance is equal to or more than a preliminarily set film-formable value or not. The metallic coating is formed in a state where the...
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JP2023532355A |
In order to provide an apparatus and method for processing workpieces that allows for optimal workpiece processing, a processing station includes a fluid-injectable processing chamber for workpiece processing. [Selection drawing] Fig. 6
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JP7314658B2 |
What is provided is stannous oxide having an α-ray emission amount of 0.002 cph/cm2 or less after heating in an atmosphere at 100° C. for 6 hours. Tin containing lead as an impurity is dissolved in a sulfuric acid aqueous solution to p...
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JP2023101913A |
To provide a simple-structured plating hanger capable of efficiently carrying out plating, with its conductive hooks being easily repairable and exchangeable and the attitude and position of each conductive hook being easily adjustable.A...
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JP2023102109A |
To provide a film deposition device of a metal coating, capable of suppressing the deterioration of film deposition quality by avoiding the dissolving of an undercoat layer of a substrate.A film deposition device 1 comprises: an anode 11...
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JP7307628B2 |
To provide a method capable of detecting a trouble in an electrolytic copper plating jig without complicated work.A method for detecting a trouble in a plating jig including a clip part joined in an electrically connectable manner to a l...
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JP2023097530A |
To provide a deposition apparatus and a deposition method that can suppress evaporation of a plating solution adhered to a polymer electrolyte.A deposition apparatus 1 is an apparatus for depositing a metallic film derived from metallic ...
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JP2023098121A |
To improve uniformity of plating thickness in a plating apparatus.A plating apparatus is provided for plating a substrate by passing an electric current from an anode to the substrate. The plating apparatus comprises a plurality of anode...
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JP7305075B1 |
Kind Code: A1 A potential sensor capable of accurately confirming the flatness of a plating film thickness in a plating apparatus is provided. A plating apparatus includes a plating tank for containing a plating solution, a substrate hol...
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JP2023095052A |
To provide a plating apparatus which can determine the acceleration in the time of the inappropriate deceleration of a conveyance device that may cause contact between a substrate holder and a processing tank, a control method of the pla...
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JP7304492B2 |
A flexible printed wiring board according to an aspect of the present disclosure is a flexible printed wiring board including a base film and a plurality of wiring lines disposed on a front surface of the base film. Each of the wiring li...
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JP2023091220A |
To provide a deposition apparatus that can easily separate an electrolyte membrane from a substrate while preventing the electrolyte membrane from stretching after the deposition of a metallic film.A control device 60 of a deposition app...
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JP2023090542A |
To provide a film forming apparatus with which after a metal film is formed, an electrolyte film can be easily separated from a base material while suppressing the elongation of the electrolyte film.A control device 60 of a film forming ...
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JP2023089291A |
To provide a substrate with vias or a silicon wafer with vias that can uniform the height of tin-based bumps after reflow with less recess depth on the top face of a plating film formed in the multiple vias on the substrate or the silico...
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JP7299025B2 |
The invention relates to a method for plating a recess in a substrate, a device for plating a recess in a substrate and a system for plating a recess in a substrate comprising the device. The method for plating a recess in a substrate co...
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JP2023088400A |
To provide an apparatus for film deposition of a metal coating capable of improving the film deposition quality by suppressing evaporation of an electrolyte solution sticking to an electrolyte film.A film deposition apparatus 1A comprise...
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JP7293765B2 |
To provide a plating apparatus capable of suppressing a variation in thickness of a plating layer formed on a surface of a base material as compared with a case where a current output from a power supply to a metal is controlled.The plat...
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JP2023084863A |
To provide a metal coating film deposition apparatus that improves the film quality by supplying an additive to an electrolytic solution.A film deposition apparatus 1A includes: an anode 11; a solid electrolyte membrane 13 arranged betwe...
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JP7295354B1 |
To prevent the central part of a paddle from sagging in a cup-type plating apparatus. A plating bath 410 for containing a plating solution, an anode arranged in the plating bath 410, a substrate holder configured to hold the substrate Wf...
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JP2023084362A |
To provide a metal film forming apparatus that can suppress the occurrence of defective film formation of a metal film.The anode 11 of a metal film forming apparatus 1 of the invention is made of the same metal as the metal film and is s...
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JP7292919B2 |
To provide a substrate processing device capable of supplying power to an electric component rotating together with a rotating table and transmitting/receiving a signal and the like without adversely affecting the rotation of the rotatin...
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JP2023525892A |
A device for transporting a plurality of parts to be processed through the apparatus for wet chemical processing is a transporter (16), along at least one trajectory (5a, 5b) in a first direction (x). It comprises a transporter (16) comp...
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JP7291911B2 |
To provide a method for estimating the concentration of an additive in a nickel electroplating solution.The electrochemical measurement of a nickel electroplating solution as the object for measurement is performed, and, using at least o...
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