| Document |
Document Title |
|
JP2023082897A |
To provide an apparatus for depositing a metal film that can suppress the occurrence of film formation defects in a metal film.A film deposition apparatus 1 includes an anode 11, an electrolyte membrane 13 placed between the anode 11 and...
|
|
JP7291223B2 |
The present invention provides a method for producing an aqueous tin methanesulfonate solution by dissolving tin (II) oxide in an aqueous methanesulfonic acid solution, wherein if A is the number of moles of the tin (II) oxide and B is t...
|
|
JP2023082465A |
To provide a metal film deposition apparatus that suppresses the occurrence of appearance defects in a metal film and improves the film deposition quality.A film deposition apparatus 1A includes an anode 11, a solid electrolyte membrane ...
|
|
JP2023524809A |
Kind Code: A1 Apparatus, systems, and methods are disclosed for electroplating cobalt, nickel, and alloys thereof in interconnect features of partially or fully processed electronic devices. During electroplating, cobalt, nickel, or thei...
|
|
JP2023078512A |
To provide an analysis method and an analysis device for plating solution that can process data associated with a precipitation pattern obtained from a plating solution to analyze a state of the plating solution quantitatively under iden...
|
|
JP7284938B2 |
To provide a removing method capable of efficiently removing an electrode surface deposit containing a lead compound adhering to a surface of an electrolysis electrode by electrolytic copper foil production or electrolysis in industrial ...
|
|
JP7285389B1 |
To improve the in-plane uniformity of a film plated on a polygonal substrate. The plating apparatus includes a plating bath, a substrate holder configured to hold a polygonal substrate, an anode arranged in the plating bath so as to face...
|
|
JP2023075905A |
To provide a metallic body, a formation method of the metallic body, and a mating type connection terminal comprising the metallic body, in which the metallic body can be formed in a short time while occurrence of a whisker due to an ext...
|
|
JP2023522576A |
The present invention discloses a plating apparatus and plating method for depositing metal on a substrate having a pattern structure. In one embodiment, a plating apparatus includes a plating bath configured to contain an electrolyte, a...
|
|
JP7282136B2 |
To provide: a palladium plating solution and a palladium plating solution replenisher which enable thick palladium plating.A palladium plating solution and a palladium plating solution replenisher contain a soluble palladium salt, an ele...
|
|
JP7279273B1 |
A plating apparatus capable of detecting the film thickness of a plating film formed on a substrate during plating is proposed. The plating apparatus includes a plating tank, a substrate holder for holding a substrate, an anode arranged ...
|
|
JP7276049B2 |
To decrease the depth of recesses present on an upper face of a plating film formed in a plurality of vias present on a substrate or on a silicone wafer, and to make the height of tin-based bumps after reflow uniform.The plating method i...
|
|
JP2023069447A |
To improve detection accuracy of anomalies of various devices and/or advance the timing of the anomaly detection.A plating apparatus for plating a substrate comprises: an anode arranged so as to face the substrate; an electric field adju...
|
|
JP7273366B2 |
To provide a copper-clad laminate plate capable of controlling an amount of apparent deflection.A copper-clad laminate plate 1 is configured to comprise a base film 11, a metal layer 12 directly superposed on the base film, and a copper ...
|
|
JP2023064297A |
To provide a metal film deposition method capable of forming a homogeneous metal film with a uniform film thickness.In a film deposition method, firstly, with a substrate W placed on a lifting device 14 and a permeable membrane 13 separa...
|
|
JP2023063249A |
To provide a surface treatment apparatus and a membrane protection member capable of preventing breakage of an ion conductive membrane.An apparatus of the invention includes: a housing which is arranged opposite to an object to be treate...
|
|
JP2023518573A |
The present invention relates to a method for chemical and/or electrolytic surface treatment of substrates in a process station and to a process station for chemical and/or electrolytic surface treatment of substrates. Methods for chemic...
|
|
JP2023062067A |
A system for chemical and/or electrolytic surface treatment of substrates in process fluids, a device for chemical and/or electrolytic surface treatment of substrates in process fluids, and a chemical and/or electrolytic surface treatmen...
|
|
JP2023059748A |
To provide a deposition apparatus 1 of a metallic film F that suppresses the occurrence of irregularities on the surface of the metallic film F and improves the quality of deposition.A deposition apparatus 1 comprises: an anode 11; a sol...
|
|
JP2023058843A |
To provide a copper-clad laminate with excellent fracture resistance and a method for producing the copper-clad laminate.A copper-clad laminate 1 comprises a base material 10, and a copper plating film 20 formed on a surface of the base ...
|
|
JP2023058770A |
To provide a film-formation device and a film-formation method which suppress accumulation of an electrolytic solution between a solid electrolyte membrane and a base material, and thereby can form a homogeneous metal film.A film-formati...
|
|
JP2023058774A |
To provide a film-formation device of a metal film which can reduce occurrence of discoloration or deterioration of a metal film caused by dryness of an electrolytic solution remaining on the surface of a film-formed metal film, and a fi...
|
|
JP2023057600A |
To provide a device of recovering flammable gas, that can prevent deterioration of a facility and is excellent in safety.The device of recovering flammable gas comprises a recovery chamber recovering flammable gas generated from a source...
|
|
JP7263078B2 |
To improve accuracy for the control of a substrate temperature in substrate processing in which the substrate is processed while being held on a rotary table.A substrate processing apparatus includes: a rotation driving mechanism configu...
|
|
JP7260337B2 |
To provide an electroplating current control method capable of realizing a desired amount.A electroplating current control method is an electroplating current control method for controlling a supply current to an electroplating facility ...
|
|
JP7257742B2 |
To provide a cleaning apparatus capable of measuring the thickness of a plating film even on a substrate having large warpage.A cleaning apparatus 50 that cleans a substrate W1 includes a horizontal transport mechanism 102 that supports ...
|
|
JP7256708B2 |
There is provided an apparatus for plating a substrate as an object to be plated. The apparatus comprises an anode and a thief tunnel arranged to be located between the substrate and the anode when the substrate is placed to be opposed t...
|
|
JP7253125B1 |
The plating apparatus includes a plating bath configured to contain a plating solution, a substrate holder configured to hold a substrate to be plated, a rotation mechanism for rotating the substrate holder, and the substrate A lifting m...
|
|
JP7250999B2 |
The invention relates to a distribution system for a process fluid for chemical and/or electrolytic surface treatment of a substrate, a device for chemical and/or electrolytic surface treatment of a substrate in a process fluid, a use of...
|
|
JP2023512815A |
An electrode for a device (1) for electrolytically treating a work piece (3), the device (1) moving the work piece (3) such that the surface to be treated passes the surface of the electrode. of the type arranged to convey to and directe...
|
|
JP7244408B2 |
There is provided a substrate holder. The substrate holder comprises a contact assembly; a first plate configured to hold a substrate between the contact assembly and the first plate; at least one first pin fixed to the contact assembly,...
|
|
JP7242516B2 |
There is provided a substrate holder configured to hold a substrate, the substrate holder comprising: a first holding member; and a second holding member configured to hold the substrate between the first holding member and the second ho...
|
|
JP2023510776A |
A method for electroplating metal into electronic device features partially fabricated on a substrate having high open area portions is provided. The method includes the steps of initiating a bulk electrofill phase with a high level curr...
|
|
JP2023510255A |
A system for printing metal traces on a substrate includes an anode substrate. A plurality of anodes are disposed on one side of the anode substrate with a first predetermined gap between adjacent ones of the plurality of anodes. A first...
|
|
JP2023510024A |
The present disclosure provides a distribution system for a processing fluid for chemical and/or electrolytic surface treatment of a rotatable substrate, an electrochemical deposition system for chemical and/or electrolytic surface treat...
|
|
JP7236783B2 |
A surface treatment device has treatment tanks (100A, 100B) in which a treatment liquid is stored, positive electrodes (142, 152) positioned in the treatment tanks, a jig (10) for hanging and retaining a workpiece (W) and setting the wor...
|
|
JP2023030837A |
To provide a metallic component (such as a terminal and an electronic contact) being low cost and realizing the improvement of high conductivity, wear resistance and heat resistance as a component (such as an onboard terminal and an elec...
|
|
JP7235012B2 |
To provide a plating apparatus and a plating method capable of suppressing damage to a plating object.A plating apparatus comprises: a plating bath 10 for storing a plating solution 15; a first electrode 20 having a mounting surface 21 o...
|
|
JP7233991B2 |
There are provided a composite plated product, which has little uneven appearance and good wear resistance, and a method for producing the same without the need of any cyanide-containing silver-plating solutions and any silver-plating so...
|
|
JP7233588B1 |
A plating apparatus capable of improving the uniformity of a plating film formed on a substrate is proposed. A plating apparatus includes: a first potential sensor arranged at a first position in a region between a substrate held by a su...
|
|
JP2023026839A |
To form a plating film that is more uniform than in the prior art.A plating film is formed on at least a part of the surface of an object, using multiple anodes (12) which are individually current-controlled while facing an object (X) im...
|
|
JP7231780B1 |
An object of the present invention is to achieve space saving when performing a plurality of types of plating. A plating apparatus includes a plating work section in which at least a pair of plating units including a rotary table section...
|
|
JP7229690B2 |
A system 10 for chemical and/or electrolytic surface treatment of a substrate 30 in a process fluid, a device for chemical and/or electrolytic surface treatment of a substrate in a process fluid, and a method for chemical and/or electrol...
|
|
JP2023507479A |
The present invention is a method of depositing a zinc-nickel alloy on a substrate comprising the steps of: (a) providing a substrate; (b) providing a zinc-nickel aqueous deposition bath as catholyte in the deposition compartment, wherei...
|
|
JP2023507515A |
The present invention is a method for reducing the concentration of iron ions in a trivalent chromium electroplating bath, comprising: (i) (a) trivalent chromium ions; and (b) a trivalent chromium electroplating bath containing iron ions...
|
|
JP7226716B2 |
To provide an ozone treatment system of a plating washing process having excellent water cleaning ability and free from persistency after administration.An ozone treatment system comprises: a washing tank (WT) for washing an article (20)...
|
|
JP2023023068A |
To provide a workpiece holding jig having conduction paths, which are insulated from each other and connected to both sides of a workpiece with low resistance, and a surface treatment apparatus.A workpiece holding jig includes: a holding...
|
|
JP7221004B2 |
Exemplary substrate locking system, device, apparatus and method for chemical and/or electrolytic surface treatment of a substrate in a process fluid can be provided. For example, it is possible to provide a first element, a second eleme...
|
|
JP2023505619A |
The present invention provides a distribution system for processing fluids for chemical and/or electrolytic surface treatment of substrates, a distribution method for processing fluids for chemical and/or electrolytic surface treatment o...
|
|
JP7219239B2 |
A paddle capable of reducing an influence of blocking the electric field and capable of improving its mechanical strength is disclosed. The paddle, which is configured to agitate a processing liquid in a processing tank by moving in the ...
|
