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JP7469289B2 |
A microporous plating solution characterized by containing nonconductive particles and polyaluminum chloride allows for easy preparation of positively charged nonconductive particles and is highly stable. Then, a method for performing mi...
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JP2024053901A |
[Problem] A composite material in which a composite film containing carbon particles in the silver layer is formed on a material, which has excellent wear resistance and prevents silver from falling off from the composite film (AgC layer...
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JP7467782B1 |
To suppress the occurrence of plating defects caused by air bubbles generated from the anode, and to simplify the structure related to the supply of plating solution. The plating module 400 includes a plating tank 410 for accommodating a...
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JP2024516407A |
The present invention relates to a device for coating components or semi-finished products with a chromium layer, in which an anode is present and which is suitable for receiving cathodically connected components. The device comprises an...
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JP7463609B1 |
An object of the present invention is to provide a plating apparatus and a plating method that can appropriately plate an object while suppressing splashing of a plating solution. [Solution] A plating apparatus 10 performs electrolytic p...
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JP7462125B1 |
Disturbances in the electric field formed between the anode and the substrate are detected. The plating apparatus 10 includes a plating tank 50 for accommodating a plating solution Q, an anode 21 disposed in the plating tank 50, and a su...
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JP7460504B2 |
A plating apparatus including a thief electrode that can be suitably maintained is provided. The plating apparatus includes a substrate holder holding a substrate, a thief electrode supporter supporting a thief electrode to be disposed o...
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JP7458877B2 |
To provide an efficient predetermined electrolytic treatment with respect to a semiconductor substrate by using treated ions in a treatment liquid.An electrolytic treatment method comprises: a first step (S1) of forming, on a semiconduct...
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JP7458952B2 |
To provide a method and an apparatus for manufacturing a rod capable of improving the plating quality of the rod.A manufacturing method of a rod 10 for plating the rod 10 is provided in which a partition wall 142 is arranged around the r...
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JP7455608B2 |
There is provided a cleaning method and a cleaning apparatus capable of removing dirt on electrical contacts, the dirt being unable to be removed with deionized water, without adversely affecting a plating solution and a substrate holder...
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JP2024512159A |
Embodiments of the present disclosure generally relate to apparatus and methods for process fluid verification and reuse. The apparatus generally includes a tool for performing lithography and a recirculation path connected to the tool. ...
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JP7450563B2 |
To provide a technique capable of applying plating to a lead frame exposed from an encapsulation resin of a semiconductor device, at a high speed with small thickness variations.There is provided a semiconductor production device compris...
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JP2024033558A |
The present invention provides an electronic component manufacturing apparatus that can perform plating to a desired thickness while suppressing the occurrence of cracks, and can reduce costs. An electronic component manufacturing appara...
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JP7447327B2 |
To provide a substrate processing device capable of supplying power to an electric component rotating together with a rotating table and transmitting/receiving a signal and the like without adversely affecting the rotation of the rotatin...
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JP2024510411A |
The present invention provides a first electrode of the current generator and a second electrode opposite the first electrode connected to the electrolyte medium via the electrode (3) of the metal part (1) to be treated. Electrodepositio...
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JP2024027776A |
An object of the present invention is to provide an apparatus and method capable of chemical conversion treatment of aluminum materials while efficiently and easily removing chemical conversion sludge. [Solution] A chemical conversion tr...
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JP7441023B2 |
To suppress the cost of treating a washing rear liquid (waste water) generated by a washing treatment in a washing tank, by efficiently carrying out a rinse treatment (rinsing treatment) of a metal material after surface treatment to sup...
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JP2024509312A |
The present invention relates to a method for effectively removing ferric ions contained in an iron electroplating solution, and the present invention relates to a method for effectively removing ferric ions contained in an iron electrop...
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JP2024027061A |
A small plating apparatus is required to treat harmful gases generated during plating and plating solution purification steps, and to recover metal ions dissolved from a base material in the plating solution. [Solution] Harmful gases are...
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JP7440571B2 |
A plating apparatus for plating a substrate, the plating apparatus comprising: an anode that is disposed facing the substrate; and an intermediate mask that is disposed on the substrate side between the substrate and the anode, has a fir...
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JP7436997B2 |
A method for preparing a filling material includes: dissolving FeCl3·6H2O and an imprinted molecule in water to form a reaction solution; adding DMF to the reaction solution and stirring for dissolution; adding BDC to the reaction solut...
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JP2024023008A |
An information processing device is provided that makes it possible to appropriately predict the vibration characteristics of a paddle depending on the operating state of a substrate plating apparatus. [Solution] An information processin...
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JP7435187B2 |
To provide a quantitative liquid supply device having no flow fluctuation.A quantitative liquid supply device (electrolytic liquid supply device 20) includes: a supply chamber 22 into which a liquid (electrolytic liquid) flowing from an ...
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JP7434653B1 |
A device for assisting in stirring a liquid phase is provided. A device 500 includes a frame 51 having a bottom portion and a side wall forming an angle with the bottom portion, and a first flexible film 54 that is attached to the frame ...
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JP2024505683A |
In one embodiment of the present invention, an electrolytic plating apparatus and an electrolytic plating method are disclosed. The electrolytic plating apparatus includes a plurality of paddles arranged in parallel. The paddle moves in ...
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JP2024504514A |
An electroplating device and an electroplating method. The electroplating apparatus includes an electroplating unit for electroplating production plates. The electroplating unit includes an electrolyte passage for thermally spraying an e...
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JP7421366B2 |
Provided is a maintenance member or the like capable of easily maintaining an electric contact in a substrate holder. It relates to a maintenance member to maintain a substrate holder including an electric contact configured to supply po...
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JP7415813B2 |
To provide a copper-clad laminate having few pinholes of a copper plated film.A copper-clad laminate comprises a base film, a copper thin film layer formed directly or via a base metal layer on the surface of the base film, and a copper ...
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JP7416020B2 |
To surely detect spark generation that causes a spark flaw, in a metal body processing line.The spark detection device is made suitable for a metal body processing line. The spark detection device comprises a current signal acquiring uni...
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JP2024005526A |
[Problem] It is possible to easily provide information that can be used as judgment material for test results of plating tests. An image comparison system 300 includes an acquisition unit 111 that acquires a surface condition image of a ...
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JP2024501411A |
A method for recovering metals from a chemical bath (100) for chemically treating structures with metals, wherein the method includes transferring a chemical composition containing metals from the chemical bath (100) to a membrane distil...
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JP7409151B2 |
To provide a manufacturing method of a copper-clad laminate capable of providing a copper-clad laminate with less warps.A copper-clad laminate is obtained by depositing a copper plating film on one side of a substrate 10 while the substr...
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JP7409150B2 |
To provide a manufacturing method of a copper-clad laminate capable of providing a copper-clad laminate with less warps.A copper-clad laminate is obtained by depositing a copper plating film on one side of a substrate 10 while the substr...
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JP7406872B1 |
A trivalent chromium plating device for cylinders that uses a trivalent chromium plating solution to perform trivalent chromium plating with good deposition, uniformity, and excellent printing durability without the occurrence of undepos...
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JP2023553748A |
The present invention relates to an electroplating composition for plating a chromium film on a substrate, comprising: (i) a source of hexavalent chromium; (ii) one or more betaines containing quaternary nitrogen and/or and (iii) one or ...
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JP2023553742A |
A cup-shaped chuck for a substrate holding device is disclosed. The cup-type chuck has an inner pressure ring, a middle frame, a seal, an outer pressure ring, and a contact ring. The inner pressure ring is fixed to the inner peripheral s...
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JP2023180832A |
To provide a plating apparatus and a plating method capable of maintaining proper posture even with respect to a large substrate and obtaining a uniform film.A plating apparatus of the present invention for plating at least one main surf...
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JP7399258B2 |
A plating apparatus 1 includes a substrate holder 10, a first electrode, a second electrode and a voltage applying unit 30. The substrate holder 10 is configured to hold a substrate. The first electrode is electrically connected to the s...
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JP7399365B1 |
To efficiently remove air bubbles throughout a resistor. A plating tank 410 configured to contain a plating solution, a substrate holder 440 configured to hold a substrate Wf with the surface to be plated facing downward, and an anode 43...
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JP7398292B2 |
There is provided a method of plating comprising: a process of bringing a sealing portion of a seal provided to prevent a contact of a substrate holder that holds a substrate from coming into contact with a plating solution, into contact...
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JP7395012B2 |
This application relates to a filtering mechanism (1) and a device for producing a conductive material (8), where the filtering mechanism (1) includes a filtering body (11), a cover (12), and a supporting member (13). The filtering body ...
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JP2023551491A |
The present invention discloses a plating apparatus. The plating device has multiple electrodes. The plurality of electrodes includes a main electrode and at least two second electrodes. The main electrode and at least two second electro...
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JP2023173163A |
To provide an electroplating apparatus 2 suitable for producing a plated wire with a homogeneous plated layer at a low cost.An electroplating apparatus 2 has a tank 18, an outer pipe 20, and a pipe electrode 22. The pipe electrode 22 has...
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JP7393067B1 |
[Issue] Materials that can replace noble metal electrodes and non-noble metal electrodes with low manufacturing costs are used in water electrolysis reactions, have high catalytic activity, and are highly durable to maintain high catalyt...
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JP2023168652A |
To provide an electrolytic gold plating solution having a long lifespan without toxicity, in which plating can be performed with the solution temperature of 35°C or lower and the plating film can uniformly be electrodeposited with excel...
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JP2023167900A |
To provide a technique capable of forming a plating film of excellent in-plane thickness uniformity, regardless of a size and a shape of a treating object.An electrolytic plating device 1 comprises: a plating tank for storing a plating s...
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JP7383441B2 |
A surface treatment device includes at least one paddle in a plate shape, in a surface treatment tank, for stirring a surface treatment solution near a substrate by reciprocally moving the paddle with respect to the substrate. The paddle...
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JP7373615B2 |
One object of the present disclosure is to suppress or prevent a plating solution from entering a sealed space of a substrate holder and to detect entry of the plating solution promptly. There is provided a substrate holder configured to...
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JP7373684B1 |
The present invention determines appropriate control parameters for forming plating with high film thickness flatness on a substrate. [Solution] A plating apparatus includes an estimating unit that estimates a current density flowing thr...
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JP2023158843A |
To provide a method of stably producing an alkaline zinc-based plated film.The method of producing a zinc-based plated film according to the present invention, includes dissolving a metal ingot including zinc using an alkaline electrolyt...
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