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JP4524633B2 |
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JP4527956B2 |
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JP4524643B2 |
This wafer polishing apparatus includes: a polishing plate having a polishing pad; a carrier plate which is placed facing the polishing pad and which slides and presses wafers against the polishing pad, while rotating in a state of holdi...
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JP2010172993A |
To provide a workpiece cutting method and a wire saw which can cut out wafers (slices) from a workpiece in a more efficient and smooth manner.The workpiece cutting method comprises steps for pressing a workpiece 28 against a cutting wire...
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JP3161915U |
To provide a polishing apparatus capable of suppressing scattering of a grinding liquid and improving a polishing effect. The grinding fluid supply means, the air supply means, and the ejection means 40 having a flow path 41 and an air m...
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JP2010167551A |
To recycle a used polishing slurry having cleaning water mixed therein and solve the problem of waste fluid disposal.The method for regenerating the used slurry includes a step of selectively separating and removing a polishing slurry co...
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JP4511801B2 |
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JP4507141B2 |
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JP4508355B2 |
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JP4493094B2 |
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JP4486774B2 |
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JP4485536B2 |
Methods and apparatuses for removing material from a microfeature workpiece are disclosed. In one embodiment, the microfeature workpiece is contacted with a polishing surface of a polishing medium, and is placed in electrical communicati...
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JP4486870B2 |
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JP2010131728A |
To restrain large abrasive grains from being included in polishing slurry and restrain the density of the abrasive grains in the polishing slurry from changing while the polishing slurry is held. A semiconductor manufacturing apparatus i...
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JP4472391B2 |
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JP2010115719A |
To enable automatic recovery of filtrating performance and filtration stable for a long time in a method for oscillating filtration.In this method for oscillating filtration, a liquid 3 to be filtrated is supplied to an oscillated filter...
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JP4466312B2 |
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JP4456308B2 |
An apparatus for feeding slurry to an external device. The apparatus includes a preparation tank for preparing the slurry. A circulation pipe is connected to the preparation tank to circulate the slurry. A feeding pipe is connected betwe...
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JP4457515B2 |
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JP4457444B2 |
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JP2010089180A |
To consistently and constantly feed polishing slurry not including any bubble, and to stably operate a centrifugal pump by separating bubbles from the polishing slurry even if bubbles are mixed in the polishing slurry, in a polishing slu...
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JP4449277B2 |
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JP4450225B2 |
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JP4449185B2 |
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JP2010076067A |
To provide a grinding fluid feeder capable of enhancing the treatment capacity of used grinding fluid, enhancing the foreign matters collection ratio, and suitably maintaining the purity of the grinding fluid to be fed to working machine...
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JP4448435B2 |
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JP4442722B2 |
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JP4431858B2 |
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JP4421100B2 |
The heat exchanger (30) of the present invention is capable of easily adjusting temperature of a machining liquid, e.g., slurry, etching liquid. The heat exchanger (30) of the present invention, which adjusts temperature of the machining...
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JP4416867B2 |
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JP4414364B2 |
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JP4409539B2 |
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JP2010017835A |
To provide a processing liquid cleaning device which easily cleans a processing liquid, and which a circulation mechanism for separation is easily attached to.The processing liquid cleaning device is provided with a circulation mechanism...
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JP4404391B2 |
A system (1) to dispense an aqueous solution to at least one point of use (2), the system comprising a device (3) to dispense the aqueous solution to the at least one point of use (2), the device (3) having at least one pressure vessel (...
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JP4405805B2 |
An abrasive article is described. The article is suitable for the deposition and mechanical polishing of a conductive material, and comprises: a polishing layer having a textured surface comprising a binder and a second surface opposite ...
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JP4400096B2 |
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JPWO2008020507A1 |
The purpose is to effectively remove small-diameter foreign substances and large-diameter foreign substances mixed by polishing from the abrasive slurry waste liquid and recover the abrasive. A high-pressure jet disperser that causes the...
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JP4391715B2 |
The invention provides a system for polishing one or more layers of a multi-layer substrate that includes a first metal layer and a second layer comprising (i) a liquid carrier, (ii) at least one oxidizing agent, (iii) at least one polis...
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JP4389002B2 |
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JP4387361B2 |
A multi-wire saw for cutting a workpiece (3) while supplying a slurry (7) containing abrasive grains to a wire (5) traveling between a plurality of rollers (24,27), whereby a slurry supply mechanism (8E,8F) having a holding portion (53,5...
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JP4383149B2 |
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JP2009285799A |
To reduce the cost of cutting fluid without degrading the function of cutting fluid that is the cooling function of a cutting blade and the function as a lubricant at a contact part between the cutting blade with a wafer in a cutting dev...
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JP4377674B2 |
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JP4374794B2 |
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JP4372010B2 |
A flow control system (200) comprises a substantially rigid vessel (210) having first and second ends, the first end of the rigid vessel (210) having an inlet (114) and an outlet (116), a process fluid reservoir situated in the rigid ves...
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JP2009269161A |
To provide a slurry separating material having high separating precision of particles included in a slurry and a long service life with hard-to-clog properties.The slurry separating material is a three-dimensional network structure porou...
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JP4367887B2 |
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JP4368495B2 |
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JP4369095B2 |
A slurry recycling method comprising the steps of: separating a spent slurry containing silicon dust resulting from slicing of a silicon ingot in the presence of a slurry composed of abrasive grains and a dispersion medium in which the a...
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JP4366627B2 |
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