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JP6239489B2 |
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JP6233296B2 |
An evaluation method of abrasive grains used in an ingot-cutting slurry includes: an evaluation solution preparation step in which abrasive grains including polishing grains and impurities are dissolved in a solvent to prepare an evaluat...
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JP6228032B2 |
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JP6221579B2 |
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JP2017177303A |
To provide a substrate polishing device that can inhibit polishing liquid from aggregating inside piping, and to provide a method for cleaning the same and a device for supplying liquid to a substrate polishing device.The substrate polis...
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JP6206388B2 |
The present invention is method for polishing silicon wafer, the method including recovering used slurry containing polishing abrasive grains that have been supplied to the silicon wafer and used for polishing, and circulating and supply...
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JP6204506B2 |
Provided is a regenerating method for used polishing slurry that can sufficiently crush solid content generated by way of centrifugal separation of used polishing slurry, and can thereby suppress damage from occurring to a glass substrat...
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JP6197752B2 |
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JP6198438B2 |
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JP6192778B2 |
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JP6190473B2 |
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JP6172030B2 |
The present invention is a method for slicing a workpiece, including: forming a wire row by a wire spirally wound between a plurality of wire guides and traveling in an axial direction, and pressing a workpiece against the wire row while...
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JP6174625B2 |
Provided is a polishing method which achieves an excellent polishing result even when a polishing composition which has been used in polishing an object to be polished is collected and reused. The polishing method according to the presen...
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JP2017126617A |
To provide a liquid chemical supply device arranged so that the inside of the device can be cleaned rapidly and safely.A liquid chemical supply device 10 comprises: a housing 11; a liquid chemical supplying pipe 12 provided to extend thr...
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JP2017119781A |
To provide a dispersion liquid for loose abrasive grains, capable of suppressing thickening of a slurry during cutting of a silicon ingot.The dispersion liquid for loose abrasive grains according to the present invention contains: 30 to ...
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JP2017120843A |
To provide a method for processing a free abrasive-containing slurry, by which a constituent of a fluid dispersion for free abrasive can be recovered by a simple operation, and others.A slurry processing method of the present invention c...
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JP6155961B2 |
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JP2017109291A |
To provide a manufacturing method of a recycled abrasive capable of forming the recycled abrasive which is easy to use as an abrasive.A manufacturing method of a recycled abrasive includes the steps of: melting gas into aqueous dispersio...
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JP6137945B2 |
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JP6140051B2 |
A polishing method of polishing a substrate while preventing coarse particles from being discharged onto a polishing pad is disclosed. In this polishing method, a substrate is brought into sliding contact with a polishing pad while a pol...
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JP6117030B2 |
A diffusion plate includes a plate member facing an opening end of a supply pipe with a thickness direction thereof substantially parallel with a supply direction of a supply fluid. The plate member is rotatable around a rotation axis su...
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JP6107669B2 |
The purpose of the present invention is to provide an abrasive regeneration method which, from a used abrasive slurry, can recover an abrasive by an efficient method and can thereafter obtain a high-purity regenerated abrasive by a simpl...
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JP6107668B2 |
The purpose of the present invention is to provide an abrasive regeneration method which, from a used abrasive, can recover an abrasive by an efficient method and can thereafter obtain a high-purity regenerated abrasive by a simple metho...
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JP6090154B2 |
The present invention provides a slicing method wherein a wire saw is used; and a coolant is supplied to a wire wound around multiple wire guides, and a silicon ingot is pressed against the wire to cut the silicon ingot while the wire is...
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JP6088359B2 |
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JP6085500B2 |
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JP6068750B2 |
To reduce a processing amount of a filtration device which supplies a coolant of high purity to a processing point of a machine tool.Chips from a dirty liquid 13 discharged from a grinder 12 are removed by a magnet separator 26 and a par...
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JP2017007055A |
To smoothly polish a polished surface while supplying polishing liquid to the polished surface.A hand polishing tool 10 includes a hand pad 11 griped by an operator during polishing work. A polishing film 21 is mounted to a polishing-sid...
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JP6050831B2 |
A method for cleaning a cross-flow filter (20), comprising the steps of: A) providing a cross-flow filter (20), wherein the cross-flow filter (20) comprises a filter membrane (21) and is configured to remove a liquid permeate stream and ...
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JP6044551B2 |
The present invention addresses the problem of providing: a method for separating a polishing material, which is capable of separating and recovering cerium oxide from a used polishing material that is mainly composed of cerium oxide by ...
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JP6041380B2 |
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JP2016198841A |
To efficiently remove an organic material such as a coolant from sludge containing silicon, and recover the silicon of high purity.A silicon recovery method includes a separation process of performing solid-liquid separation of sludge co...
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JP2016198878A |
To perform specular working of a surface of a difficult-to-machine material at short time at high accuracy.A grind stone is formed by dispersing an abrasive grain mixture into a mixture of rosin and/or a rosin derivative, a synthetic res...
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JP6030703B2 |
Chemical mechanical polishing compositions including an abrasive and cesium hydroxide and methods for polishing dielectric layers associated with integrated circuits using cesium hydroxide containing polishing compositions.
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JP2016175844A |
To provide a separation method of a fullerene derivative, with which the fullerene derivative is separated from a liquid including the fullerene derivative.In a separation method of a fullerene derivative from enhanced functional particl...
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JP6002308B1 |
[Subject] A surface polish device which can carry out polish removal of the dirt unremovable in cleaning fluid adhering on the surface of a wire rod over a long period of time at high speed is provided. [Means for Solution] Jet circulati...
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JP6000119B2 |
To provide a processing waste liquid treatment apparatus which stores only clear water after sufficient separation of processing chips in a clear water tank even when filtration means is new.A processing waste liquid treatment apparatus ...
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JP5982693B2 |
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JP5976659B2 |
Provided is a method that easily recycles an abrasive agent having an abrasive performance equivalent to a pre-use new abrasive agent, and that has a high rate of elimination of silicon components and aluminum components from a used ceri...
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JP2016147287A |
To provide a convenient and highly productive regeneration process for manufacturing regenerated casting sand capable of being used even in a cold box process.A casting sand regeneration process for regenerating casting sand to be used i...
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JP5967246B2 |
To provide a cerium oxide recovery method that enables abrasive waste generated in polishing of a glass substrate to be recovered and recycled as a less-impurity abrasive which is composed mainly of cerium oxide and can be used to polish...
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JP5967939B2 |
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JP5964740B2 |
A gas-liquid separator includes: a gas-liquid separation tank; a gas-liquid introduction pipe configured to introduce a gas-liquid two-phase flow into the gas-liquid separation tank, the gas-liquid introduction pipe extending in the gas-...
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JP5945634B2 |
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JP5943529B2 |
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JP5941995B2 |
A coolant regeneration method for making coolant, which has been used when cutting an ingot using a wire saw, reusable is characterized in that coolant is supplied respectively into the respective hollow sections of one or multiple hollo...
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JP5940224B2 |
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JP5938589B2 |
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JP2016087568A |
To provide a gas-liquid separator that can suppress entry of liquid into an exhaust line.The gas-liquid separator includes: an introduction port for introducing a gas-liquid two-phase flow into a body; a liquid phase discharge port for d...
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JP2016059973A |
To provide a regeneration method of a polishing slurry and the like where the mixing of the aggregate of polishing chips in the polishing slurry can be suppressed and the improvement of the producibility of a substrate, the improvement o...
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