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JP4911290B2 |
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JP4907682B2 |
A multi-wire saw for cutting a workpiece (3) while supplying a slurry (7) containing abrasive grains to a wire (5) traveling between a plurality of rollers (24,27), whereby a slurry supply mechanism (8E,8F) having a holding portion (53,5...
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JP2012056016A |
To provide a wet separating device that improves the efficiency of separation, recover rate and recovering purity, and having additional units such as tanks and a pump with necessary minimum, and to provide an abrasive recovery system us...
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JP2012056081A |
To provide a lapping method and device of a spherical body, capable of enhancing lapping process efficiency.The lapping method is a lapping method of a spherical body, in which a lapping is performed, by grinding stones 2a and 3a, for th...
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JP2012053948A |
To provide a manufacturing method of a disk-shaped substrate which scarcely generates obstruction in the circulation of a polishing liquid and can polish stably even if a gutter for circulating a polishing agent is used in order to suppl...
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JP4897224B2 |
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JP2012505529A |
Embodiments described herein provide an application for delivery of fluids within substrate processing systems. More particularly, embodiments described herein provide applications for delivery of processing chemicals within substrate pr...
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JP2012040642A |
To provide a device and a method for supplying slurry, capable of completely processing a wafer in processing even when a slurry supply engine runs down, as is the case in a double supply system without disposing any double supply system...
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JP2012040640A |
To provide a coolant control system for a wire saw that allows a semiconductor wafer to be manufactured inexpensively and efficiently at a higher yield.The coolant control system is for the fixed abrasive type wire saw that manufactures ...
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JP4885352B2 |
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JP2012033762A |
To provide a method and equipment for manufacturing a semiconductor wafer, capable of suppressing a change in cut shape of the wafer due to the influence of frictional heat generated between a wire and a work.A method for manufacturing a...
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JP4876345B2 |
The preparation apparatus 4 determines the target distribution of the amount of polishing on the basis of the film thickness of the wafer 2 measured by the measuring apparatus 3 . The preparation apparatus 4 assumes a control program for...
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JP4869536B2 |
A method of manufacturing a semiconductor component includes forming a first layer over a semiconductor substrate, providing a mixture comprised of a first component and a second component, optically detecting a concentration of the firs...
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JP4869796B2 |
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JP4857973B2 |
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JP2012006136A |
To provide a wire saw machine with a wire of a long lifetime, having a high machining accuracy and a high reliability.An ultrasonic vibrator 13 that joins an aluminum ultrasonic propagation body 12 is located approximately 1 mm spaced fr...
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JP4851174B2 |
The invention provides a system for polishing one or more layers of a multi-layer substrate that includes a first metal layer and a second layer comprising (i) a liquid carrier, (ii) at least one oxidizing agent, (iii) at least one polis...
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JP4852323B2 |
A liquid supply apparatus is to supply a polishing liquid from a polishing supply source onto a polishing surface of a polishing table at a predetermined flow rate. The liquid supply apparatus according to the present invention includes ...
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JP4849660B2 |
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JP4839137B2 |
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JP4836441B2 |
The present invention provides a polishing composition containing an organic nitrogen-containing compound, an organic polybasic acid, an abrasive, and water, wherein the organic nitrogen-containing compound has in the molecule two or mor...
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JP4832690B2 |
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JP4824976B2 |
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JP4819523B2 |
To provide a working fluid supply device, using a working fluid filling up a container, and performing replacement work without suspending machining work in replacing with a new container filled with a working fluid. The working fluid su...
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JP2011218503A |
To provide a method for disposing a silicon-containing waste liquid to recover silicon particles from which impurities are effectively removed.In the method for disposing a silicon-containing waste liquid, a recycled coolant and a recycl...
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JP2011212601A |
To improve removing efficiency of magnetic particles while simplification of the apparatus is attained.In a magnetic particle removing apparatus, a yoke 212 having a magnet 213 is installed in the lower part of a flow passage bottom wall...
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JP4801438B2 |
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JP4803167B2 |
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JP4801437B2 |
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JP4799122B2 |
A method for polishing a Cu film comprises contacting a Cu film formed above a semiconductor substrate with a polishing pad attached to a turntable, and supplying a first chemical liquid which promotes the polishing of the Cu film and a ...
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JP4796336B2 |
A substantially uninterrupted flow of a pressurised abrasive slurry is maintained by successively charging each of a plurality of vessels V 1 , V 2 with an abrasive material while discharging an abrasive slurry from another of the vessel...
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JP2011200980A |
To provide a wafer manufacturing device allowing an easy change of a discharge position of polishing and grinding liquid, sufficiently spreading of the polishing and grinding liquid to cutting surfaces of all raw stones and accurately cu...
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JP2011201161A |
To provide a method and apparatus for manufacturing wafers that can accurately cut ores by fully spreading a polishing abrasive slurry on the sections of all ores.In the method of manufacturing wafers, a plurality of ores 10 arranged in ...
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JP2011177810A |
To provide a coolant purifying device improving maintainability and purification efficiency, and reducing the installation area thereof.In the coolant purifying device including a magnetic separation device 20, an eddy current tank 40, a...
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JP2011177870A |
To provide an addition device for hydrogen peroxide facilitating feeding work by making a feeding amount of the hydrogen peroxide constant and being excellent in economical property.The addition device 1 includes: a tank 2 for storing a ...
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JP2011177809A |
To provide a coolant purifying device for improving maintainability.The coolant purifying device includes: a magnetic separation device 20, an eddy current tank 40; a clean tank 50; a first precipitation tank 10 disposed between a main p...
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JP2011173198A |
To provide a mixed liquid supply device capable of accurately perceiving the remaining amount of abrasive stock solution in an abrasive stock solution tank with a simple structure.The mixed liquid supply device supplying a machining devi...
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JP3170134U |
To provide a magnet strainer in which foreign matter adhering to a magnet in a magnet strainer for use in a substrate polishing apparatus can be easily confirmed, and a polishing apparatus using the same. When polishing a glass substrate...
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JP4759790B2 |
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JP4760703B2 |
A method for determining the flow of a fluid ( 60 ) in a gap ( 64 ) between a pad ( 48 ) and a substrate ( 12 ) includes the step of utilizing a hybrid Navier-Stokes/lubrication formulation to calculate the flow of the fluid ( 60 ) in th...
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JP2011156628A |
To prevent occurrence of buoyancy caused by a polishing tool submerged in a polishing liquid, in a polishing apparatus that performs a polishing work by interposing a polishing liquid between the polishing tool and a surface to be proces...
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JP4743951B2 |
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JP4729428B2 |
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JP4723409B2 |
The invention provides a system for polishing one or more layers of a multi-layer substrate that includes a first metal layer and a second layer comprising (i) a liquid carrier, (ii) at least one oxidizing agent, (iii) at least one polis...
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JP4718854B2 |
To provide a regenerating processing method and a device of waste slurry, capable of regenerating the waste slurry in a slurry-use type processing apparatus, while restraining cost, with a simple constitution. This regenerating processin...
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JP4715880B2 |
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JP2011125965A |
To reduce exchanging of a filter so as to reduce a cost, even when grinding chips are removed through the filter while a coolant is circulated in a grinding process that employs a fixed abrasive as a grinding pad.A method of manufacturin...
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JP4714823B2 |
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JP2011121147A |
To provide a method of polishing a semiconductor wafer capable of restricting deterioration in surface roughness near the center of a semiconductor wafer to be obtained in machining for polishing the semiconductor wafer.This is a method ...
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JP4709366B2 |
To provide a method and apparatus for treating coolant used for lens cleaning devices, which permits grinding dust in a coolant tank to be removed smoothly without unpleasant labor. The coolant treating apparatus is provided with a coola...
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