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JP5466554B2 |
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JP5466455B2 |
In the disclosed method, SiC or Si in a solution or waste liquid can be recovered without pollution of wastewater, and silicon carbide is produced that can be used as an abrasive, as grit, and as a polishing material. The method for prod...
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JP2014050955A |
To provide a polishing device and a polishing method which enable the reduction of the consumption of a polishing liquid while maintaining a relatively high polishing rate.A polishing device includes: a polishing table 22 having a polish...
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JP5449397B2 |
The present invention provides a wiresaw cutting method comprising cutting a workpiece with a wiresaw while applying an aqueous cutting fluid to the wiresaw from a recirculating reservoir of cutting fluid, monitoring at least one of a ch...
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JP5443243B2 |
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JP5446601B2 |
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JP2014046396A |
To provide a recovery method and a recovery system where system configuration is simple and small-sized and particulates having a particle diameter of a fixed value or more and being usable are recovered with high efficiency from a liqui...
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JP5441727B2 |
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JP5429647B2 |
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JP5427822B2 |
Provision of a method for cutting a workpiece with a wire saw whereby a large-diameter workpiece can be cut accurately and efficiently without any defects such as breakage occurring. When cutting a workpiece, a saw wire 1 is positioned s...
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JP5430271B2 |
To provide a rotary drum type abrasive grain recovery device enhancing a separation ratio of abrasive grains from sludge and recovering as much used abrasive grains as possible. This rotary drum type abrasive grain recovery device is equ...
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JP5422245B2 |
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JP5416348B2 |
To provide a gas-generating reaction apparatus having a function of separating a solid from a gas, in which the interference of the gas, which is generated by a reaction of a metal component with an alkali, with the residual solid to be ...
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JP5389563B2 |
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JP2014000644A |
To provide a liquid mixture supply system capable of sufficiently delivering liquid mixture to a processing apparatus without improving delivery capability of a pump even if a route for delivering liquid mixture becomes longer.A liquid m...
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JP5384994B2 |
The invention provides a system for polishing one or more layers of a multi-layer substrate that includes a first metal layer and a second layer comprising (i) a liquid carrier, (ii) at least one oxidizing agent, (iii) at least one polis...
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JP5375895B2 |
To perform normal polishing by securing a polishing amount and reducing back pressure near a center without reducing a slurry flow rate, and to suppress the reattachment of abraded substrate components to a polished substrate surface by ...
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JP5377123B2 |
A method for making heated plane of a cooler to obtain better flatness and roughness includes a grinder with a grinding plate and a fixture. Then, the cooler is arranged onto the fixture. Next, the abrasive is injected into the gap betwe...
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JP5370598B2 |
Provided is a method for recovering an abrasive material component from used slurry having cerium oxide as the principle component of the abrasive material therein, the abrasive component recovery method being one in which post-recovery ...
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JP2013237130A |
To allow coolant to be reused by efficiently removing metal material particles from coolant waste liquid containing the metal material particles discharged in working of a metal material.In a method for recovering coolant from coolant wa...
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JP3187466U |
To provide a slurry regeneration device capable of constantly and continuously regenerating a slurry regardless of the amount of the slurry recovered. A slurry regenerating device 10 that reusably regenerates a slurry S composed of used ...
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JP3187465U |
To provide a slurry regeneration device capable of grasping the amount of slurry in a storage tank. A slurry regenerating device 10 that reusably regenerates a slurry S composed of used coolant containing chips and abrasive grains genera...
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JP2013239621A |
To provide a separation method of semiconductor components capable of separating semiconductor components efficiently from grinding slurry.The separation method of semiconductor components for separating semiconductor components from the...
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JP5332914B2 |
Provided is a method for cutting a silicon ingot, with which the waste slurry generated when a silicon ingot is cut by a wire saw is subjected to primary centrifugation and separated into a primary separated liquid and a solid component,...
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JP5335289B2 |
To provide a method of recovering an inorganic powder from e.g. waste liquid containing the inorganic powder, e.g. silicon powder, through a simple method. The method of recovering an inorganic powder includes a process (1) of adding a s...
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JP5331200B2 |
Disclosed is a technique which efficiently removes the glass component contained in a used Cerium-based abrasive slurry, restores the abrasion rate, and regenerates a Cerium-based abrasive which suppresses the occurrence of abrasion dama...
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JP2013219307A |
To provide a system for regenerating slurry and a regeneration method, used for a chemical-mechanical polishing at the time of performing flattening after packing of conductive metal into a via plug or the like.A CMP slurry regeneration ...
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JP5320640B2 |
To provide an apparatus and a method for efficiently recovering lapping abrasives, in a reutilizable state, from a lapping agent after use in lapping. A used lapping agent 7 contains a lap debris 9 and at least one type of abrasives 8. A...
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JP5317531B2 |
To provide a method for cleaning a slurry supply device capable of surely eliminating microorganisms attached to and bred on any of portions from a supply line of a polishing liquid to a supply line for supplying a slurry of a mixture li...
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JP5303649B2 |
Disclosed is an apparatus for supplying slurry for semiconductor, including a filter which filters slurry particles larger than a predetermined particle size; an air injector which is connected with the filter so as to back-wash the filt...
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JP5299042B2 |
To provide a silicon oxidation suppression method substituted for a pH control method using a pH sensor suppressing oxidation of a silicon cutting powder in a coolant liquid and enhancing solid/liquid separation property of the silicon c...
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JP5297019B2 |
To provide a manufacturing method of a ceramic sintered body, in which a pH value of an aqueous grinding liquid is controlled to a specified range, and which hardly causes an operating failure etc. of each component of a manufacturing de...
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JP5301629B2 |
To provide a liquid supply structure that can efficiently supply grinding liquid to a machining point to be a sliding contact part between an abrasive surface of a cup-shaped grinding wheel and a workpiece and recovering the grinding liq...
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JP2013535848A |
The present invention provides a system and method for recycling an abrasive chemical mechanical polishing (CMP) slurry after polishing substrates therewith. The method comprises circulating the recovered CMP slurry from a blending tank ...
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JP5286040B2 |
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JP5286940B2 |
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JP5280218B2 |
A slurry regenerating device provided with a centrifugal separator (2) for allowing waste slurry to be inserted therein, a discharge opening (12) for discharging a primarily separated substance and a secondarily separated substance from ...
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JPWO2012005142A1 |
The present invention is an abrasive (5) for polishing the surface to be polished of the object to be polished (1), and has first silicon oxide fine particles having an average primary particle diameter of 5 to 20 nm and an average prima...
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JP2013169620A |
To provide a magnet strainer for use in a substrate polishing device capable of easily checking foreign matter magnetized and attached inside the magnet strainer.When a glass substrate is polished by a polishing machine by using polishin...
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JP5263657B2 |
To provide a polishing device having improved slurry utilizing efficiency. This polishing device comprises a surface plate 10 on the upper surface of which a polishing pad is installed and which is rotatingly driven, a substrate moving m...
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JP5264430B2 |
To provide a cutting and grinding oil, and a method for cutting and grinding, sufficiently prolonging tool life even with small amount used, and applicable to a workpiece material comprising iron alloy such as stainless steel. The cuttin...
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JP5261096B2 |
To provide silicon recovery method and device capable of stably performing dehydrating treatment without a chemical dose and recovering silicon in high enrichment. Grinding or polishing drainage including silicon particle groups having t...
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JP5248209B2 |
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JP5250405B2 |
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JP5245076B2 |
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JP5230980B2 |
To effectively remove magnetic foreign matters contained in slurry with an attractor with a magnet and to effectively remove the magnetic foreign matters attracted to the attracting body for a repeated use of the attractor. The device fo...
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JP2013126928A |
To recover and recycle an abrasive consisting mainly of cerium oxide containing few impurities, which can be used even for polishing a synthetic quartz glass substrate for cutting-edge semiconductor applications such as a photomask and a...
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JP5218886B2 |
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JP2013116526A |
To prevent a working fluid from spilling over from a working fluid tank by defoaming generated foam and preventing decrease in working accuracy and disconnection of a wire caused by insufficient supply of the working fluid, in a working ...
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JP5207002B2 |
A chemical mechanical polishing aqueous dispersion includes (A) abrasive grains, (B) an organic acid, and (C1) copper ions or (C2) at least one kind of metal atoms selected from Ta, Ti, and Rb, the chemical mechanical polishing aqueous d...
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