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JP4369054B2 |
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JP4362473B2 |
A chemical-solution supplying apparatus (100) for supplying slurry to an exterior device (7) includes a supply route (A) in which abrasive suspension flows at a predetermined flow rate and a return route (C) connecting the supply route a...
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JP4358708B2 |
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JP4358983B2 |
To provide a rotary joint capable of assuring an excellent sealability by using in a polishing device for silicon wafer. A plurality of annular members 13 are stacked in axial direction to form a tubular body 10. A radial flow passage 13...
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JP4353991B2 |
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JP4354551B2 |
Apparatus for dispensing a liquid to at least one point of use, the apparatus comprising a plurality of chambers, each having dispense, return and fill modes of operation in which liquid is driven therefrom, unused liquid is returned, an...
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JP4354552B2 |
The system has three pumps (10, 13, 16) for the slurry concentrate, de-ionised water and an oxidizer, and a flow network with dispense (34) and recycle (36) legs. A junction (26) connects the pumped streams and the recycle stream to form...
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JP2009228442A |
To provide a tube pump capable of increasing the life of a tube even when the tube is not rotated.This tube pump includes the flexible tube 310, and a plurality of rollers 340, 350, 360 moving along the stretching direction of the tube 3...
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JP4314582B2 |
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JP4310884B2 |
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JP4309825B2 |
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JP4294910B2 |
In a small scaled plant intended for flexible manufacturing, a pure water supply system is provided at a low cost without reducing a production efficiency. A pure water system produces a plurality of grades of pure water which are suppli...
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JP4294396B2 |
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JP2009147044A |
To polish the bevel of a semiconductor wafer without reducing a yield upon manufacturing a semiconductor device.A semiconductor device manufacturing apparatus includes a mechanism for holding and rotating a semiconductor wafer 1 using re...
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JP4278773B2 |
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JP2009125915A |
To provide a grinding wheel mounting mechanism for a grinding device allowing the simultaneous or separate mounting of two kinds of grinding wheels if necessary.A grinding wheel includes a first grinding wheel 30 composed of a plurality ...
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JP4276521B2 |
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JP4271678B2 |
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JP4270880B2 |
A magnetorheological fluid delivery system includes a mixing and tempering vessel. Fluid is admitted to the vessel via a plurality of tangential ports, creating a mixing of the fluid in the vessel and promoting homogeneity. Fluid may be ...
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JP2009113148A |
To provide a method of filtrating a polishing slurry capable of maintaining filtration accuracy semi-permanently by a filter capable of completely eliminating the mixing of coarse solid matters and having extremely long life, and to prov...
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JP4262922B2 |
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JP4254526B2 |
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JP4252081B2 |
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JP4253048B2 |
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JP4252084B2 |
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JP4251516B2 |
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JP4247955B2 |
To provide a composition for use in the precision polishing of the surface of rigid and brittle materials including, in particular lithium tantalate single crystal materials and lithium niobate single crystal materials, and to provide a ...
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JP4248895B2 |
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JP2009061526A |
To mirror-polish a wafer while preventing damage by sufficiently supplying a polishing solution thereto even when the water is large and thin.This wafer polishing device is used to adjust the thickness of a wafer to a predetermined thick...
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JP2009061559A |
To re-use the water obtained after efficiently removing the chips contained in an effluent used in a semiconductor water cutting step.A high tension direct current field is applied to the effluent to change the surface charge of silicon ...
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JP4243154B2 |
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JP4238951B2 |
A polishing composition for a magnetic disk substrate to be used for a memory hard disk, which comprises:(a) colloidal silica as an abrasive in an amount within a range of from 0.1 to 35 wt % based on the total weight of the composition;...
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JP4237439B2 |
A method of polishing or planarizing a substrate comprising abrading at least a portion of the surface of a substrate comprising a metal, metal oxide, metal composite, or mixture thereof, with a composition comprising a metal oxide abras...
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JP4233484B2 |
To provide a coagulation treatment device capable of removing an object to be removed from a fluid containing the fine object to be removed, and a coagulation treatment method employing it. The coagulation device for the fluid is provide...
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JP2009029078A |
To provide a wire-saw device capable of controlling a temperature of slurry, wherein dimensional accuracy of a wafer can be improved by adjusting temperatures in each part of a wire and a guide roller to those suitable to a highly accura...
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JP4218774B2 |
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JP4210462B2 |
A fluid mixing device ( 30 ) used for processing fluid, including a first fluid feed passage ( 34 ) for feeding first fluid, a second fluid feed passage ( 43 ) for feeding second fluid, and a mixing part ( 41 ) for generating mixed fluid...
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JP4212155B2 |
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JP2008302469A |
To provide a polishing device for a color filter preventing attachment of a polishing agent to an opening part of a droplet supplying hose head end of the polishing agent and dropping of it on a substrate, and also to provide a polishing...
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JP2008296351A |
To provide a substrate treatment apparatus for polishing a peripheral portion of a substrate to be treated and a substrate treatment method, which performs accurate polishing, while suppressing the cost.The substrate treatment apparatus ...
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JP4192894B2 |
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JP4194783B2 |
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JP4189384B2 |
An information recording medium glass substrate manufactured by polishing the surface of a raw material glass plate. The polishing is divided into two steps, a step for performing a first polishing process to roughly polish the surface o...
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JP4185381B2 |
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JP4188598B2 |
The invention provides a system for polishing one or more layers of a multi-layer substrate that includes a first metal layer and a second layer comprising (i) a liquid carrier, (ii) at least one oxidizing agent, (iii) at least one polis...
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JP2008279539A |
To efficiently recover a polishing fluid (slurry) used for chemical machine polishing, and also to provide a method and a device for recovering the polishing fluid in a less contaminated state in each kind of contamination.In the recover...
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JP2008272842A |
To obtain a flow control device capable of efficiently operating a polishing device with a small amount of slurry.This flow control device is arranged between a slurry feeder 3 for feeding the slurry and a CMP device 2 for performing pol...
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JP2008272904A |
To provide an apparatus and method for polishing capable of preventing a gap between the polishing amount of the substrate positioned at an upper side and the polishing amount of the substrate positioned on a lower side, when polishing i...
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JP4179448B2 |
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JP2008246645A |
To provide a polishing device capable of preventing foreign matter from being entrapped into a polishing liquid.An upper surface plate 20 and a lower surface plate 10 vertically hold a polishing workpiece W such as a glass substrate, etc...
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