| Document |
Document Title |
|
JP5691179B2 |
|
|
JPWO2013054577A1 |
Provided are a processing waste liquid circulation device and a processing waste liquid circulation method capable of maintaining a pH value of a processing liquid within a predetermined range. The machining fluid is supplied to the mach...
|
|
JPWO2013054576A1 |
Provided are a processing waste liquid treatment apparatus and a processing waste liquid treatment method capable of maintaining the conductivity of the processing liquid within a predetermined range. The processing liquid is supplied to...
|
|
JPWO2013047678A1 |
Cutting or polishing provided with a fixed abrasive wire (2) to which abrasive particles are fixed, a support unit (8) for supporting a workpiece (10), and a coolant liquid supply unit (9) for supplying a coolant liquid. Using the crushe...
|
|
JP5689891B2 |
The invention relates to a device for the double-sided processing of flat work pieces, comprising an upper working disc and a lower working disc, wherein the working discs between the working surfaces thereof facing each other, form a wo...
|
|
JP5682222B2 |
|
|
JP5681029B2 |
To provide a processing waste liquid treatment apparatus that can discharge air accumulated in an ion exchange resin cylinder without sending the air to a processing apparatus, when exchanging the ion exchange resin cylinder.The processi...
|
|
JP5672020B2 |
|
|
JP5658000B2 |
|
|
JP2015011735A |
To provide a manufacturing method of a glass substrate for a magnetic disk, that can, when the main surface of the glass substrate made of aluminosilicate glass is polished with a polishing liquid containing cerium hydroxide as abrasive ...
|
|
JP5647056B2 |
|
|
JP2014239228A |
To provide a CMP polishing liquid which can effectively reduce coarse particles in comparison to conventional ones, and can suppress the occurrence of a scratch in a face to be polished after polishing.A CMP polishing liquid according to...
|
|
JP2014216369A |
To provide an abrasive and a polishing method by which a surface to be polished of a substrate can be polished at high speed and stability in long-time use is also improved even in the case where the concentration of silicon-oxide partic...
|
|
JP2014216368A |
To provide a polishing agent in polishing of a sapphire substrate, excellent in stability when using polishing for a long period of time by suppressing a variation of pH and improving sustainability of polishing speed, and to provide a p...
|
|
JP5618508B2 |
|
|
JP5604062B2 |
|
|
JP5598607B2 |
The present invention is directed to a method for polishing a silicon wafer, the method comprising: polishing the silicon wafer by bringing the silicon wafer into sliding contact with a polishing pad attached to a turn table while supply...
|
|
JP5598580B2 |
Provided is a method for recovering an abrasive material component from used slurry having cerium oxide as the principle component of the abrasive material therein, the abrasive component recovery method being one in which post-recovery ...
|
|
JP5591036B2 |
|
|
JP2014160833A |
To provide a polishing method with which, when polishing a non-oxide single crystal substrate such as a silicon-carbide single crystal substrate by collecting and recycling a used polishing solution, a high polishing speed can be maintai...
|
|
JP5578319B2 |
|
|
JP5579130B2 |
|
|
JP5574243B2 |
To provide a grinding method and device using a liquid coolant, which enhance rust-preventive, detergent and antiseptic effects on a workpiece and adsorption and separation effects on grinding dust of the foamlike liquid coolant, and dow...
|
|
JPWO2012161029A1 |
A method for producing a regeneration filter, which is (1) a step of preparing a filter used for filtering a dispersion liquid containing silica particles, (2) a step of wetting the filter with a liquid, and (3) a step of (2) above. Prov...
|
|
JP5562370B2 |
Chemical Mechanical Polishing/Planarization (CMP) apparatus, method, and substrate produced thereby. Polishing surface with non-uniform recesses therein. CMP head and method having integral slurry dispensing mechanism. CMP apparatus and ...
|
|
JP3192081U |
To provide a grinding apparatus having a small installation area of the apparatus. A grinding apparatus 1 for performing a grinding process on a substrate W, a holding means 2 for holding the substrate, a grinding means 4 for grinding th...
|
|
JP5548860B2 |
|
|
JP2014128877A |
To solve the problem that though there is provided a technology to obtain both a machining rate and satisfactory surface roughness by grinding using a grinding stone and loose abrasive, a supplied loose abrasive cannot be satisfactorily ...
|
|
JP2014130673A |
To reduce scratch defect on a surface of a glass substrate.A manufacturing method of a glass substrate for a magnetic disk includes a step of polishing a main surface of a glass material using polishing liquid. In a slurry tank 122 for s...
|
|
JP5542818B2 |
|
|
JP5544020B2 |
|
|
JP5539390B2 |
The present disclosure generally relates to methods for recovering silicon from saw kerf, or an exhausted abrasive slurry, resulting from the cutting of a silicon ingot, such as a single crystal or polycrystalline silicon ingot. More par...
|
|
JP5534601B2 |
|
|
JP5530564B2 |
|
|
JP5526759B2 |
|
|
JP5526960B2 |
|
|
JP2014100747A |
To provide a compound liquid supply device which reduces the frequency of replenishment of a polishing material undiluted solution into a sub tank and replacement of the sub tank replenished with the polishing material undiluted solution...
|
|
JP5511261B2 |
|
|
JP2014097558A |
To provide a mixed liquid supply system capable of suppressing breakage of a circulation path.A mixed liquid supply system 1 includes: a mixing tank 4 for storing slurry S; sending-out piping 5; returning piping 6; a sending-out pump 7; ...
|
|
JP2014097559A |
To provide a mixed liquid supply device capable of grasping clogging of a filter.A mixed liquid supply device 1 includes; a mixing tank 4 for storing slurry S; sending-out piping 5; a sending-out pump 7; a filter 17; pressure measurement...
|
|
JP5505713B2 |
|
|
JP5505835B2 |
|
|
JP5495599B2 |
|
|
JP2014091181A |
To provide a cyclone separator which controls the wear due to sludge, such as grinding and the like, and can maintain the separation performance over a long time.The cyclone separator which performs the solid-liquid separation of waste f...
|
|
JP5486392B2 |
To provide an ingot cutting method which can improve regeneration efficiency of a cutting oil composition, with a simple operation, by separating cutting powder from waste oil solution which contains used cutting oil composition and the ...
|
|
JP2014073556A |
To provide a regeneration method of a cerium oxide-based abrasive capable of regenerating a reusable cerium oxide-based abrasive by reducing sufficiently SiO2 from a used cerium oxide-based abrasive, or the like.A regeneration method of ...
|
|
JP5479781B2 |
|
|
JP5479046B2 |
|
|
JP5470658B2 |
To provide a treatment liquid cleaning device in which even sludge with relatively small specific gravity can be surely removed to properly clean a treatment liquid even if a coolant or the like high in bubbling property is used as the t...
|
|
JP2014061575A |
To further ensure filtration of foreign matters mixed into a coolant while simplifying a configuration of a coolant filtering device.A coolant filtering device includes foreign matter removal means 26 installed in a horizontal piping por...
|
