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JP4695771B2 |
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JP2011104693A |
To provide a substrate polishing device which prevents an abrasive liquid or a cleaning liquid from staying in a side groove for collecting the abrasive liquid or the cleaning liquid falling down from a polishing stage where a substrate ...
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JP4693203B2 |
The disclosure relates to a carrier head of a chemical mechanical polishing apparatus to apply and distribute a polishing slurry to a polishing pad. The carrier head includes a retaining ring (110) having a trough for holding a supply of...
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JP4689241B2 |
A chemical mechanical polishing pad (200) that includes a polishing layer (204) having a polishing region (208) and containing a plurality of grooves (212) extending at least partially into the polishing region. During polishing, the gro...
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JP2011083845A |
To solve a problem that recovery rate of a dispersion liquid is lowered and cost is increased since the dispersion liquid is discarded to lower content rate of a chip and to achieve cost reduction by reducing load of primary separation a...
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JP2011079102A |
To provide a sheet polishing machine capable of preventing any over-polished state at a peripheral edge of a color filter 1 even when surface wear occurs in a polishing head 40, and the supply of polishing liquid is excessively large in ...
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JP4673137B2 |
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JP2011509187A |
A process for the complete separation of the suspending fluid from the solid components container in an exhausted slurry, either abrasive or not, coming from the cutting operation or other mechanical working of materials of monocrystalli...
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JP4657412B2 |
A polishing table 11 in the CMP apparatus 10 has a diameter smaller than the diameter of a polishing pad 12. The polishing pad 12 is disposed on the polishing table so as to cover the entire top surface of the polishing table 11. A space...
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JP2011054906A |
To provide a method for stably storing slurry containing quadrivalent metal hydroxide particles distributed in water without fluctuating pH.A method for storing slurry containing water and quadrivalent metal hydroxide particles distribut...
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JP2011051028A |
To provide a grinding method for performing rough grinding and finished grinding in one process using a cup-type grinding wheel head to achieve a prescribed highly accurate smooth surface.The grinding method using a concentrically-spaced...
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JP2011051046A |
To provide a machining device capable of suppressing the occurrence of clogging in a rotation grinding wheel even if the rotation grinding wheel is used for carrying out dry-type machining, and a machining device suitable for the machini...
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JP4646517B2 |
A method of mixing two or more chemicals such as for a CMP system. The method includes delivering a first chemical to a first inlet port of a point of use mixer at a first flow rate, delivering a second chemical to a second inlet port of...
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JP4645056B2 |
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JP2011506110A |
Common sources of different (e.g., concentrated) process materials are controllably supplied to multiple blending manifolds associated with multiple process tools, processing stations, or other points of use, to create an independently c...
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JP2011041922A |
To provide a magnetic material separator which can efficiently recover magnetic material powder.A cutting chip removing device (magnetic material separator) 1 comprises: an adsorber 10 which has at least a pair of magnets 12 arranged so ...
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JP4644120B2 |
A material for purification of a semiconductor polishing slurry that without changing of pH value, is capable of efficiently purifying a polishing slurry to thereby not only prevent metal contamination of a polished object as effectively...
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JP4641763B2 |
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JP4641540B2 |
An apparatus for polishing substrates; comprising: at least two substrates to be polished; at least two second polishing surfaces; a rotatable carousel; at least two first substrate head assemblies suspended from said carousel and holdin...
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JP4632635B2 |
To solve the problem that wastewater mixed with ground refuse and shaven refuse generated through machining such as dicing, CMP (chemical- mechanical polishing) or the like is treated heretofore by two methods, that is, a flocculation an...
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JP4622741B2 |
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JP2011016185A |
To provide a washing liquid for a slurry circulating path and a washing method for the same, which prevents the metal contamination in a silicon wafer due to metal ions eluted from free abrasive grain following washing in an alkaline aqu...
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JP2011502054A |
A method for treating spent abrasive slurry obtained from cutting a body of a substrate material into wafer-like slices, the slurry comprising a lubricant fluid, unspent abrasive particles and fines, is disclosed, method comprising separ...
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JP2011011205A |
To provide a magnetic filter device which effectively carries out filtration treatment of a liquid to be treated and cleaning treatment of a filter, and which achieves the increment of the filtration flow volume and the improvement of th...
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JP2011011307A |
To provide a recycling method and a recycling apparatus of slurry for use in wafer polishing processing a large amount of used-slurry in a short time.The recycling method of slurry for use in wafer polishing for reusing slurry used in a ...
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JP2011005561A |
To provide a method and system for cutting a silicon ingot inhibiting cost increase by improving recovery while suppressing deterioration of cutting quality in cutting the silicon ingot with a wire saw while supplying regenerated slurry ...
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JP4612600B2 |
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JP4609675B2 |
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JP4601445B2 |
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JP2010279860A |
To provide a technique for deliquoring and solidifying liquid-containing sludge, by which liquid components can be effectively separated and deliquored from sludge containing oil, water or the like by using compressed air and a filter bo...
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JP4597168B2 |
Provided is a bubble damper of a slurry supply apparatus, more particularly, a bubble damper of a slurry supply apparatus in which a bubble damper removes bubbles generated by a slurry supply apparatus. The bubble damper system includes ...
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JP2010274354A |
To provide a washing device and a method capable of keeping concentration of a polishing material in slurry circulated and used constant even when water washing is performed after wet-blast washing in a same washing area.In the prescribe...
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JP4592968B2 |
Disclosed is a grinding fluid supply device of a lens grinding apparatus. The grinding fluid supply device includes first grinding fluid supply means for supplying a grinding fluid in a tangent direction of a circular grinding wheel, whi...
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JP4585100B2 |
To provide the regeneration method of polishing spent liquid for minimizing a load to an environment and appropriately regenerating polishing characteristics advantageously in terms of costs. The generation method of polishing spent liqu...
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JP2010263135A |
To provide a semiconductor wafer polishing apparatus capable of mixing liquids having respectively different physical properties in piping, and to provide a joint and a stirring top included in the polishing apparatus. In the semiconduct...
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JPWO2009022571A1 |
Provided are a deburring method and an apparatus capable of suppressing the generation of sparks and the scattering of dust when removing burrs at a threaded joint portion of a pipe. The deburring device (100) according to the present in...
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JP3164027U |
To provide an apparatus capable of efficiently recovering useful components from a used slurry discharged from a processing process of a silicon wafer in a short time via a primary centrifuge and a secondary centrifuge. A plurality of se...
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JP4580433B2 |
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JP2010247310A |
To provide a method and device for supplying slurry reducing the amount of slurry remaining in a drum after use to the minimum.The method and device for supplying the slurry includes (1) a normal process in which the slurry in a slurry s...
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JP4570889B2 |
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JP2010221347A |
To reuse coolant for polishing a glass substrate by effectively removing and separating foreign matter, such as glass powder mixed with coolant after completion of a polishing process.This method is for separating foreign matter in coola...
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JP2010221337A |
To provide a method for recycling used grinding fluid almost entirely removing fine chips, wire abrasion powder and the like from the used grinding fluid discharged from a working machine, recovering dispersion fluid at a high recovery p...
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JP2010214515A |
To provide a method of manufacturing a reusable glass abrasive material at high purity from a glass abrasive material used for polishing a polishing object.This method includes a process for recovering first aqueous dispersion liquid inc...
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JP4552168B2 |
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JP4551167B2 |
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JP2010206167A |
To improve a slurry distribution on a pad by adjusting slurry concentration in a different part of a slurry reservoir by further combining a means of adjusting a device to control a flow rate with a feedback loop.An injector 10 has a con...
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JP4543125B2 |
To provide an abrasive liquid recycling system for a chemical and mechanical flattening device (hereinafter called a CMP device), capable of keeping the good quality of a machining surface of a semiconductor wafer and the like. This abra...
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JP4541796B2 |
An abrasive and a dispersion medium are introduced into a dispersing machine to uniformly disperse the abrasive. The liquid to be processed after dispersion is centrifugally classified by a centrifugal classifier to remove heavy particle...
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JP2010530135A |
There are provided a method and a system for regenerating a waste slurry which is disused after a slurry has been used to raise the cutting efficiency in a process of fabricating various wafers, such as semiconductor wafers, solar wafers...
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JP4534241B2 |
To provide an abrasive recovering device to efficiently recover abrasive particles for re-utilization from polishing process drain containing abrasive discharged from a CMP process used in a semiconductor manufacturing factory. In a devi...
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