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JP2013099831A |
To solve the problem that though there is provided a technology to obtain both a machining rate and a satisfactory surface roughness by grinding using a grinding stone and loose grains, supplied loose grains cannot be satisfactorily held...
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JP2013091130A |
To provide a grinding abrasive grain collecting device even in damage to a screw and a bowl, excellent in control accuracy, and having high collecting efficiency.The grinding abrasive grain collecting device separates a concentrated liqu...
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JP2013086204A |
To reproduce performance as abrasive by simple reproduction processing in used abrasive slurry.This method for reproducing the cerium oxide-based abrasive slurry for polishing a glass material includes the following processes: a first pr...
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JP5173945B2 |
A method of regenerating a coolant is provided with which a regenerated slurry can be inhibited from having an increased viscosity. The method of coolant regeneration comprises subjecting a spent slurry discharged after the cutting of a ...
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JP2013056381A |
To provide a coolant regeneration method capable of regenerating a coolant in a high yield while having a function to remove sludge adhered to a rotating body.The coolant regeneration method 1 includes: a detergent discharge step S0' of ...
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JP5163078B2 |
To provide a polishing apparatus for removing foreign substances from a waste liquid, recovering the polishing liquid to repeatedly use the liquid and preventing the clogging to use a filter for a long time. A waste polishing liquid from...
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JP2013046936A |
To provide an electrolysis treatment method of an aqueous grinding/cutting fluid, which eliminates the need of using an antiseptic agent and an anticorrosive agent by being mixed with water for cutting and polishing machining, and improv...
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JP5148948B2 |
A method of recycling an abrasive slurry for recycling a slurry that: contains colloidal silica; and has been used in polishing semiconductor wafer(s) is provided. The method includes: adding a dispersant to the used slurry having been c...
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JP2013505144A |
The present invention relates to a method for purifying waste silicon slurry, comprising: separating solids and cutting oil included in waste silicon slurry; mixing the separated solids with water; and separating abrasives and wastewater...
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JP5128793B2 |
The double face polishing apparatus (30) is capable of controlling an amount of supplying slurry to a lower polishing plate (32). The double face polishing apparatus (30) comprises: the lower polishing plate (32) and an upper polishing p...
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JP2013004896A |
To provide a method and an apparatus for recovering a liquid coolant which allow for circular reuse of a used liquid coolant discharged in a cutting step of a semiconductor ingot or a processing step of semiconductor wafers cut from the ...
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JP2012256715A |
To provide a polishing device capable of suppressing occurrence of polishing failure.There is provided a polishing device comprising a slurry pipe 300 and a pure water supplying module 320. The slurry pipe 300 includes: an outlet 302 whi...
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JP5107407B2 |
A material for purification of a semiconductor polishing slurry that without changing of pH value, is capable of efficiently purifying a polishing slurry to thereby not only prevent metal contamination of a polished object as effectively...
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JP2012250301A |
To increase the density of nano-bubbles by reducing a variation of a thickness of a wafer after polishing.This nano-bubble circulation type polishing device is composed by including: a polishing device for polishing a wafer by being sand...
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JP2012250300A |
To reduce a variation of a thickness of a wafer after polishing by reducing the abrasion of a surface caused by the polishing.This nano-bubble circulation type polishing device includes: a polishing device including a center gear, a lowe...
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JP2012532762A |
A method for preparing a suspension from a separation process, wherein the suspension is made of a particulate abrasive and a liquid slurrying agent. The method includes the steps of: a) thinning the suspension in a tank with an addition...
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JP2012245582A |
To provide a method for manufacturing cerium oxide-based abrasive from the cerium oxide-based abrasive with amorphous solids adhered thereto.The method includes a step of obtaining separated deposits containing cerium oxide-based abrasiv...
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JP5097611B2 |
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JP5091668B2 |
The invention relates to a matrix liquid for producing machining suspensions, a machining suspension produced with the matrix and a method of fractionating the used machining suspension yielded after use. The invention also relates to a ...
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JP5090191B2 |
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JP5086021B2 |
To provide a process for efficiently recovering high-quality rare earth oxide from waste grinding slurry. In a method of recovering rare earth elements, rare earth oxides are recovered from the waste grinding slurry containing rare earth...
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JP5077756B2 |
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JP5080769B2 |
An object of the present invention is to provide a polishing method and a polishing apparatus that can secure an even polished shape and can remove slurry that has contributed to polishing and contains polishing by-product to the outside...
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JP5073961B2 |
Alpha-amino acid containing chemical mechanical polishing compositions and slurries that are useful for polishing substrates including multiple layers of metals, or metals and dielectrics.
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JP2012222107A |
To provide a semiconductor manufacturing method which can polish a polishing target film at a practical polishing speed though usage of CMP slurry is reduced.A semiconductor device manufacturing method of an embodiment comprises: a proce...
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JP5057658B2 |
To provide a solid-liquid separation method for a slurry material in which secure solid-liquid separation is carried out without flowing out from a gap between processing parts even if a solid component is fine and has a hardly entwined ...
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JP5057855B2 |
To efficiently recover metal components included in sludge so as to be reutilized. The sludge 10 is prepared by blending polished sludge comprising first particles 12 discharged in a polishing stage (metal polished powder such as Ni-cont...
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JP5047503B2 |
A cyclone used in a separator apparatus includes a body and a vortex finder. The body includes an inlet passageway, a cylindrical passageway connected to the inlet passageway, and a conical passageway connected to the cylindrical passage...
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JP5034742B2 |
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JP2012521896A |
The present invention generally relates to apparatus and method for recycling both polishing slurry and rinse water from CMP processes. The present invention also relates to rheology measurements and agglomeration prevention using centri...
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JP2012178418A |
To provide an apparatus and a method for collecting a polishing agent in which a slurry obtained by condensing the polishing agent to a high concentration can be collected while suppressing increase of a pressure loss or considerable red...
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JP5025848B2 |
An apparatus, as well as a method, brings a surface of a substrate into contact with a polishing pad that has a window, causes relative motion between the substrate and the polishing pad, and directs a light beam through the window so th...
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JP5015920B2 |
Process and apparatus for completely recovering the reusable components of an abrasive slurry used in slicing crystalline materials of silicon, quartz or ceramics when it becomes exhausted and enriched with undesired waste matter. The pr...
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JP2012156550A |
To provide a chemical mechanical polishing composition including an abrasive and cesium hydroxide, and a method for polishing a dielectric layer associated with an integrated circuit using cesium hydroxide containing a polishing composit...
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JP5003294B2 |
The present invention is a slicing method and a wire saw apparatus including winding a wire around a plurality of grooved rollers and pressing the wire against an ingot to be sliced into wafers while supplying a slurry for slicing to the...
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JP4970635B2 |
The apparatus for distribution of abrasive suspension or slurry comprises a reservoir (1) in a recirculation contour (40) with pumps (5,6) and a filter (8), and a flow control system including a pressure sensor (80) and a proportional in...
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JP2012125859A |
To provide an apparatus for feeding a polishing solution which feeds the polishing solution to a polishing pad of a polishing apparatus without causing the solidification of a polishing abrasive grain.The apparatus for feeding the polish...
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JP4969313B2 |
To provide an inexpensive process of efficiently recovering rare earth oxides of high quality from waste grinding slurry containing rare earth elements. In a method of recovering rare earth elements, rare earth oxides are recovered from ...
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JP4965949B2 |
The present invention provides a slicing method comprising winding a wire around a plurality of grooved rollers and pressing the wire against an ingot to be sliced into wafers while supplying a slurry for slicing to the grooved rollers a...
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JP4958463B2 |
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JP2012106319A |
To stably supply a polishing liquid on an entire surface of a polishing pad.The polishing liquid supply device 100 includes: a liquid storage part 110 for storing the polishing liquid; a liquid replenishing part 120 for replenishing the ...
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JP4947754B2 |
A substrate for use as a disk substrate in a hard disk drive or the like, an information recording medium such as a magnetic disk, and a starting material glass plate which is a starting material of the substrate for information recordin...
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JP4945857B2 |
An object of the present invention is to provide a composition for washing a polishing pad which removes a water-insoluble compound which was separated from a surface to be polished during polishing, formed at least on the surface of a p...
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JP4943614B2 |
A composition and a method for planarizing or polishing a surface with the composition are provided. The composition comprises about 5-90 wt. % of fumed metal oxide and about 10-95 wt. % of abrasive particles, wherein about 90% or more o...
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JP4943613B2 |
A composition and a method for planarizing or polishing a surface with the composition are provided. The composition comprises a liquid carrier, a chemical accelerator, and solids comprising about 5-90 wt. % of fumed metal oxide, and abo...
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JP4936590B2 |
High through-put Cu CMP is achieved with reduced erosion and dishing by a multi-step polishing technique. Deposited Cu (13) is polished with fixed abrasive polishing pads initially at a high removal rate and subsequently at a reduced rem...
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JP4930292B2 |
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JP2012076194A |
To provide a method for economically recovering only diamond abrasive grains from the wastewater of polishing slurry used for precise polishing and containing the diamond abrasive grains, a tool used for the method, and a method for manu...
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JP2012076152A |
To provide a method capable of advantageously collecting a water-glycol based cutting medium by effectively removing odor components of water-soluble cutting waste liquid in a regeneration treatment of the cutting waste liquid discharged...
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JP4918298B2 |
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