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WO/2024/053609A1 |
The purpose of the present invention is to provide: an alkali-soluble resin able to yield a cured product having a high refractive index; a photosensitive resin composition; and a cured product. The present invention is an alkali-soluble...
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WO/2024/026668A9 |
Disclosed in the present invention are an injectable hydrogel adhesive having both fast-curing and anti-swelling properties and a use. The injectable hydrogel adhesive comprises the following components in percentage by mass: 5%-20% of t...
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WO/2024/053774A1 |
The present invention relates to a photocurable resin composition for electrode protection, and a preparation method therefor, and, specifically, to a photocurable resin composition and a preparation method therefor, the composition prot...
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WO/2024/048156A1 |
The present invention provides: a resin composition which is curable at a relatively low temperature and which has a long pot life; a cured product; and a semiconductor device and an electronic component which include the cured product.ã...
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WO/2024/046703A1 |
An anaerobically curable composition comprising: a liquid anaerobically curable component; a solid anaerobically curable component; a solid polyether polyvinyl butyral resin; and a curing component for curing the anaerobically curable co...
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WO/2024/048605A1 |
Provided are: a photosensitive resin composition comprising a polyimide precursor having a radical-polymerizable group, a photopolymerization initiator, and a compound having a coumarin skeleton; a cured product; a layered body; a method...
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WO/2024/048604A1 |
A resin composition containing a polyimide precursor that includes a repeating unit represented by formula (1-1) and that has a polymerizable group content of 2 mmol/g or more and an amide bond content of 1.5 mmol/ g or less, a polymeriz...
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WO/2024/048603A1 |
Provided are: a resin composition comprising a polyimide precursor containing a repeating unit represented by formula (2); a cured product; a laminate; a method for producing a cured product; a method for producing a laminate; a method f...
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WO/2024/043096A1 |
The purpose of the present invention is to provide: a coated medical device that is provided with lipid adhesion suppressing ability in addition to adequate hydrophilicity and slipperiness; and a simple method for manufacturing the same....
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WO/2024/038152A1 |
The invention relates to compositions comprising a constituent-A, which constituent-A consists of a polylysine component, a XL-component, and a fibrous component which fibrous component consists of at least one fibrous element which fibr...
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WO/2024/039172A1 |
Provided are a composition for encapsulating an organic light-emitting device, and an organic light-emitting device display apparatus comprising organic layers formed therefrom, the composition comprising: (A) a radiation-curable multifu...
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WO/2024/034398A1 |
Provided is a resin composition exhibiting excellent high frequency characteristics and heat resistance reliability. The resin composition comprises: (A) a polyphenylene ether resin that has, at a terminal end, a functional group includi...
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WO/2024/031542A1 |
The present application provides a modified bio-based waterborne polyurethane, a method for preparing same, and use thereof. The modified bio-based waterborne polyurethane is prepared from the following starting materials: 50-150 parts b...
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WO/2024/034683A1 |
The present invention addresses the problem of providing a novel copolymer that can be used for a drug delivery technique.　The present invention relates to a copolymer obtained by binding a target-affinity molecule to a copolymer X com...
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WO/2024/024195A1 |
Provided are a photosensitive resin composition and a photosensitive coloring composition which exhibit excellent developability and favorable low-temperature curability, and which can be used to form a cured resin film having sufficient...
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WO/2024/024657A1 |
A first problem addressed by the present invention is to provide a curable composition with which a cured film that is obtained by curing same exhibits excellent adhesiveness and exhibits excellent low-reflectivity with respect to infrar...
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WO/2024/024331A1 |
The present invention provides a resin composition which is in a liquid state at 25°C and contains (A) an epoxy resin and (B) methacrylic acid anhydride, wherein the epoxy resin (A) contains (A-1) an epoxy resin that is in a liquid stat...
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WO/2024/024494A1 |
The present invention provides a photosensitive composition that suppresses development residue and makes it possible to form a cured film that has excellent substrate adhesion. This photosensitive composition includes a resin, a coloran...
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WO/2024/024441A1 |
Provided is a silicone-containing copolymer that can reduce environmental load, and that provides an effect of suppressing generation of foreign matter attributed to sublimation of pigments on the surface of a coating film. Specifically,...
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WO/2024/019001A1 |
The present invention provides a photocurable thermally conductive composition which has excellent coatability and enables a cured product thereof to have high thermal conductivity, while achieving a good balance between high elastic mod...
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WO/2024/016079A1 |
A method of transforming a polysaccharide into a cross-linkable polysaccharide is described which comprises providing a solution comprising a solubilized polysaccharide, converting the polysaccharide into an amino-polysaccharide by repla...
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WO/2024/018941A1 |
A resin composition comprising: a resin A having an ethylenically unsaturated bond-containing group; and a compound B containing a halogen atom and an ethylenically unsaturated bond-containing group and having a molecular weight of 500 o...
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WO/2024/018984A1 |
Provided is a copolymer having excellent curability, production stability and storage stability and capable of imparting excellent solvent resistance to a cured article.　The copolymer comprises a constituent unit (A) derived from a com...
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WO/2024/018918A1 |
Provided is a resin material which is highly soluble in solvents and which nevertheless exhibits a low permittivity and a low dielectric loss tangent and has high heat resistance.　The resin material is a polyfunctional vinyl resin repr...
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WO/2024/015163A1 |
Provided herein is a two-component acrylic-epoxy adhesive composition.
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WO/2024/014298A1 |
The purpose of the present invention is to provide: an active-energy-ray-curable coating composition capable of forming a cured coating film having exceptional weather resistance, abrasion resistance, and chemical resistance; and a molde...
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WO/2024/014300A1 |
The resin composition comprises a pigment, a pigment derivative having a BET specific surface area according to the nitrogen adsorption method of 2 to 300 m2/g, a resin, and a solvent. Also provided are a method for producing a resin com...
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WO/2024/014436A1 |
Provided is a cured body having excellent low-dielectric properties, high elastic modulus at normal temperature and high temperatures, and a high cross-link density. Also provided is a varnish containing: a polymer compound that has a pl...
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WO/2024/015165A1 |
Provided herein is a two-component, thermally-conductive acrylic-epoxy adhesive composition.
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WO/2024/014053A1 |
This hard coat resin composition for an automotive exterior molding film comprises: a urethane acrylate (A) having a structure in which a pentaerythritol triacrylate is further reacted with a diisocyanate obtained by reacting an ethylene...
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WO/2024/012720A1 |
An actinic radiation and/or thermally curable composition (I) for composite material comprising: (A) at least 20 wt% of compound A comprising at least 2 ethylenically unsaturated moieties and a structural moiety; (B) at least 20 wt% of c...
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WO/2024/009612A1 |
The present invention addresses the problem of providing a curable resin that can provide a cured product having superior adhesion and thermal shock resistance, as well as a method for manufacturing an intermediate with which said curabl...
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WO/2024/010371A1 |
A resin composition according to an embodiment comprises an oligomer, a monomer, a photoinitiator, and an additive, wherein the oligomer is included in a range of 10% to 25% by weight with respect to the total of the resin composition, t...
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WO/2024/010189A1 |
The present invention relates to a (meth)acrylate-based resin, and a dry film solder resist comprising same and, specifically, to a (meth)acrylate-based resin in which generation of chlorine ions is reduced by regulating the types of a b...
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WO/2024/010069A1 |
The present invention relates to a UV-curable composition which comprises a combination of a (meth)acrylate-based curable resin composition, comprising one or more acrylate ester with 3 or more acrylate groups; and (meth)acrylate-based u...
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WO/2024/009810A1 |
A novel organopolysiloxane represented by average formula (1) can be cured rapidly by the irradiation with ultraviolet ray and can be cured satisfactorily even in a shaded part which ultraviolet ray cannot reach when a dual-curable organ...
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WO/2024/009895A1 |
The present invention provides a composition which contains metal particles and a (meth)acrylic polymer that has (meth)acryloyl groups on both ends of a poly(meth)acrylate chain.
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WO/2024/010026A1 |
The present invention provides: a resin composition which contains a solvent and at least one resin that is selected from the group consisting of a polyimide precursor, a polyimide, a polyamide-imide precursor, a polyamide-imide and a po...
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WO/2024/004390A1 |
A curable composition containing a radical polymerization initiator represented by formula (1), and a radically curable compound, a method for producing a cured product, a film, an optical element, an image sensor, a solid-state imaging ...
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WO/2024/004918A1 |
A resin composition which overcomes defects of prior-art techniques and is less odorous and excellent in terms of crack resistance in a cooling/heating cycle test, chemical resistance, and air dryability is provided without using any cop...
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WO/2024/004425A1 |
A curable composition containing a radical polymerization initiator represented by formula (1) and a radically polymerizable compound; a method for producing a cured product of the curable composition; a method for producing a cured prod...
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WO/2024/004976A1 |
A polycarbodiimide compound that is a reaction product of a polycarbodiimide (a) having isocyanate groups at both ends, obtained by polymerizing at least one selected from aliphatic diisocyanates and alicyclic diisocyanates, and a polyme...
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WO/2024/005189A1 |
Provided is a curable resin composition comprising a thermosetting alkali-soluble resin (A1) having an acid value of 55 to 100 mgKOH, a photocurable alkali-soluble resin (A2) having an acid value of 20 to 100 mgKOH/g, a (meth)acrylic mon...
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WO/2024/005195A1 |
A curable resin composition including: a heat-curable alkali-soluble resin (A1) that has an acid value of 55-100 mgKOH/g; a photocurable alkali-soluble resin (A2); a (meth)acrylic monomer (B) that has two polymerizable functional groups ...
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WO/2024/004732A1 |
This photosensitive composition comprises a coloring material, a polymerizable compound, and a photopolymerization initiator. The amount of coloring material contained in the total solid content of the photosensitive composition is 40% b...
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WO/2024/004619A1 |
An embodiment of the present invention provides: a curable composition containing a radical polymerization initiator represented by formula (1) and a radically polymerizable compound; a method for producing a cured product; a film; an op...
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WO/2024/004826A1 |
The present invention addresses the problem of providing an active energy ray-curable composition that is capable of demonstrating sufficient adhesion to a film that does not have an easy adhesion layer.　The present invention is an act...
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WO/2024/002742A1 |
The invention relates to compositions comprising silicone urethane (meth)acrylates having at least three (meth)acrylate groups and not more urethane groups than (meth)acrylate groups, methods for preparing said compositions, as well as r...
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WO/2024/004426A1 |
A curable composition containing a radical polymerization initiator represented by formula (1) and a radically polymerizable compound; a method for producing a cured product of the curable composition; a method for producing a cured prod...
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WO/2023/248976A1 |
The present invention provides: a polymer that has excellent storage stability and can yield a cured product having excellent solvent resistance even under low-temperature curing conditions; a photosensitive resin composition that contai...
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