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WO/2018/159602A1 |
The present invention provides an adhesive gas barrier film which comprises a gas barrier unit that is composed of a protective film and a gas barrier layer and an adhesive unit that is composed of an adhesive resin layer and a releasing...
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WO/2018/152062A1 |
The present invention is an adhesive composition for use in passivating metallic conductors in an electronic device including at least one low molecular weight polyisobutylene polymer having a weight average molecular weight of about 75,...
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WO/2018/151460A1 |
The present invention relates to a support and a manufacturing method for the support. The support for supporting a cosmetic material according to the present invention comprises: a first support having a first bonding surface; a second ...
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WO/2018/152164A1 |
The present invention is an adhesive composition including at least one low molecular weight polyisobutylene polymer having a weight average molecular weight of about 75,000 or lower, at least one high molecular weight polyisobutylene po...
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WO/2018/152497A1 |
An adhesive and method for injection or compression bonding, where the adhesive is based on a grafted polypropylene resin and at least one of maleimide compound, phenolic resin, blocked isocyanate, functionalized silane, or an epoxy resin.
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WO/2018/147351A1 |
A dielectric heating adhesive film for adhesion of a plurality of adherends comprising the same material or different materials, by dielectric heating. The dielectric heating adhesive film is characterized by: containing a thermoplastic ...
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WO/2018/147352A1 |
A dielectric heating adhesive film for adhesion of a plurality of adherends comprising the same material or different materials, by dielectric heating. The dielectric heating adhesive film is characterized by: containing a thermoplastic ...
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WO/2018/143373A1 |
[Problem] To provide a multilayer sheet for skin material that exhibits an excellent adhesiveness to polypropylene (PP) layers and foam PP layers and an excellent softness, an excellent scratch abrasion resistance, and an excellent oil r...
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WO/2018/142997A1 |
Provided is a water dispersion body comprising a resin component and water. The resin component comprises: composite particles (D) having an ethylene-unsaturated carboxylic acid copolymer (A) and a polymer (B) the polymer units of which ...
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WO/2018/135544A1 |
The present invention provides a laminated film with which it is possible to suitably heat weld together two or more members. This laminated film is used for bonding a first member and a second member, and is at least provided with a fir...
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WO/2018/129669A1 |
Polymer blends can be used in a multilayer structure and to multilayer structures comprising one or more layers formed from such blends. In one aspect, a polymer blend comprises (a) a copolymer comprising ethylene and at least one of acr...
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WO/2018/128557A1 |
The present invention relates to a method for producing and applying hot-melt adhesives, comprising the following steps: adding at least one polymer and one adhesion agent to a homogenizer/melter; mixing and heating the at least one poly...
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WO/2018/121656A1 |
Disclosed is a white polyolefin packaging film, which comprises the following components in terms of parts by weight: polyolefin resin A 100 parts; polyolefin resin B 20-50 parts; an organic peroxide compound initiator 0.6-2.0 parts; a c...
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WO/2018/122470A1 |
The present invention relates to an adhesive mixture, containing one or more cohesive polymers, one or more tackifiers and optionally one or more separate plasticizer, wherein at least one tackifier is selected from lignin or derivatized...
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WO/2018/118794A1 |
The present application discloses methods for using an adhesive composition comprising a polymer of the formulae A, B and C: wherein the variables are as defined herein.
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WO/2018/113455A1 |
It relates to a multi-layer film for seal-peel applications, an article comprising said film and the use of said film.
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WO/2018/114305A1 |
The present invention relates to hot melt adhesive compositions comprising ethylene vinyl acetate copolymer(s) and isothiazolinone fungicides according to formula (I). Such hot melt adhesives show improved fungus resistance and are thus ...
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WO/2018/115789A1 |
The present invention relates the use of at least one copolymer of ethylene and butyl acrylate, as defined below, as cohesive agent, in a hot-melt adhesive composition. The invention also relates to a hot-melt adhesive composition compri...
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WO/2018/116555A1 |
Provided is an adhesive which, when used as an adhesive for laminating a metal foil to a resin film, can stably exhibit satisfactory adhesiveness and can give a laminate highly excellent in terms of electrolyte resistance and heat resist...
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WO/2018/116967A1 |
This adhesive composition is characterized by containing (A) a modified polyolefin resin and (B) an epoxy compound, and is also characterized in that: the modified polyolefin resin (A) is obtained by graft modifying a polyolefin resin wi...
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WO/2018/109547A1 |
The present invention provides an adhesive resin composition to be used in the adhesion of fluorine resins, wherein the purpose of the adhesive resin composition is to bond fluorine resins to each other or to bond a fluorine resin and a ...
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WO/2018/110361A1 |
Provided are a release film having excellent heat resistance, appearance, mechanical characteristics, followability, stain resistance and release properties; and a protective film having a release layer that exhibits the aforementioned c...
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WO/2018/110771A1 |
The present invention relates to a cabin air filter for a vehicle, and presents a method for manufacturing a cabin air filter utilizing a carbon nano-material; and a cabin air filter utilizing a carbon nano-material and manufactured ther...
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WO/2018/104750A1 |
Sealants for insulated glass units or solar panels are disclosed. The sealant comprises polyisobutylene and a polymer which is a copolymer obtained from the polymerisation of at least one ethylenically-unsaturated aliphatic hydrocarbon m...
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WO/2018/099816A1 |
The present invention relates to an ethylene polymer composition for use in adhesive applications, to an article comprising the ethylene polymer composition and to a process for producing said article.
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WO/2018/100672A1 |
Provided is a hot-melt adhesive composition which is a mixture containing an α-olefin copolymer (A) that is polymerized using a multi-site catalyst, an α-olefin copolymer (B) that is polymerized using a single site catalyst, an ethylen...
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WO/2018/098431A1 |
A hot melt adhesive composition comprises a polymer blend based on a first polymer component having a low melting point and is selected from a polypropylene homopolymer and a copolymer of propylene and ethylene and mixtures thereof; a se...
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WO/2018/095744A1 |
The present invention relates to a pressure sensitive adhesive composition comprising: i) at least one butene-1 (co)polymer; ii) at least one liquid tackifier; iii) at least one solid tackifier; iv) at least one styrene copolymer; v) opt...
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WO/2018/092800A1 |
The present invention provides: an adhesive composition which contains (A) a modified polyolefin resin, (B) a multifunctional epoxy compound, (C) a curing accelerator and (D) a silane coupling agent, and which is characterized in that if...
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WO/2018/090182A1 |
Disclosed is a degradable adhesive composition. The composition consists of the following components in parts by weight: 30 - 80 parts of a degradable polymer, 3 - 9 parts of a tackifier, 10 - 20 parts of an accelerator, 6 - 15 parts of ...
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WO/2018/094236A1 |
The invention features a hot melt adhesive composition that can be applied at temperatures as low as 107°C, while maintaining excellent bonding under stress and a very fast setting time.
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WO/2018/088359A1 |
[1] A propylene polymer having a melting endotherm (ΔH-D), as measured using differential scanning calorimetry (DSC), of 0 to 80 J/g, and a viscosity, as measured using a B-type viscometer, of 500 to 6000 mPa∙s; [2] a propylene resin ...
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WO/2018/079356A1 |
Provided are: a dielectric-heating bonding film that can achieve secure bonding even when a dielectric heating treatment is short; and a bonding method that uses the dielectric-heating bonding film. A dielectric-heating bonding film that...
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WO/2018/079355A1 |
Provided are: a prescribed dielectric-heating bonding film that can achieve favorable bonding to different types of adherends even by means of a short dielectric heating treatment; and a bonding method that uses the dielectric-heating bo...
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WO/2018/079354A1 |
Provided are: a dielectric-heating bonding film that makes it possible to achieve secure joining in a relatively short time when a dielectric heating treatment is performed on adherends such as polyolefin resins; and a joining method tha...
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WO/2018/074070A1 |
One aspect of the present invention is a hot melt adhesive that comprises a thermoplastic polymer, a tackifier, and a softener, wherein the softener includes an acid-modified oil modified by at least one of carboxylic acid and carboxylic...
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WO/2018/073088A1 |
The invention relates to contact adhesive compounds containing 5 to 50 wt% copolymers of propylene having ethylene and/or having olefins, selected from the group of 1-olefins having 4 to 20 C atoms, wherein the copolymers have been produ...
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WO/2018/058219A1 |
The invention relates to a process for treating dregs for use as an activator of rubber vulcanization, thus lending a purpose to this residue generated by the cellulose industry, and providing vulcanized rubbers with properties that are ...
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WO/2018/062182A1 |
Provided is a modified polyolefin resin which exhibits excellent adhesion to a nonpolar substrate such as a polyolefin substrate, while having excellent stability in an alcohol solvent. With respect to this modified polyolefin resin, a p...
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WO/2018/056493A1 |
The present invention relates to a polypropylene composite film and, more specifically, to a polypropylene composite film adhering to a phenol resin lamination plate of an aluminum electrolytic capacitor, the film comprising: an outer la...
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WO/2018/056776A2 |
The present application relates to an adhesive composition and an organic electronic device including the same, and provides an adhesive composition and an organic electronic device including the same, the adhesive composition being capa...
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WO/2018/053802A1 |
Disclosed herein are adhesive compositions comprising : (a) a continuous insulating binder phase, (b) a plurality of conductive particles, (c) a first particulate non-conductive phase formed of a plurality of insulating particles, and (d...
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WO/2018/047422A1 |
Provided is a gas barrier laminate having a structure wherein a gas barrier layer and an adhesive layer are directly laminated, said gas barrier layer including a polymer compound and having been modified. An adhesive composition being a...
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WO/2018/047868A1 |
An adhesive composition containing a modified polyolefin resin (A) and a polyfunctional epoxy compound (B) and whereby a sheet-shaped object formed from said adhesive composition fulfills requirements (I) and (II). ・Requirement (I): Th...
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WO/2018/047920A1 |
Provided is an adhesive composition containing a component (A) being a modified polyolefin resin and a component (B) being a polyfunctional epoxy compound, said adhesive composition being characterized by having no more than 20 mg of out...
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WO/2018/047473A1 |
A polyacetal resin-nitrile rubber composite wherein, on a blasted surface of a polyacetal resin molded article, an undercoating adhesive layer formed of an undercoating adhesive, said undercoating adhesive comprising (a) poly(para-vinyl ...
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WO/2018/047919A1 |
Provided is an adhesive composition containing a component (A) being a modified polyolefin resin and a component (B) being a polyfunctional epoxy compound, said adhesive composition being characterized by having a storage elastic modulus...
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WO/2018/042995A1 |
[Problem] To provide: a resin composition that has exceptional adhesiveness with respect to bare copper, can maintain adhesiveness with respect to bare copper even when exposed to a high-temperature, high-humidity environment for an exte...
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WO/2018/040952A1 |
Disclosed are a modified white graphene-compounded butyl sealant for hollow glass and a sealing method therefor. The modified white graphene-compounded butyl sealant contains: a basic sealant and an auxiliary. The basic sealant comprises...
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WO/2018/043586A1 |
Provided is a chloroprene rubber latex adhesive composition which exhibits excellent initial adhesive strength and normal adhesive strength, and exhibits excellent thermal creep resistance with respect to an adherend. This chloroprene ru...
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