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JP7149293B2 |
Solvent-based adhesive composition are disclosed, the compositions comprising (A) a polyester-urethane resin, (B) an epoxy-terminated polyester compound, (C) a phosphoric acid, and (D) an aliphatic isocyanate curing agent. Methods for pr...
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JP7144030B2 |
To provide a manufacturing method of a laminate panel capable of being applied to a panel having no water absorption, and capable of manufacturing a beautiful laminate panel without generating irregularity on the panel at good efficiency...
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JP2022134674A |
To provide a moisture-curing type adhesive composition that contains an organic polymer having a hydrolyzable silyl group and is a curable composition excellent in colorless transparency.A moisture-curing type adhesive composition includ...
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JP2022132809A |
To provide a curable resin composition which has good curability and can give a cured product showing high strength.A curable resin composition contains a polyoxyalkylene-based polymer (A) having a reactive silyl group of formula (1), a ...
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JP2022132810A |
To provide a curable resin composition which can give a cured product showing high strength.A curable resin composition contains a polyoxyalkylene-based polymer (A) having a reactive silyl group and a branch structure, and a polysilsesqu...
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JP2022129376A |
To provide a method for bonding a first thermoplastic substrate and a second thermoplastic substrate.Each of substrates 210, 220 has a first melting temperature. In order to form a first co-bonded structure 217, a first semi-crystalline ...
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JP2022538528A |
Novel crosslinkers and curable compositions comprising such crosslinkers are provided. Bonded constructions comprising the disclosed curable compositions exhibit high adhesion, elongation, and impact resistance even when the bonding subs...
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JP2022121248A |
To provide an adhesive composition that has low dielectric constants and high storage stability, a laminate film having a cured layer of the adhesive composition, and a printed wiring board including the laminate film.An adhesive composi...
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JP7120498B1 |
[PROBLEMS] To provide an adhesive composition excellent in heat resistance, adhesive strength, low relative permittivity and dielectric loss tangent, and excellent dielectric properties, and an adhesive sheet, laminate, and printed wirin...
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JP7120497B1 |
[PROBLEMS] To provide an adhesive composition excellent in heat resistance, adhesive strength, low relative permittivity and dielectric loss tangent, and excellent dielectric properties, and an adhesive sheet, laminate, and printed wirin...
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JP7115120B2 |
To provide a photosensitive adhesive composition that can be bonded at low temperature.A photosensitive adhesive composition for film formation has a polymer containing a cyclic olefin-derived structural unit in a molecule, a photosensit...
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JP7115196B2 |
To provide a bonded joint structure that is produced by joining a metal member and another member with an adhesive, and has excellent adhesion durability, and an automobile component including the bonded joint structure.A bonded joint st...
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JP7112997B2 |
To provide an electronic device package tape that can reduce the peeling of an adhesive layer from an electronic device when the adhesive layer is cured and can be attached well to a ring frame.An electronic device package tape according...
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JP7104336B2 |
Conventionally, a photocurable composition to which an ultraviolet absorber is added is difficult to form a colorless and transparent cured resin because the ultraviolet absorber itself is colored, and thus the photocurable composition i...
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JP2022532377A |
The present invention relates to radiation or radiation / moisture double curable compositions based on (meth) acrylate polymers or (meth) acrylate-terminated and silane-terminated polymers. The present invention further relates to their...
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JP7099791B2 |
An adhesive article is described comprising a foamed adhesive layer and a non-foamed adhesive layer. The adhesive of each adhesive layer comprises a tetrahydrofurfuryl (meth)acrylate copolymer; an epoxy resin; a polyether polyol; and opt...
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JP7095133B2 |
The present invention relates to an adhesive film comprising a composition including a binder resin, an epoxy resin and a filler. Provided are an adhesive film, an adhesive film-attached laminate including the same, and a metal thin film...
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JP2022083241A |
To provide a curable composition that has low viscosity and high workability, is quickly curable, and also excels in the mechanical properties of its cured product, adhesiveness to a substrate, and heat resistance, and provide an adhesiv...
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JP2022075060A |
To provide a curable composition excellent in adhesive force, flexibility, and weather resistance.The curable composition contains (A) a (meth)acrylate copolymer having 0-1.2 crosslinkable silyl groups per molecule, (B) a polyoxyalkylene...
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JP7066350B2 |
To provide an underfill insulating film suitable for a gang bonding process, which can solve problems such as poor conduction and occurrence of voids in the gang bonding process.There is provided an underfill insulating film for a gang b...
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JP7061783B2 |
To provide an adhesive composition high in curing rate, exhibiting required adhesive strength by curing by a deep part in short time, capable of forming a cured article excellent in water resistance.The adhesive composition contains 100 ...
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JP7060483B2 |
To provide a tape for an electronic device package which reduces peeling of an adhesive layer from an electronic device when a metal layer is stuck to the electronic device via the adhesive layer and the adhesive layer is cured.A tape 1 ...
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JP2022523392A |
The moisture-curable composition, as well as the coating method and the substrate containing it, are disclosed herein. In some embodiments, the curable composition comprises a component (A) containing an organic polymer containing a reac...
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JP7042986B1 |
An adhesive composition containing an epoxy resin (A), an epoxy resin curing agent (B), a phenoxy resin (C), and an inorganic filler (D), wherein the phenoxy resin (C) has elasticity at 25 ° C. The ratio is 500 MPa or more, and the rati...
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JP2022046049A |
To provide a hot-melt composition having excellent coating suitability, capable of forming an extendable member with extensibility, stretch recoverability, and stress sustainability when extended at high temperature.Provided is a hot-mel...
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JP2022043966A |
To provide an adhesive between circuit board layers which has a comparatively low dielectric constant and is excellent in adhesion and unevenness followability, and a laminate obtained using the adhesive between the circuit board layers....
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JP2022034707A |
To provide an organic polymer having a specific reactive group, a method for efficiently producing the organic polymer, and a resin composition containing the organic polymer.A method for producing an organic polymer (A) having an alleny...
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JP2022031739A |
To provide an adhesive sheet for devices that gives a cured product having low dielectric properties in a high frequency region, and has a curable adhesive layer having excellent adhesive suitability.Provided is an adhesive sheet for dev...
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JP7022800B1 |
To provide an adhesive composition having both workability and cold / heat impact resistance. An adhesive containing a poly (meth) acrylic polymer (A) having a reactive silyl group, an oxyalkylene polymer (B) having a reactive silyl grou...
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JP7014397B2 |
To provide a curable composition which has low viscosity and is excellent in workability before curing, can strongly bond and integrate a flooring material onto a metal sheet such as a floor substrate material over a long period of time ...
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JP7003910B2 |
Provided is an actinic-ray-curable adhesive composition which has excellent adhesive force, is suitable for use in laminating any of various protective films for polarizers to a polarizing element, and is excellent in terms of curability...
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JP2022027097A |
To provide a polarization film having an adhesive layer, equipped with an adhesive layer capable of maintaining reworkability after preheating even if adhered onto a conductive layer while having durability under a high temperature envir...
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JP7014236B2 |
The objective of the present invention is to provide a radical-curable adhesive, which is an adhesive composition capable of maintaining sufficient adhesion reliability even under conditions at a lower temperature for a shorter period of...
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JP7013638B2 |
To provide an adhesive composition which is excellent in storage stability and can be cured at a relatively low temperature in a short time.The adhesive composition contains an onium salt represented by general formula (1) and a cationic...
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JP7012794B2 |
A curable composition comprising a tetrahydrofurfuryl (meth)acrylate copolymer; an epoxy resin component; a liquid polyether polyol; a hydroxy-functional film-forming polymer; and a cationic photoinitiator. An adhesive article comprising...
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JP2022019608A |
To provide an aqueous dispersion that finely and stably contains polyphenylene ether resin in aqueous medium and forms a coating layer to exhibit a variety of excellent properties.An aqueous dispersion contains a polyphenylene ether resi...
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JP7011656B2 |
A one component epoxy adhesive composition is comprised of an epoxy resin, a polyurethane based toughener, an epoxy capped toughener comprised of a polymer backbone capped with an epoxy, wherein the polymer backbone is at least partially...
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JP2022013755A |
To provide a tile construction method enhancing bonded-tile durability to vibration and linear expansion of a construction surface, and excellent in stain resistance of an adhesive layer.A tile construction method comprises bonding a til...
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JPWO2020170908A1 |
A agent containing a polyoxyalkylene polymer (A) having a reactive silicon group, a (meth) acrylic acid ester polymer having a reactive silicon group (B), and an epoxy resin curing agent (D). , An epoxy resin (C), and a multi-component c...
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JP6980153B2 |
Provided is an adhesive sheet for devices, having a curable adhesive layer comprising component (A) and component (B), and having a component (A) content of at least 3.0 mass% in the curable adhesive layer. The adhesive sheet for devices...
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JP2021185610A |
To provide a tape for an electronic device package which reduces peeling of an adhesive layer from an electronic device when a metal layer is stuck to the electronic device via the adhesive layer and the adhesive layer is cured.A tape 1 ...
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JP6977747B2 |
To provide a curable composition capable of adding higher hardness than prior art and capable of adding excellent hardness similar to prior art and higher elongation than prior art to cured article after curing, and an oxyalkylene polyme...
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JP2021183657A |
To provide a curable composition enabling formation of a cured object excellent in water proof adhesive property while maintaining handleability and flexibility of a modified silicone curable composition.A curable composition contains: a...
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JP2021184086A |
To provide a manufacturing method for an optical laminate and a manufacturing apparatus for an optical laminate, by which the temperature unevenness in a width direction on a surface or a roll can be reduced and the problem of the qualit...
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JP2021184085A |
To provide a manufacturing method for an optical laminate and a manufacturing apparatus for an optical laminate, by which the temperature unevenness in a width direction on a surface or a roll can be reduced and the problem of the qualit...
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JP6971846B2 |
The present invention provides a sheet having an elastomer layer having a Shore A hardness of less than 40, wherein the elastomer layer has an adhesion force to stainless steel of not more than 11 oz/in at 90 degree peel strength.
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JP6967171B2 |
A curable adhesive sheet for a device, having an adhesive layer containing component (A) and component (B). The curable adhesive sheet for a device has an adhesive sheet provides a cured material having excellent low-dielectric character...
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JP6967999B2 |
To provide an adhesive composition classified as a modified silicone adhesive, exhibiting efficient adhesiveness to hardly adhering plastic, and having suppressed increase of viscosity with time.There is provided an adhesive composition ...
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JP2021527739A |
The present invention relates to a supported catalyst having usefulness in the polymerization and copolymerization of epoxide monomers, and the supported catalyst is described by the general formula (I) :.[In the formula, [DMCC] represen...
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JP2021161429A |
To provide a curable composition exhibiting an excellent anti-fouling effect over a long period of time after curing.A curable composition includes: a polymer (I) having a hydrolyzable silyl group, including a polyalkylene oxide (A) havi...
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