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JP2023097194A |
To provide a method for manufacturing an automobile door which has short joint process time and long open time, has a transparent member and a support, and has high joint strength between both of the members, and an automobile door which...
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JP2023097104A |
To provide a method for manufacturing a side step for a vehicle which has short joint process time and long open time, on the condition that the side step has a metal member and a resin member and joint strength of both of the members is...
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JP2023096956A |
To provide a method for manufacturing a pillar for an automobile vehicle body that enables easy manufacture and is lightweight, which has short joint process time and long open time.A method for manufacturing a pillar for an automobile v...
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JP2023096924A |
To provide a method for producing a radiator, which can produce easily a lightweight radiator, particularly by shortening the time of a bonding process and extending the open time.A method for producing a radiator includes a pre-bonding ...
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JP2023096973A |
To shorten joint process time, and extend open time, in manufacture of a cross member for a roof that can be easily manufactured and is lightweight.A method for manufacturing a cross member for a roof includes a pre-joint step of prepari...
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JP2023096713A |
To provide a method for manufacturing an on-vehicle motor which has short joint process time and long open time on the condition that excellent air permeability and excellent heat dissipation property can be achieved.A method for manufac...
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JP2023086476A |
To provide an adhesive film for circuit connection which improves a conductive particle capturing rate between opposite electrodes of a circuit connection structure, and can reduce connection resistance of the circuit connection structur...
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JP2023525559A |
[Solution] The present disclosure relates to oxamates and formulations made therefrom, and methods of making both oxamates and formulations. [Selection figure] None
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JP2023082957A |
To provide an adhesive composition for a vulcanized rubber which is excellent in adhesiveness.The adhesive composition for a vulcanized rubber contains: an organic polymer having an alkoxysilyl group; an epoxy resin having an aromatic hy...
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JP2023081074A |
To provide a polarizing plate with a retardation layer, which offers superior high-temperature durability.A polarizing plate with a retardation layer according to an embodiment of the present invention comprises a polarizing plate includ...
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JP7288807B2 |
A water-based temporary fixing adhesive having excellent temporary fixing performance, coating performance and adhesion-stain prevention performance and containing (A) a hydroxy group-having thermoplastic resin and (B) a glucide, wherein...
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JP7286569B2 |
To provide a thermosetting resin composition, a thermosetting adhesive and a thermosetting resin film which are excellent in adhesion to a metallic foil, have high Tg and low dielectric characteristics, and are excellent in compatibility...
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JP7285247B2 |
Provided are: a reactive silicon group-containing polymer that provides a cured product having a low modulus, flexibility, and excellent tensile strength, despite having a plurality of reactive silicon groups introduced to the terminal t...
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JP7282034B2 |
Thermally-conductive gap fillers are described. The gap fillers comprise an aziridino-functional polyether polymer and thermally conductive particles. Initiators suitable for such systems ae also described. Such gap fillers may be used i...
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JP7282204B2 |
The present disclosure relates generally to the field of adhesives, more specifically to the field of structural adhesive tapes, in particular for use in bonding metal parts. The present disclosure also relates to a method of bonding two...
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JP7277796B2 |
The purpose of the present invention is to provide a thermally conductive moisture-curable resin composition which develops excellent thermal conductivity and peelability after curing.The thermally conductive moisture-curable resin compo...
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JP7276245B2 |
To provide a room temperature-curable organopolysiloxane composition having excellent adhesiveness, water-resistant adhesiveness and usability with respect to engineering plastics (nylon 66, polybutylene telephthalate, polyphenylene sulf...
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JP7273283B2 |
The adhesive composition according to the present invention, which is capable of realizing low-temperature quick-curing properties, conductive properties, shelf life properties, and adhesive strength that are practical not only for COG m...
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JP7267107B2 |
The present invention provides: a water-based temporary adhesive agent which comprises a thermoplastic resin having at least (A) a hydroxyl group and has both excellent temporary adhesion performance, excellent application performance, a...
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JP2023518075A |
A method of connecting a first part (2) to a second part (3), comprising: a) providing a contact surface (4) of said first part (2) with a multiplicity of nanowires (1); b) applying an adhesive (6) to the contact surface (4) of the first...
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JP7265038B2 |
A curable perfluoropolyether adhesive composition containing the following components (A) to (C): (A) 100 parts by mass of a linear perfluoropolyether compound having at least two alkenyl groups per molecule and having a perfluoropolyeth...
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JP2023517322A |
1) A moisture-curable silylated composition comprising 35-65% by weight of a polymer (A) comprising at least two alkoxysilyl end groups of formula (I); , (In the formula, R1represents a hydrocarbon divalent group containing 5 to 15 carbo...
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JP7261787B2 |
Provided is a curable composition in which a cured product after curing has high strength, high rigidity, and flexibility, and a cured product obtained by curing the curable composition. A multi-pack curable composition including an A ag...
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JP7256022B2 |
Provided is a thermosetting adhesive including: a polyurethane; an isocyanate; an epoxy; and a phenoxy resin, in which dynamic viscoelasticity spectrum of a cured product has a peak indicating a softening temperature in an area of 200 °...
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JP7249998B2 |
Provided are a reactive silicon group-containing polymer and a curable composition containing said polymer, that: provide a cured product having a low modulus, flexibility, and excellent tensile strength, tensile elongation, and tear str...
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JP7246313B2 |
Provided are: a curable composition of which a cured product after being cured has high strength, high rigidity and flexibility; and a cured product obtained by curing said composition. The present invention provides a multi-pack type cu...
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JP7239470B2 |
A self-adhesive article comprises an adhesive layer comprising a crosslinked adhesive composition, which comprises at least one polysilylated polymer having a number-average molar mass (Mn) of at least 20000 g/mol, wherein the at least o...
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JP7238099B2 |
This invention provides a material having a low dissipation factor that is suitable for use as an insulating material for a printed wiring board and the like; a resin composition used for the production of the material; and an applicatio...
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JP7226636B2 |
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JP7224138B2 |
An object of the present invention is to provide a technique suitable for achieving low wiring resistance and reducing a variation in the resistance value between semiconductor elements to be multilayered in a method of manufacturing a s...
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JP7221278B2 |
An adhesive composition, including at least polymer containing silane groups, between 15 and 35 wt.-% of at least one polymeric plasiticzer, between 0.5 and 2.5 wt.-% of at least one monomeric or oligomeric aminofunctional alkoxysilane S...
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JP2023020498A |
To provide: a novel phosphorus compound having a triazine ring; a synthesis method for the phosphorus compound; a flame retardant containing the phosphorus compound; and a resin composition containing the phosphorus compound and a resin ...
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JP2023020775A |
To provide: a novel phosphorus compound having an isocyanurate ring; a flame retardant containing the phosphorus compound; a resin composition containing the phosphorus compound and a resin component; and uses thereof.The present inventi...
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JP2023020499A |
To provide a novel phosphorus compound having a triazine ring that can be used in a flame retardant and the like.The present invention pertains to a phosphorus compound having a triazine ring represented by chemical formula (I) (R2 is a ...
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JP7211715B2 |
To provide a curable resin composition that has excellent flow characteristics before curing, and has excellent adhesiveness, heat resistance, and flex resistance after curing; and provide a cured product of the curable resin composition...
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JP2023009597A |
To provide a curable composition having low viscosity and good strength and stretchability which can afford a cured product having a high modulus.There is provided a curable composition which comprises a polymer A and a polymer B, wherei...
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JP2023007423A |
To provide a curable composition for spray coating having excellent depth curability and spray coatability.A curable composition for spray coating contains a polymer having a hydrolyzable silyl group (A) of 100 pts.mass, a plasticizer (B...
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JP2023000498A |
To develop an adhesive for a flexible copper-clad laminate that provides FCCL with excellent dimensional stability without copper foil breakage or wrinkles while achieving both properties comparable to those of the casting method 2-layer...
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JP7196841B2 |
An adhesive for semiconductors, which contains a thermoplastic resin having a glass transition temperature of 35°C or less.
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JP2022182481A |
To provide a mass transfer method for a micro-optical device excellent in laser transfer performance.A mass transfer method for a micro-optical device includes: a fixed film formation step which applies onto a transparent substrate a tem...
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JP2022182451A |
To provide a composition for temporary fixation excellent in heat resistance, laser beam absorbency and adhesion.A composition for temporary fixation is to be used for forming a temporary fixation film that separates a temporarily fixed ...
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JP7179279B2 |
To provide a curable composition having excellent environmental hygiene during use, having low viscosity and high thixotropy (high thixotropic properties) and having excellent coatability and adhesive strength without emitting a solvent ...
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JP7172990B2 |
The present invention provides an adhesive composition containing: an anionic polymerizable or cationic polymerizable epoxy resin or oxetane resin; a first silane compound having a functional group that reacts with the epoxy resin or oxe...
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JP7173250B2 |
To provide an adhesive composition which is excellent in storage stability and can be cured at a relatively low temperature in a short time.The adhesive composition contains an onium salt represented by general formula (1) and a cationic...
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JP7169698B2 |
To provide a high-water-resistance and low-modulus single-component MS sealant and a preparation method thereof.The single-component MS sealant contains 20-50 pts.wt. of a base MS resin, 20-50 pts.wt. of a plasticizer, 50-150 pts.wt. of ...
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JP7164645B2 |
Provided are: an adhesive film formed of a composition for an adhesive film comprising a binder resin, an epoxy resin, and a filler; a laminate with an adhesive film attached thereto comprising the same; and a metal clad laminate compris...
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JP7158854B2 |
Adhesive compositions are described that significantly improve the adhesion of polymer overmold compositions to metal substrates in polymer-metal junctions. The adhesive compositions include one or more poly(aryl ether) polymers, where e...
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JP2022157565A |
To provide a polymerizable composition from which a cured product excellent in moist heat resistance can be produced.The polymerizable composition contains a phosphorus-based antioxidant (A), a cationically polymerizable compound (B), an...
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JP2022153321A |
To provide a polyester-based adhesive composition which is excellent in reworkability in initial bonding, exhibits high adhesive force by heating after bonding and is excellent in adhesion reliability, is further excellent in optical cha...
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JP2022153322A |
To provide a polyester-based adhesive composition which is excellent in initial adhesive force, optical characteristics and moisture heat whitening resistance under high temperature and high humidity.A polyester-based adhesive compositio...
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