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JP2009084307A |
To provide an adhesive for connecting electrodes, having improved repairability and heat resistance, and also having improved connection reliability of a flexible printed circuit board with a rigid substrate, for example, when the flexib...
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JP2009073987A |
To provide a high dielectric resin composition that can more easily introduce into a printed wiring board a high dielectric insulation layer in a form of adhesive film by a vacuum laminator, and allows formation of a plating conductor la...
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JP4250792B2 |
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JP4251807B2 |
To provide such an adhesive sheet for manufacturing a semiconductor device that can prevent both wire bonding failure and mold flushing, and reduce the abnormality of a semiconductor device when the adhesive sheet is used for manufacturi...
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JP2009068004A |
To provide a film adhesive having both of process characteristics such as suitability to filling into an adherend, low-temperature laminating property and pickup property after dicing and characteristics which contribute toward improving...
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JP2009068003A |
To provide a film adhesive having both of process characteristics such as suitability to filling (embedding) into an adherend, low-temperature laminating property and pickup property after dicing and characteristics which contribute towa...
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JP2009062522A |
To settle the problem that, in some cases, the conventional polarizing plate does not exhibit sufficient hot water resistance.A water-based adhesive comprising a polyamine epihalohydrin resin, a polyamidopolyamine epihalohydrin resin and...
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JP2009062506A |
To provide a method for coating the surface of a body to be coated, a coating agent prepared by carbodiimide-modifying a maleic anhydride-modified amorphous polypropylene resin by using a polycarbodiimide-based resin containing a carbodi...
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JPWO2007029609A1 |
The present invention is a heat-resistant adhesive sheet that improves the variation in dimensional stability of flexible printed circuit boards, in particular, two-layer flexible printed circuit boards that are required to have higher h...
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JP4238671B2 |
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JP4240711B2 |
To provide a method for manufacturing an adhesive film for die bonding, where the loss of film material is small, and there is also no problem of dislocation, and an adhesive layer of equal thickness can be provided, and moreover which c...
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JP4235808B2 |
An adhesive composition is provided comprising (A) a polyimide resin containing a diorganopolysiloxane linkage having vinyl groups as organic substituent groups on the backbone, (B) an epoxy resin, and (C) an epoxy resin-curing catalyst....
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JP4236148B2 |
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JP4237726B2 |
An adhesive sheet with a base for flexible printed wiring boards is provided, which has advantages of easiness of machining, excellent moldability, high rigidity and preventing the fall of resin dust particles during machining of a multi...
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JP2009045821A |
To provide a method for producing an adhesive film which has exponentially high productivity as compared with a conventional method.In the method for producing the adhesive film, a thermoplastic polyimide layer is stacked on at least one...
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JP2009045820A |
To provide a method for producing an adhesive film which has high productivity as compared with a conventional method.The multilayer film of a polyimide precursor solution is obtained by casting-applying a solution (A) containing at leas...
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JP2009046629A |
To provide an adhesive composition having process characteristics such as filling property (embedding property) to an adherend and low-temperature laminating property, and reliability in a semiconductor device such as reflow-proof, as we...
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JP4231511B2 |
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JP4228400B2 |
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JPWO2007018120A1 |
The present invention is an adhesive film containing (A) a polyimide resin and (B) a thermosetting resin, wherein the (A) polyimide resin contains a polyimide resin having a repeating unit represented by the following formula (I). The pr...
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JP4225325B2 |
To provide a siloxane polyimide soluble in an ordinary organic solvent, and showing distinguished heat-resistant adhesiveness when used as a main component of an adhesive for bonding a base material and a copper foil of a flexible printe...
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JP2009029982A |
To provide a flame-retardant adhesive resin composition that can be subjected to thermocompression bonding at a lower temperature compared to a conventional polyimide adhesive without impairing excellent heat resistance and electric char...
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JP4224185B2 |
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JP4220079B2 |
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JP4219660B2 |
In a wafer dicing/die bonding sheet comprising a backing member, an adhesive layer, and a protective member, the adhesive layer is made of an adhesive composition comprising a phenolic hydroxyl radical-bearing polyimide resin, an epoxy r...
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JP2009021562A |
To provide an adhesive sheet for semiconductor capable of reducing a deficit such as a fracture, crack, and peeling-off during dicing even if cutting speed is high, and of reducing contamination due to cutting powder.The adhesive sheet f...
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JP2009019171A |
To provide a die bonding paste having improved adhesiveness in a hot state, which can not be conventionally achieved, having little change with time in a high temperature state, having excellent heat resistance and durability and giving ...
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JP4213998B2 |
To provide a polyimide-based adhesive resin composition which is excellent in low temperature adhesion, heat resistance and low moisture absorption and also in hygroscopic reflow resistance; a film adhesive comprising the above resin com...
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JP4212793B2 |
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JP2009007580A |
To provide a polyamideimide resin showing a high glass transition temperature without respect to a value of modulus.This polyamideimide resin, which has an organosiloxane skeleton, is obtained by reaction between a diimide-dicarbonic aci...
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JP2009007551A |
To provide a resin varnish which can realize an adhesive layer-coated metal foil which can form an adhesive layer with very few spots even when applied to a lowly roughened foil and can form a printed wiring board capable of fully reduci...
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JP4206685B2 |
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JP2009001793A |
To provide an adhesive using a resin composition achieving bonding at a relatively low temperature, having excellent heat resistance, adhesion to a polyimide and solder heat resistance.The adhesive using the resin composition achieving b...
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JP4206371B2 |
This invention is to provide an adhesive composition not only ameliorating its excessive flowability under light irradiation but also excellent in physical properties including dimensional stability, heat resistance and adhesive force, a...
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JP2008308539A |
To provide an adhesive composition that exhibits antistatic effects and can prevent bleeding-out of an electroconductive polymer.The adhesive composition comprises an acrylic adhesive (A) and an electroconductive polymer (B) subjected to...
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JP2008308551A |
To provide a polyimide resin with high transparency useful as a circuit material, excellent in warpage-proof property, soluble in an organic solvent of a low boiling point and capable of being imidized at a low temperature, and a polyami...
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JP2008308618A |
To provide an adhesive composition providing a cured product having a low modulus and excellent adhesiveness, and to provide an adhesive film having the adhesive layer.The adhesive composition comprises (A) 100 pts.mass of a polyimide re...
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JP2008308552A |
To provide an adhesive composition having excellent gap-filling properties, and providing a cured product having a low modulus and excellent adhesiveness, and to provide an adhesive film having an adhesive layer comprising the compositio...
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JP4200376B2 |
A flexible metal foil-polyimide laminate is prepared by joining a polyimide film to a metal foil via an intervening adhesive layer. The adhesive is a mixture of polyamic acids: (A) the reaction product of 3,4,3',4'-biphenyltetracarboxyli...
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JPWO2006115258A1 |
The present invention provides a polyimide film that suppresses dimensional changes due to thermal stress, particularly a polyimide film having a function of suppressing thermal strain applied to a material when a metal layer and a polyi...
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JP2008303372A |
To provide a polyimide having excellent processability, that is, having organic solvent solubility and thermoplasticity and having both high glass transition temperature and high toughness, and is useful as e.g., a resin for an adhesive ...
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JP2008303254A |
To provide a pressure-sensitive adhesive composition forming an adhesive layer excellent in initial adhesiveness (tackiness), adhesive strength to a base material, heat resistance, wet heat resistance, transparency and antistatic perform...
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JP2008545019A |
A composition comprises a first curable resin composition that includes at least one aromatic epoxy resin in combination with a solvent, a functionalized colloidal silica dispersion, and at least one other component selected from the gro...
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JP4195590B2 |
To provide a bonding sheet which can sufficiently improve all properties of adhesion, heat resistance, bending resistance and processability, can enhance versatility and can be suitably used as a wiring material or part in various types ...
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JP2008274074A |
To obtain an easily adhesive polyester film having excellent adhesiveness to a rubber and adhesion durability and a laminate that is obtained by laminating the rubber to the easily adhesive polyester film and has excellent elasticity and...
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JP2008277802A |
To provide an adhesive film for semiconductor which can be easily peeled at a room temperature after sealing while having enough adhesion properties to a lead frame, and to provide a lead frame using it and a semiconductor device.The adh...
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JP2008274210A |
To provide an adhesive film for circuit boards preferable as a build-up layer for semiconductor chip-mounting substrates suitable for miniaturizing electronic appliances.The adhesive film for circuit boards is prepared by forming a resin...
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JP2008274180A |
To obtain an easily adhesive polyester film having excellent adhesiveness to rubber and adhesion durability and a laminate that is obtained by laminating rubber to the easily adhesive polyester film and has excellent elasticity, sealabil...
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JP2008274269A |
To provide a photosensitive adhesive composition capable of obtaining a high adhesive strength when it is hot, and also capable of obtaining superior alkali developing property.The photosensitive adhesive composition comprises a polyimid...
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JP4178934B2 |
To commercially provide a heat resistant laminate film which scantly curls while sufficing properties such as heat resistance, insulation reliability, adhesion and a metal layered laminate using the same as well as to provide a highly re...
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