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JP4180292B2 |
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JP4175060B2 |
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JP2008260860A |
To provide an adhesive composition which can reduce formaldehyde on a production and on an adhesion treatment to improve a work environment and can improve long time heat resistance on the adhesion of organic fibers to a rubber.This adhe...
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JP4174274B2 |
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JP4172179B2 |
To obtain a resin composition as an adhesive having high heat resistance sufficiently resistant to lead free soldering for providing a highly heat resistant copper-clad laminate and a printed-circuit board and provide an adhesive film us...
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JP4171898B2 |
A dicing/die bonding adhesion tape includes a substrate, a silicone adhesive layer, and a bonding layer. A tack strength of 0.2-2.0 N/25 mm is developed between the silicone adhesive layer and the bonding layer. The bonding layer is form...
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JP4174248B2 |
To provide a new polyimide resin having excellent heat resistance and solubility in a solvent, a resin composition containing the resin, a covering material for electronic parts which meets heat resistance, formability of a covering laye...
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JP4169978B2 |
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JP4168368B2 |
To provide an adhesive sheet acting as a dicing tape in a dicing process and having excellent connection reliability in a connecting process between a semiconductor element and a supporting member, wherein the adhesive sheet has heat res...
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JP2008248042A |
To provide a halogen-free hot-melt adhesive having excellent flame retardance and a high modulus of elasticity and to provide a flat cable comprising the hot-melt adhesive as an adhesive layer and thereby having high flame retardance and...
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JP2008248114A |
To provide an adhesive composition having a good following property with a fine pattern on a substrate plate and capable of becoming a cured material without having a void.This adhesive composition is provided by containing (A) an epoxy ...
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JP2008248227A |
To provide an amine-epoxy curing agent composition in which the pot life is long and the aqueous emulsion or dispersion is stabilized.The curing agent composition comprises the reaction product of alkylated polyalkyleneamine compound and...
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JP2008239694A |
To ensure the sliding properties of an adhesive film while reducing the content of inorganic particles as an anti-blocking agent to be added in the adhesive film.The adhesive film is provided with an adhesive layer containing a thermopla...
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JP2008239802A |
To provide a photosensitive adhesive composition capable of exerting a sufficiently high adhesive strength and sufficiently suppressing formation of voids between substrates (adherend members) when used as an adhesive for bonding the sub...
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JP4163433B2 |
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JP2008229866A |
To provide a heat-resistant adhesive film which is useful, for example, for DAF: a die-attachment film which can materialize a semiconductor package high in durability.In the adhesive film, a polyamideimide resin layer (layer a) wherein ...
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JP4155193B2 |
The present invention provides a non-flammable heat-resistant resin composition that is provided with (A) modified polyamideimide resin, (B) thermosetting resin and (C) organic phosphor-based compound, and a cured film, obtained from the...
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JP4150011B2 |
To provide a polyimide adhesive composition which excels in insulating properties and heat resistance, improves high temperature adhesion properties, and excels in adhesion properties to a coating layer of mutually different materials fo...
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JP4146684B2 |
To obtain a heat-resistant adhesive resin composition improved in low moisture absorption and low-temperature adhesive properties and a film adhesive using the same. The adhesive resin composition comprises (A) a thermoplastic polyimide ...
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JP2008202016A |
To provide an adhesive for a rubber composite that exhibits a high adhesive force between a polyester film and a rubber, is excellent in durability of the adhesive force and can produce a laminate excellent in moldability and to provide ...
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JP4145640B2 |
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JP2008195852A |
To provide an adhesive composition exhibiting high adhesive strength despite of a radical curing system and having stable performance even after reliability test (e.g., a sample is allowed to stand at 85C/85%RH) and further having wide c...
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JP2008189935A |
To provide an adhesive film having low elastic modulus and flexibility and a method for producing the adhesive film.The adhesive film is obtained by using a semi-aromatic polyamideimide resin obtained by reacting a diimidodicarboxylic ac...
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JP4134607B2 |
In a heat exchanger having tubes and fins, a polyaniline film made of polyaniline and/or a derivative thereof is formed on the surfaces of the tubes and the fins. This polyaniline film is imparted with at least one hydrophilic functional...
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JPWO2006082814A1 |
While maintaining the inherent heat resistance, mechanical strength, chemical resistance, and molding characteristics (process characteristics) of polyimide, it has better electrical characteristics (low dielectric properties), gas perme...
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JP4125505B2 |
To provide a sheet for cleaning a carrying system of various kinds of substrate treatment apparatuses and an exposure mask (reticle) in fine processing, and a cleaning method using the same. A cleaning sheet is formed by providing an adh...
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JP4122568B2 |
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JP2008161939A |
To provide a process which can dimensionally repair a metallic detail part joined to a substrate positioned below, without degrading the bonding function and also without thermally damaging the substrate during repairing the metallic det...
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JP4118089B2 |
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JP4120156B2 |
To obtain a die bonding material having good adhesion when heated as an adhesive material of a support member of an electronic component such as a semiconductor element or the like, a lead frame, an insulating support board or the like, ...
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JP4117140B2 |
A hardening type reactive particles which contain a carbodiimide compound in such a way to have the reactive performance the carbodiimide group inherently has only in the surface layer section or both surface layer section and inside of ...
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JP4116869B2 |
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JPWO2006082828A1 |
Only the film flow direction (MD direction) and the film crossing direction (TD direction) were regarded as important for the dimensional change of the flexible metal-clad laminate, but as the wiring became finer, not only the MD / TD di...
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JP2008521747A |
Formulation comprising a polymerizable monomer and/or a polymer and, dispersed therein, a superparamagnetic powder, which comprises aggregated primary particles, the primary particles being built up from magnetic metal oxide domains havi...
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JP4106491B2 |
A method for manufacturing a creped fiber web is provided and includes providing a rotating cylindrical dryer surface, applying an ionene adhesive to the rotating cylindrical dryer surface to form an adhesive dryer surface, conveying a f...
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JP2008138124A |
To provide an adhesive composition providing a cured material having a low elastic modulus and excellent in adhesiveness, and an adhesive film equipped with the adhesive layer.The adhesive composition contains (A) 100 pts.mass polyimide ...
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JP4102051B2 |
To provide a conductor layer/polyimide film/adhesive laminate suitable for manufacturing a multilayered printed wiring board having high heat resis tance, a narrow pitch wiring pattern, small diameter viaholes, uniform insulating layer t...
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JP4097454B2 |
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JP4097451B2 |
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JP4096227B2 |
To provide a polymer electrolyte film molded by a simple film forming process and exhibiting a high ion conductivity while suppressing the swelling of the film under a high temperature and high humidity condition by incorporating a small...
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JP2008124141A |
To provide an adhesive film for dicing/die bond having a low-temperature thermocompression bonding nature to a wafer and a highly reliable chip taking-out nature.This adhesive film for dicing/die bond comprises a pressure sensitive adhes...
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JP2008124296A |
To provide a semiconductor device made of a chip which exhibits wafer reinforcement effects during a manufacturing process, is excellent in handleability, exhibits stable mounting characteristics during a mounting process, and exhibits h...
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JP2008118069A |
To provide a semiconductor device consisting of a chip, which has a wafer reinforcing effect and excellent handling ability in the production process, shows stable mounting properties in the mounting process, and has high reliability in ...
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JP2008112972A |
To provide resin paste for die bonding for easily supplying/applying a semiconductor chip by a print method to a substrate to which a semiconductor chip should be attached at a relatively low temperature, and for achieving the following ...
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JPWO2006033267A1 |
The present invention provides a polyimide film having a function of suppressing thermal strain applied to a material, particularly when a metal layer and a polyimide film are laminated by a laminating method, an adhesive film using the ...
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JP2008094865A |
To provide a film-shaped adhesive having a modulus reduced for reducing warp of which the problem comes to the fore and has arisen from the thinning of a chip and a board, providing a reduced stress generated at junction of a semiconduct...
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JP2008094967A |
To provide a non-halogen/non-phosphorus flame-retardant adhesive film for a printed circuit board, which enables pressure-bonding at 250C and is excellent in heat resistance, solder heat resistance after moisture absorption, processabili...
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JP4075581B2 |
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JP4075409B2 |
To provide an adhesive film which can conductively connect electrodes in response to higher density and higher preciseness without using conductive particles having been used and can correspond to the irregular heights of the electrodes,...
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JP4077621B2 |
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