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JP2007227950A |
To provide a lead frame with an adhesive film for semiconductor which can adhere at a low temperature, in a semiconductor device. The adhesive film for semiconductor has a three-layer structure consisting of a support film with a glass t...
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JP2007224258A |
To provide an acrylic pressure-sensitive adhesive composition with high resistance to heat, particularly high fixing properties to a polyolefin or a cyclic polyolefin under high temperature atmosphere, and further excellent in the resist...
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JP3968835B2 |
To obtain a siloxane polyimide soluble in usual organic solvents and excellent in heat resistant adhesiveness when used as a main ingredient in an adhesive for instantaneously adhering a base material of a flexible print board to a coppe...
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JP2007522672A |
An assembly of a semiconductor die attached to a substrate is made with a composition comprising compounds that contain an oxazoline functionality and an electron acceptor or an electron donor functionality. Electron donor functionalitie...
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JP3950560B2 |
To obtain the adhesive having excellent heat resistance, formability of adhesive layer and low-temperature adhesiveness by making the adhesive include plural specific polyimide resins having different glass transition temperatures (Tg) a...
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JP3948491B2 |
[Problems] To provided an adhesive composition for semiconductor that permits handling without an occurrence of cracking or peeling off even when being flexed, that at the time of laminating, permits laminating on the electrode side of a...
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JP2007177031A |
To obtain a polyimide film having improved heat shrinkability and enhanced adhesiveness.The polyimide film having low heat shrinkage/high adhesiveness comprises 3,4'-diaminodiphenyl ether, 4,4'-diaminodiphenyl ether and pyromellitic dian...
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JP2007177030A |
To provide a polyimide film which has improved heat shrinkability and improved adhesiveness.This polyimide film produced by applying an electrical discharge treatment to a polyimide film formed from 3,4'-diaminodiphenyl ether, 4,4'-diami...
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JP2007173338A |
To provide an adhesive sheet and a method of its use, capable of highly reliably sticking a heating body and a heat dissipation member in a short time by strong adhesive force while securing electric insulation.A thermally conductive adh...
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JP3931387B2 |
To obtain the subject composition useful for a bonding agent excellent in solvent solubility, etc., optical member utilizing its colorless transparency, and e.g. electrode binder for nonaqueous electrolyte secondary cells utilizing its c...
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JP2007138058A |
To provide a highly adhesive polyimide film, especially a polyimide film which shows an improved adhesion to a copper foil and is excellent in dimensional stability and water wettability, and a method for manufacturing the same.The highl...
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JP2007138095A |
To provide a resin composition excellent in mechanical strength, low thermal expansion and heat resistance, and also having sufficient high-frequency property and capable of maintaining the high-frequency property with time, and to provi...
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JP2007138059A |
To provide a highly adhesive polyimide film which shows an improved adhesion to a copper foil and is excellent in dimensional stability and water wettability, and a method for manufacturing the same.The highly adhesive polyimide film is ...
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JP2007131747A |
To provide an adhesive composition having excellent adhesiveness, water and heat resistances, especially the adhesive composition suitable as an adhesive composition for paper or woodworking.The adhesive composition comprises an aqueous ...
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JP3923120B2 |
To obtain an adhesive resin composition for printed wiring boards, processable under thermo-compressing bonding conditions at a relatively low temperature and excellent in heat resistance, hygroscopic solder heat resistance, processabili...
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JP2007126579A |
To provide an adhesive for a lactone ring-containing polymer capable of firmly bonding the lactone ring-containing polymer to other thermoplastic resins and base materials other than the thermoplastic resins, and a laminated product usin...
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JP3918519B2 |
To prepare an adhesive sheet working as a dicing tape in a dicing step and working as an adhesive sheet having excellent connecting reliability in a connecting step for connecting semiconductor elements with a support. The adhesive sheet...
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JP2007119661A |
To provide a polyamide adhesive sheet utilized for flexible print circuit boards having excellent heat resistance, chemical resistance, dimensional stability, electrical characteristics, etc.The polyamide adhesive sheet having a three-la...
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JP3911776B2 |
To improve the thermal stress relaxation effect for an adhesion force and the balance of reflow resistance property by combining a resin with amide group and/or imide group with a thermosetting resin. A board for connecting semiconductor...
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JP2007091947A |
To provide an adhesive film meeting the recent demand for producing a flexible metal-clad laminated board having small dimensional change not only in MD/TD directions but also in diagonal directions deviated from MD in right and left sid...
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JP2007088501A |
To provide a thick film bonding member ensuring good stress relaxation and a package height in a μBGA structure, and to provide a bonding member ensuring good chip lamination nature and good wire bondability in an stacked CSP.The bondin...
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JP2007077308A |
To provide a new polyimide resin which has high solubility in organic solvents and high mechanical heat resistance, to provide a heat-resistant resin laminated film containing the polyimide resin and having high adhesiveness and high sol...
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JP3896597B2 |
PURPOSE: To obtain a vinyl chloride plastisol applicable to a woody material at low temperatures by adding a tackifier comprising a polyamine compound having a specified molecular weight and a specified amine value to a composition mainl...
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JP2007067245A |
To provide a film-like interconnect line tape which is low in restoration stress in the state of bent, and can be stuck to a semiconductor member such as a chip or the like even at relatively low temperature.The film-like interconnect li...
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JP3893085B2 |
To provide an adhesive for electronic parts enabling bonding and curable at relatively low temperatures and having sufficient heat resistance and reliability, etc., and to provide an adhesive tape for electronic parts using the same. The...
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JP2007056201A |
To provide a resin film with an adhesive thereon that uses an aromatic polyamide film and is excellent in adhesive properties.The resin film with an adhesive thereon has an adhesive layer laminated on at least one side of the resin film,...
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JP2007055853A |
To provide a method of manufacturing a ceramic composite member which is bonded with an adhesive layer being even and free of a bubble, superior in adhesive strength at a high temperature of 200°C or higher, can be suitably used as memb...
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JP2007056167A |
To obtain an adhesive film that has low-temperature laminating properties of wafer back, high-temperature adhesiveness and reflow resistance.The adhesive composition has an adhesive layer comprising a resin composition composed of (A) a ...
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JP2007051272A |
To obtain a conductive adhesive that has high heat resistance and excellent adhesivity to metal.The conductive adhesive comprises an organic-inorganic hybrid resin or an ultrahigh molecular weight polyamide as a base. The organic-inorgan...
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JP3885896B2 |
To obtain an adhesive composition, capable of giving a bonded part which has high reliability and is easily repaired with a widely used solvent, and to obtain a connection member. This adhesive composition is composed of a cyanate ester ...
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JP2007039511A |
To provide a method for producing an adhesive film, by which the non-tacky multilayer film prepared by forming a thermoplastic polyimide layer on at least one side of a heat-resistant polyimide layer can suitably be produced.This method ...
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JP2007019151A |
To provide a tape for processing wafers which is used for a dicing step wherein a wafer is cut and divided, and which is applicable for even a case when it is difficult to punch the wafer into a precut shape.The tape for processing a waf...
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JP3871828B2 |
To obtain a die attach paste which can be cured within a short time by mixing an isocyanuric acid ethylene oxide-modified di or tri-acrylate with a monoacrylate or the like, a phosphoric group-containing acrylate or the like, an alicycli...
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JP3871268B2 |
The present invention provides a magnetic core whose outer surface has been coated without handling brittle ribbon to thereby impart insulating properties and shape retention properties to the magnetic core after annealing heat treatment...
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JP3869482B2 |
To obtain a water-dispersed mold release composition having excellent storage stability and develops excellent mold release properties by short-time heating by dispersing a mold release component obtained by reacting an amino polyamine c...
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JP3865046B2 |
To obtain a polyimide silicone resin composition substantially containing no solvent and, therefore, capable of eliminating a process of solvent removal and giving high adhesiveness to base materials of various shapes, using a (meth)acry...
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JP2006346521A |
To provide a method where, even in the case of varnish in which resin is precipitated in accordance with the moisture-adsorption of a solvent, a resin layer can be stably formed on a base material film with stable thickness precision.A s...
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JP3862004B2 |
To obtain a heat-resistant resin composition which not only particularly excels in heat resistance but also exhibits excellent properties in drying characteristics, film formability, electrical properties, and the like, compared to the c...
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JP3860395B2 |
To provide an adhesion assistant effective for a multilayered composite capable of keeping the adhesion of layers over a long time in the contact with a reagent at high temp. and capable of being produced inexpensively and simply. A ther...
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JP2006335789A |
To provide a polyimide resin composition having excellent processability, adhesiveness and heat resistance.The polyimide resin composition comprises a polyimide obtained by polymerizing an acid component with a diamine component and an i...
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JP2006328407A |
To provide a polyimide film having sufficiently excellent characteristics such as a sufficiently high elastic modulus, low coefficient of linear expansion, low water absorption, low coefficient of moisture-absorption expansion, low coeff...
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JP2006321930A |
To provide a double-sided adhesive film functioning as a film-like spacer in place of a dummy chip.The adhesive film for a stack type semiconductor package has a three-layer structure in which resin layers containing a thermosetting resi...
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JP3850106B2 |
To obtain a recording medium having excellent traveling durability and high volumetric recording density by constituting a nonmagnetic base of an arom. polyamide resin and forming a primer coating layer consisting of a polyamide imide re...
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JP3852488B2 |
To obtian an adhesive composition, essentially comprising specific plural kinds of resins, a latent curing agent and a specified nitrogen-containing compound, capable of carrying out the low-temperature connection of high- density electr...
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JP2006316232A |
To provide an adhesive film having a thermoplastic polyimide layer formed on at least one surface of a high heat-resistance polyimide layer and having little stickiness, and to provide a process for suitably producing the adhesive film.T...
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JP2006306007A |
To meet the requirements that a flexible printed wiring board requires finer wiring, high density mounting and flexibility along with reduction in size and higher performance of an electronic instrument and furtehr requires a halogen-fre...
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JP2006299261A |
To provide die attachment adhesives with improved stress performance capability comprising a resin capable of being cured by free-radical polymerization, a free radical curing agent, and an epoxy compound or resin with a vinyl or allyl u...
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JP2006297942A |
To provide a panel which can be made into single side, double side or multilayer PWB with high circuit density and rapid transmission of high-frequency signals.A film of polyimidebenzoxazole (PIBO), which has an electrically conductive l...
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JP3839887B2 |
To prepare an adhesive tape which can be stuck at relatively low temps., can insulate without fail, and has sufficient heat resistance and reliability by forming polyimide-contg. adhesive resin layers on both sides of a polyimide- contg....
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JP2006295064A |
To provide an adhesive film for a semiconductor which has high adhesive properties to a lead frame which is subjected to a surface process such as an organic film coating, etc. , and can simply be peeled off from the lead frame and a sea...
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