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JP2006290983A |
To provide a carbodiimide-modified aromatic polymer adhesive by which the reduction of bonding force between a polar resin and an aromatic polymer is suppressed; and to provide a layered product comprising the polymer composition and hav...
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JP2006291150A |
To provide a double layered FPC which is improved in reliability and yield and also is improved in dimensional stability when heated.The heat resistant adhesive sheet is prepared with a heat resistant adhesive agent layer containing a th...
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JP3837858B2 |
To provide an adhesive having high heat conductivity and high electric conductivity by including conductive spherical silver powder having the maximum particle size and the average particle size not more than a specific value, an expoxy ...
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JP2006282973A |
To provide an adhesive film which exhibits good adhesiveness at a low temperature and good good wire bonding property in combination.The adhesive film is an adhesive film used for adhering a semiconductor device to a body to be adhered, ...
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JP2006523760A |
Thermally conductive, sinterable, adhesive compositions, free of fugitive solvents, that include a powder of a relatively high melting point metal or metal alloy, a powder of a relatively low melting point metal or metal alloy powder and...
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JP2006274116A |
To obtain a radiation-proof adhesive composition that is excellently user friendly and is simply used for bonding and a radiation-proof adhesive composition provided with conductivity and to provide a radiation apparatus using the radiat...
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JP3826334B2 |
To obtain an epoxy resin composition having excellent slump-free characteristics, improved slump resistance when subjected to a mechanical stress, and good slump resistance after a longer post-mixing time by blending an epoxy resin, a th...
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JP2006249223A |
To provide a primer composition capable of exhibiting excellent adhesivity to nylon, polycarbonate and other various substrates.This primer composition comprises a urethane prepolymer and/or a thermoplastic polyurethane, an epoxy resin, ...
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JP3822967B2 |
To provide a heater capable of easily, quickly, equally, regularly fitting to a being-heated body even in the being-heated body whose both ends are connected to a device and having almost no degree of freedom, independent of the size of ...
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JP2006241174A |
To provide a film-formed adhesive capable of sufficiently filling the recessed parts of the surface of a supporting member by heating on the transfer molding of a sealing agent on being used as the die-bonding material in the production ...
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JP3821252B2 |
To suppress the reduction of the heat resistance of a solder caused by a highly multilayered wiring board, by using a bonding agent having a softening point of a specific temperature range in a B stage state and made of a polyamideimide ...
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JP3817320B2 |
To provide a pressure fixed paper for ink jet in which superior ink coloring properties are demonstrated when printing is applied on a confidential face by an ink jet printer, good resistance to water is provided and the printing on the ...
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JP3817326B2 |
To provide a production process whereby an adhesive tape for electronic parts comprising at least two adhesive layers formed at a low temp. can be produced at a low cost with a min. coating apparatus and a common press laminator even whe...
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JP3815840B2 |
To obtain an adhesive composition having adhesiveness at room temperature and very excellent in electrical characteristics, by using as the adhesive component a fluoroelastomer made by treating a fluoroelastomer with an alkali to form an...
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JP3815912B2 |
To provide a tape for LOC(lead-on-chip) having satisfactory handling and punching abilities. This tape is constituted, by slitting a polyimide film with adhesive agent provided with adhesive agents on both sides of an aromatic polyimide ...
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JP3810800B2 |
Controlled molecular weight imide oligomers and co-oligomers containing pendent phenylethynyl groups (PEPIs) and endcapped with nonreactive or phenylethynyl groups have been prepared by the cyclodehydration of the precursor amide acid ol...
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JP2006199871A |
To provide an adhesive film which can be resisted to a soft soldering and reflow under strict conditions of moisture and can be well used as a flexible printed circuit (FPC) board while keeping an adhesion with the adhesive film and a me...
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JP2006193576A |
To provide a polyimide resin composition having excellent processability, adhesiveness and heat resistance.This polyimide resin composition comprises a polyimide obtained by reacting an acid component with a diamine component, and an iso...
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JPWO2004111148A1 |
INDUSTRIAL APPLICABILITY According to the present invention, a protective tape for an ultra-thin wafer or a dicing tape to be bonded can be laminated on the back surface of the wafer at a temperature lower than the softening temperature,...
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JP2006190717A |
To provide a substrate suitable for a semiconductor integrated circuit which uses flying leads.In the substrate for the semiconductor integrated circuit, a metal layer 1, an adhesive layer 2, an insulating film 3, and an adhesive layer 4...
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JP3798839B2 |
To provide a high-frequency induction heat bonding method which enables bonding between a metal and a metal, a ceramic or a highly heat- resistant resin to be conducted in a short time with good thermal efficiency by sandwiching a heat-r...
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JP2006182942A |
To provide a film adhesive excellent in minute workability, and having low temperature adhesiveness, and heat resistance.This adhesive film contains 100 parts per weight heat resistant resin (a), and 20-100 parts per weight curing epoxy ...
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JP3789546B2 |
To obtain a heat-resistant adhesive comprising a specific polyamide and a silane coupling agent, capable of bonding at a low temperature, excellent in adhesiveness, wetting property and reflow crack resistance and useful for films having...
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JP3789969B2 |
To obtain a homogeneously reinforced thin sheet-like adhesive composite material contg. a large amt. of a reinforcement by causing an adhesive resin and a particulate filler to be contained in voids of a nonwoven porous polymer substrate...
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JP2006159785A |
To provide a manufacturing method of a multilayer film which enables a self-supporting film to be easily removed from a support while ensuring adhesion between a high heat-resistant polyimide and a thermoplastic poyimide of the multilaye...
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JP2006160957A |
To obtain an adhesive film that has slipperiness and is useful as an FPC substrate even in producing a dense circuit pattern.The adhesive film has a highly heat-resistant polyimide layer and a thermoplastic polyimide-containing adhesive ...
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JP2006161038A |
To provide a film adhesive excellent in low temperature adhesion and burying property and having a function as a die bonding film suitable for use in a semiconductor package, and to provide a film adhesive having the function as the die ...
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JP2006165045A |
To provide an adhesive sheet by which dicing and die-bonding processes can be performed stably in a semiconductor manufacturing process.The sheet for dicing and die-bonding of a semiconductor wafer comprises (1) a base film 1, (2) a stic...
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JP2006144022A |
To provide a filmy adhesive for a wafer back sticking method which can deal with a very thin wafer, and an adhesive sheet formed by sticking together the filmy adhesive and a UV-type dicing tape.The filmy adhesive is formed by containing...
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JP3777732B2 |
To enable improvement in workability, adhesiveness, insulating reliability and durability, by incorporating respectively at least one type of thermoplastic rein and cyanate ester resin as essential components of an adhesive composition. ...
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JP3779334B2 |
PURPOSE: To improve heat resistance and adhesive force by incorporating a thermoplastic resin obtained by reacting a given thermo-plastic resin and a coupling agent. CONSTITUTION: An aromatic diamine and/or bisphenol is polycondensed wit...
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JP3777021B2 |
To obtain a low-stress low-temperature adhesive film which can be desirably used in die bonding not only for 42 alloy lead frames but also for copper lead frames and can be desirably used for insulating supporting bases by using a polyim...
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JP2006124700A |
To provide a polyimide composition which prevents cohesive failure of a film and has improved adhesive strength between a copper foil pattern and a cover lay and improved adhesive strength between a substrate to be protected and a polyim...
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JP2006117945A |
To provide a method for producing a polyimide resin which is used for adhesive films having excellent low temperature adhesiveness, low hygroscopicity, and the like, and further having high adhesive force, when heated, and excellent PCT ...
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JP2006117949A |
To provide a die bonding material for an electronic component and its support element which has a good adhesiveness in a high temperature and a good resistance against high temperature soldering and is excellent in low stress property an...
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JP3772913B2 |
PURPOSE: To provide an adhesive capable of solving change in dimensions of adhesive due to curing shrinkage which has been a problem in a conventional epoxy resin-based adhesive, excellent in adhesiveness and heat resistance, having smal...
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JP2006110772A |
To provide a method for efficiently manufacturing an adhesive film causing no ply separation and having a good shape by a coextrusion-cast coating method and a chemical curing method.The manufacturing method of a multilayered film having...
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JP3771269B2 |
A multi-ply paper product wherein the plies are adhesively joined together is disclosed. One or both of the plies may have embossments protruding towards and contacting the other ply. The plies are adhesively joined, preferably at such e...
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JP2006096825A |
To provide a polyimide resin which can obtain the sufficiently low modulus of elasticity with keeping the well heat resistance and insulating property and besides which can obtain the well adhesiveness to a ceramic substrate and an organ...
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JP3765331B2 |
To provide a low-stress filmy adhesive in which stress hardly builds up during adhesion and which is useful for an adhesive member of a large-sized semiconductor chip. A filmy adhesive (A) comprises an adhesive layer contg. 100 pts.wt. a...
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JP2006083263A |
To obtain a thermoplastic adhesive composition that has excellent adhesiveness to a plastic film and a metal, excellent hydrolytic resistance and film forming properties.The thermoplastic adhesive composition comprises (A) a crystalline ...
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JP2006070176A |
To provide a highly fire retardant halogen-free composition which does not emit toxic gases such as hydrogen bromide upon combustion and has a sufficient bending life, when used at high temperatures.The fire retardant adhesive compositio...
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JP3752372B2 |
To obtain an adhesive polyimide film of which deffectives (burr) occurring in a punching step is greatly reduced by specifying the thicknesses of the core layer and adhesive layers of an adhesive film comprising a core layer and adhesive...
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JP2006057108A |
To provide an essentially colorless, transparent polyimide film useful for optical fibers and thermal protective coatings.The polyimide film comprises preparing a polyamic acid solution by reacting an acid component with a diamine compon...
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JP3751054B2 |
An adhesive polyimide composition comprises 100 weight parts of a polyimide siloxane having a Tg of not lower than 200 DEG C. and 0.2 to 5 weight parts of a silane coupling agent having a glycidyl group. An epoxy resin may be incorporate...
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JP2006052244A |
To provide a 2-pot type curable aqueous adhesive excellent in initial bonding strength, continuous bonding strength, durable bonding strength and preservation stability and also having less discoloration over time of its bonded layer, an...
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JP2006506476A |
Chemically inert pressure sensitive adhesives having improved adhesion to polar and semipolar substrates, as well as to the manufacture and use thereof, especially for manufacturing pressure sensitive adhesive tapes possessing high initi...
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JP2006052389A |
To provide an adhesive film capable of providing a flexible metal-clad laminate in which occurrence of a dimensional change is suppressed when prepared by a laminate method and a flexible metal-clad laminate obtained by laminating a meta...
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JP2006045322A |
To provide an adhesive composition which excels in processability and flexibility and can improve heat resistance and adhesiveness.The adhesive composition comprises (A) a modified polyamideimide resin obtained by copolymerizing (a) an a...
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JP2006045388A |
To provide an insulating adhesive sheet, which can suitably be applied for producing a printed wiring board, having low linear expansion, preventing inorganic fillers from projecting out of the circuit formation surface, and having excel...
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