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JP4075801B2 |
An adhesive sheet comprising a pressure−sensitive adhesive layer and a substrate layer, wherein the strength of adhesion between the pressure−sensitive adhesive layer and the substrate layer is controlled by means of irradiation with...
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JP4075580B2 |
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JP4076324B2 |
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JP2008081577A |
To provide an adhesive sheet excellent in planarity and uniformity and slight in residual solvent volatilization when undergoing processing and/or using at high temperatures, to provide a metal-laminated sheet obtained by laminating the ...
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JP2008081623A |
To provide a polyimide precursor resin composition which uses a polyimide precursor excellent in storage stability and high in transmittance for electromagnetic waves to a short wavelength region and can be used as a highly sensitive pho...
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JP4071958B2 |
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JPWO2005113696A1 |
To provide an adhesive tape which acts as a dicing tape in a dicing process and has excellent dicing property and pick-up property, and provides an adhesive tape having excellent connection reliability in a bonding process between a semi...
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JPWO2005111165A1 |
The present invention is to provide a method for producing an adhesive film having dramatically higher productivity than conventional methods. The present invention is a method for producing an adhesive film by laminating an adhesive lay...
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JP4067388B2 |
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JP4067869B2 |
This invention relates to a siloxane-modified polyimide resin which shows excellent adhesiveness and can be bonded by thermocompression at high temperature even after subjection to thermal hysteresis in the manufacturing step for electro...
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JP4063950B2 |
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JP4062941B2 |
To provide an adhesive to be applied to the rear side of a wafer for thermo-compression bonding without generating cracks with only a slight a warp even when the thickness of the wafer is equal to or less than 300 μm, having a wide rang...
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JP2008507404A |
Adhesive polymers are formed when polyvalent azides and alkynes are assembled into crosslinked polymer networks by copper-catalyzed 1,3-dipolar cycloaddition. The condensation polymerization is efficiently promoted by Cu ions either leac...
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JP2008506013A |
A method for preparation of a sulfonic and or sulfonic acid salt containing polyimide resins comprising melt reaction of a polyimide resin with an organic compound, wherein the organic compound contains at least one aliphatic primary ami...
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JP4054062B2 |
Thermosetting polymers with high temperature capability and superior oxidative stability for composite and adhesive applications are disclosed. These polymers are ideally suited for adhesives and RTM, resin film infusion, and prepreg met...
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JP2008038084A |
To provide an adhesive sheet excellent in flatness and homogeneity and slight in the volatilization of polymer-derived decomposition products when undergoing high-temperature processing or services, to provide a metal-laminated sheet wit...
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JP4048550B2 |
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JP2008503626A |
Curing agent for epoxy resins, consisting of A) 1%-99% by weight of an adduct obtainable by reacting a1) a poly-ethylene polyamine having up to six nitrogens in the molecule with a2) a monoglycidyl ether, the adduct of a1) and a2) prefer...
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JP2008021858A |
To provide adhesive giving an adhesion layer superior in low temperature thermo-compression bonding property and superior in reliability, and to provide an adhesive film provided with the adhesion layer for dicing/die bonding.The film is...
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JP4038838B2 |
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JP2008013772A |
To provide a curable composition containing a liquid maleimide compound and a maleimide compound.The new thermosetting resin composition does not need a solvent for giving a system having viscosity suitable for easy handling. The composi...
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JP4038177B2 |
The present invention relates to a polyimide copolymer used in a precursor of heat resistant adhesive and methods for preparing the same, and more particularly, to a polyamic acid copolymer and methods for preparing the same obtained by ...
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JP4033909B2 |
In accordance with the present invention, there are provided novel compositions based on a defined maleimide moiety. Invention compositions have excellent moisture resistance (and, hence are much less prone to give rise to "popcorning"),...
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JP4026386B2 |
Provided are polyimide and a thin film thereof which have a three-dimensional structure and therefore are excellent in a mechanical strength and a heat resistance as compared with those of conventional linear polyimide. The polyimide is ...
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JP4024033B2 |
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JP4017532B2 |
To provide an excellent contact bonding post card paper sheet for inkjet recording in which basic adhesive characteristics as a contact bonding post card paper sheet are satisfied, and dispersion condition of an adhesive for the contact ...
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JP4017029B2 |
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JP4013092B2 |
To obtain an adhesive film showing good adhesion at low temperatures by mixing a thermosetting resin and a filler with a polyimide resin obtained by reaction of a tetracarboxylic acid anhydride on a diamine. A tetracarboxylic acid dianhy...
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JP4013091B2 |
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JP2007533817A |
Method for making lignocellulosic composites by adhering lignocellulosic substrates together. A first variant of the method involves using an adhesive composition that comprises a reaction product of (i) first ingredient selected from a ...
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JP4012206B2 |
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JP2007284671A |
To provide an adhesive film having fillability to irregularities of insulation substrates after heating in a large number of die bond processes, wire bond processes and the like in a stacked package, and resistant to soldering heat treat...
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JP3999032B2 |
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JP2007277522A |
To provide an electroconductive adhesive film having electrical conductivity and adhesive strength when heated, to provide an adhesive sheet using the same and to provide a semiconductor device. The electroconductive adhesive film is cha...
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JP3994696B2 |
An aromatic polyimide film of polyimide composed of a 3,3',4,4'-biphenyltetracarboxylic acid component and a p-phenylenediamine component, which has a thickness of 35 to 55 mum and is employed for manufacturing a polyimide film/metal fil...
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JP3997421B2 |
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JP3995022B2 |
[Problems] To provided an adhesive composition for semiconductor that permits handling without an occurrence of cracking or peeling off even when being flexed, that at the time of laminating, permits laminating on the electrode side of a...
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JP3993905B2 |
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JP3991218B2 |
A conductive adhesive composition is obtained by mixing a binder resin with 30-98 wt % based on the adhesive composition of a silver powder as a conductive agent. The silver powder contains a silver powder consisting of flat primary part...
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JP3994498B2 |
To provide a die bonding method for semiconductor elements having adhesive applicable on a wafer over a wide range of temperatures without causing great warpage of the wafer, and also to provide a method for manufacturing a semiconductor...
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JP3994298B2 |
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JP3988058B2 |
To obtain an adhesive member for improving wire-bonding work, esp. a heat-resistant adhesive suitable for a lead-fixing tape, by using a copolymer produced by reacting a tetracarboxylic dianhydride, a diamine or a diisocyanate, and a pol...
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JP3988482B2 |
To provide an adhesive for various printed-wiring boards which is halogen-free, has excellent flame retardance and excellent adhesion due to the stress relaxation action, a flame-retardant and heat-resistant resin composition useful for ...
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JP2007254719A |
To provide a base material for thermal adhesion having excellent properties in both flame retardance and adhesion, which is excellent in flexibility and shape-forming property to a mold, which has excellent adhesion and capable of being ...
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JP2007254530A |
To provide a laminated adhesive sheet which has heat resistance and flexibility at higher levels, has a low linear expansion coefficient and adhesiveness in specific ranges, and enables to achieve lightening (thinning). This laminated ad...
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JP2007238652A |
To solve a problem in which adhesiveness between a metal plate and an organic polymer layer is insufficient in a metal surface pretreatment method without using hexavalent chromium and the method is inferior to practicality, though a lam...
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JP3979792B2 |
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JP3979607B2 |
A film of polyimidebenzoxazole (PIBO) having an electrically conductive layer adhered to at least one face thereto, wherein the PIBO film has a tensile strength greater than 200 MPa. A printed wiring board having at least one dielectric ...
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JP3978628B2 |
To provide a low-temperature adhesive film for die bonding. This film comprises 100 pts.wt. polyimide resin (A) obtained by reacting a tetracarboxylic dianhydride containing at least 30 mol.%, based on the total tetracarboxylic dianhydri...
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JP2007231217A |
To provide an adhesive film replaceable with a die attach paste. The invention relates to the adhesive film which is used for protection of semiconductor elements in a quad flat non-lead package, having double layered structure comprisin...
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