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JP4518370B2 |
A support structure for supporting a ceramic susceptor in a chamber is provided. The support structure includes a supporting portion joined with a back face of the ceramic susceptor. The supporting portion includes an inner space that is...
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JP4520154B2 |
A gypsum dryer/calciner includes a calcining space; a first pipe having an inlet connected to a source of hot gases and an outlet emerging in the calcining space; a second pipe having an inlet connected to a source of gypsum and an outle...
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JP4510393B2 |
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JP4496356B2 |
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JP4497798B2 |
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JP2010144939A |
To provide a circulation type substrate burning furnace capable of reducing a heat loss and obtaining a stable burning temperature. By blowing out hot air to the inside of a furnace body 10, the burning processing of a glass substrate W ...
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JP2010144956A |
To efficiently heat even a reactant with a low wavelength absorption factor from a visible area to a near-infrared area. A furnace body 10 housing a reactant 12 is provided so that sunlight 7 collected by a light collector 13 is radiated...
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JP2010143964A |
To provide a carbonization apparatus which can prevent a distillation gas from leaking from a carbonization furnace by a simple structure. The carbonization apparatus has the carbonization furnace 21 to which a mixture is supplied, a con...
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JP2010139132A |
To solve problems of leak, clogging, etc., caused by adhesion of exhaust gas components to a valve by not installing the valve to an exhaust pipe for exhausting gas generated from a treated object; to prevent increase in flow resistance,...
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JP4486885B2 |
A reactor chamber is positioned between a top array of LED heat lamps and a bottom array of LED heat lamps. The LED heat lamps forming the top and bottom arrays are individually or controllable in groups such that power output along each...
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JP4488155B2 |
A method and for heat-treating at least one material being processed (3) under a specific process-gas atmosphere (111) of at least one process gas (4) with the aid of a heat-treatment unit (6). The heat-treatment unit has at least one en...
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JP4488682B2 |
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JP2010133651A |
To provide a furnace truck for eliminating influence on a furnace temperature by suppressing wrapping-around of a high-temperature gas while protecting a lower section of a truck. This furnace truck includes the truck 4 for loading and c...
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JP2010121822A |
To easily store and take out a treated object in a short time in a hot isostatic pressure device of a structure in which a cover section of heat insulated structure, is applied as an upper cover for a pressure container by a connecting m...
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JP4474239B2 |
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JP2010106351A |
To provide a treatment method which reduces a container portion that must be removed after the treatment, and also solves problems occurring due to thermal stress in a cooling stage and residual stress in service, when diffusion-bonding ...
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JP3159266U |
To provide a degreasing furnace capable of significantly reducing power consumption and suppressing a high-temperature exhaust gas emission amount. A degreasing furnace 1 is discharged from a degreasing furnace main body 10 for performin...
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JP4450624B2 |
An apparatus for heat treating semiconductor wafers is disclosed. The apparatus includes a heating device which contains an assembly linear lamps for emitting light energy onto a wafer. The linear lamps can be placed in various configura...
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JP4439513B2 |
A dropping model electrostatic levitation furnace which puts a charged sample in levitation state by an electric field generated between electrodes and subjects the sample to heat treatment, in which a drop tube evacuatable in vacuum is ...
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JP4434752B2 |
An ash melting system of the present invention includes a slagging combustion furnace ( 10 ) for melting ash into molten slag; and a slag separating apparatus ( 50 ) for bringing the molten slag ( 121 ) discharged from the slagging combu...
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JP4423844B2 |
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JP4423205B2 |
The present invention relates to a susceptor system for an apparatus for the treatment of substrates and/or wafers, provided with a treatment chamber (1) delimited by at least two walls and with at least one heating solenoid (9); the sus...
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JP4422355B2 |
The oven has a plate (16) with a reception seating for a calibration device (46) having a fuse element (56) inserted in the oven for the duration of a calibration programme. The calibration device has a pair of electrically conductive pi...
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JP4421238B2 |
After the maintenance of a heat treatment apparatus, a susceptor and a heating plate are moved upwardly and a nitrogen gas flow from an inlet toward an outlet passage is produced prior to heat treating a semiconductor wafer. In this stat...
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JP4417071B2 |
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JP4411039B2 |
To provide a method and apparatus for producing carbon having carbon allotropes, by which high quality carbon can be produced, a method for producing a carbon formed article, and a method for producing a formed article comprising a carbo...
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JP2010025452A |
To provide a device and a manufacturing method capable of shortening the processing time, increasing the heating rate, and sintering at a lower temperature than conventionally upon heating a ceramic body.A ceramic body sintering device i...
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JP4408745B2 |
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JP4410043B2 |
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JP2010017753A |
To provide a small heating furnace for the simulation test of a reflow furnace, by which movement of a lead-free solder in a reflow furnace is observed executing an accurate simulation through X-ray radioscopy under a temperature rise an...
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JP2010014289A |
To deform a treated object W into a desired three-dimensional shape.This high-temperature gas pressure treatment device includes a high-pressure container 2, a storage unit 24 disposed on a lower cover 5 in the high-pressure container 2 ...
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JP4402873B2 |
To provide a filament for an electron gun that is hard to break during operation of a metal melting furnace by enabling stable radiation of thermoelectrons to realize excellent productivity of products. Two lead wires 34 and 35 are respe...
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JP4399026B2 |
The silicon heating furnace (10) is constructed by combining two semi-cylindrical furnaces (26a),(26b). Each of the semi-cylindrical furnaces (26a), (26b) has a semi-cylindrical housing (34), an insulator (36), heaters (38), and an isoth...
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JP2010002171A |
To provide a heat treatment oven with inductive heating that enables effective preheating without requiring a large volume for a gas heater zone.This heat treatment oven 10 includes a loading or treatment zone 30, at least one gas inlet ...
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JP4394345B2 |
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JP4389194B2 |
To provide a heat treatment furnace in magnetic field with safety and low leakage of magnetic field at lower equipment cost and lower manufacturing cost as compared with a conventional case. The heat treatment furnace in magnetic field c...
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JP4390819B2 |
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JP2009293828A |
To provide a high-temperature gas pressure treatment device capable of being used in actual industrial manufacturing, simplifying work, increasing a work speed and reducing costs, in the high-temperature gas pressure treatment device hav...
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JP4385213B2 |
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JP4380236B2 |
A heating means is disclosed which comprises a reflector plate composed of an opaque quartz and a quartz tube welded to the surface of the reflector plate. A carbon wire which generates heat when a current is applied is inserted in the q...
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JP2009281643A |
To prevent dropping of volatile matter 40 recondensed on a ceiling face 15 on a calcination reception object A by a simple means in a calcination furnace 10 for calcining the calcination reception object A generating the gaseous volatile...
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JP4377601B2 |
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JP4376243B2 |
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JP4372707B2 |
To provide a heat treatment device capable of suppressing leakage of a sublimate generated by cooling of a produced gas produced with a heat treatment of a heating object. This heat treatment device 1 is so structured an air pipe arrange...
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JP4371260B2 |
In a thermal processing apparatus ( 1 ), an upper opening ( 60 ) is closed by a transparent plate ( 61 ) and a light emitting part ( 5 ) emits light through the upper opening ( 60 ). Also provided are a susceptor ( 72 ) for supporting a ...
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JP4369107B2 |
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JP4365777B2 |
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JP4363413B2 |
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JP2009257553A |
To provide a winding type pressure vessel having a structure soaking a piano winding layer in cooling water for cooling inner cylinder and capable of prolonging fatigue life without increasing the size and weight of the whole vessel when...
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JP4348597B2 |
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