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WO/2023/186569A1 |
A substrate warpage determination system comprises at least three first supporting devices and at least three second supporting devices, forming first and second substrate support areas configured to carry a substrate, an actuator config...
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WO/2023/192006A1 |
An optical pulse stretcher apparatus includes: a hermetically-sealed container including one or more walls that define an interior cavity that is maintained, in operation, at a controlled environment, at least one wall having one or more...
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WO/2023/190879A1 |
Provided is a novel negative-type photosensitive resin composition having superior resolution and insulation reliability. The negative-type photosensitive resin composition is characterized by: comprising (A) a polyhydroxyamide compound ...
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WO/2023/186440A1 |
Disclosed is a method for determining a spatial distribution of a parameter of interest over at least one substrate or portion thereof, the at least one substrate having been subject to a semiconductor manufacturing process, the method c...
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WO/2023/188624A1 |
The purpose of the present invention is to provide a light source device capable of suppressing the influence of debris. A light source device according to one embodiment of the present invention is provided with a beam take-in part, a...
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WO/2023/188296A1 |
The present invention relates to a photosensitive multilayer resin film which comprises a first resin composition layer and a second resin composition layer, wherein: the first resin composition layer and the second resin composition lay...
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WO/2023/189961A1 |
This resist composition contains a resin component (A1) having: a constitutional unit (a01) derived from a compound represented by general formula (a0-1); and a constitutional unit (a02) including a lactone-containing cyclic group or the...
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WO/2023/189785A1 |
Provided are: a dispersion of hollow silica particles having a small particle size, a low refractive index, and high dispersibility in a dispersion medium or in a resin; and a method for producing the dispersion. The particles are holl...
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WO/2023/188484A1 |
Provided is a light source device capable of improving the luminous efficiency of plasma generated by an energy beam. A light source device according to an embodiment of the present invention uses an energy beam to create plasma from a...
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WO/2023/190061A1 |
Provided are: a resin composition including a polyimide precursor containing a repeating unit represented by formula (1) and a radical polymerizable compound, wherein ΔSP calculated by the following formula (S) is more than -3.5 MPa1/2 ...
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WO/2023/188008A1 |
The present invention is a photosensitive resin composition containing (A) a binder polymer, (B) a photopolymerizable compound having an ethylenically-unsaturated bond, (C) a photopolymerization initiator, and (D) a bisphenol compound ha...
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WO/2023/188630A1 |
The purpose of the present invention is to provide a light source device that can improve the luminous efficiency of plasma generated by energy beam. According to one embodiment of the present invention, a light source device that uses...
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WO/2023/192962A1 |
A macromolecular mechanophore platform that undergoes a mechanically gated chromogenic reaction in the presence of an extrinsic small molecule developing reagent is described, along with methods of synthesis and use thereof in different ...
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WO/2023/190455A1 |
[Problem] To provide a photosensitive resin composition which makes it possible to sufficiently suppress generation of residue of an unnecessary filler on a substrate after a pattern has been formed on the substrate. [Solution] This phot...
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WO/2023/190802A1 |
The present invention relates to a photosensitive resin film which contains (A) a compound having an ethylenically-unsaturated group, (B) a thermosetting resin, (C) a photopolymerization initiator, (D) an inorganic filler, and (E) a fluo...
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WO/2023/190060A1 |
The present invention provides: a photosensitive resin composition which contains a polyimide precursor that contains a repeating unit represented by formula (1), a polymerizable compound and a photopolymerization initiator; a cured prod...
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WO/2023/185530A1 |
A dry film resist, a photosensitive dry film, and a copper clad laminate. The dry film resist comprises (A) an alkali-soluble resin, (B) a photopolymerizable monomer, (C) a photoinitiator, and (D) a sensitizer; and the sensitizer (D) com...
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WO/2023/190798A1 |
The present invention pertains to a photosensitive multilayer resin film having a first resin composition layer and a second resin composition layer, wherein: each of the first resin composition layer and the second resin composition lay...
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WO/2023/191988A1 |
A system includes an illumination source configured to generate an illumination beam, and a collection sub-system that includes an objective lens, one or more detectors located at a collection pupil plane, a light modulator, and a contro...
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WO/2023/186964A1 |
The invention relates to a method for the chemical treatment of a surface, in particular a surface (32) of a substrate (31) of a component (Mx, 117) of a projection-exposure apparatus (1, 101) for semiconductor lithography by application...
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WO/2023/189371A1 |
The present invention addresses the problem of providing a chemical liquid that, when used in a step for bringing a contact target object into contact with the chemical liquid, is less likely to generate a predetermined defect in the con...
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WO/2023/189435A1 |
This analysis system comprises: a first measurement unit for measuring first information items that are pattern information items of a first pattern on a first substrate; a storage unit for storing the first information items measured by...
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WO/2023/191213A1 |
The present invention relates to an overlay measurement device. More specifically, the present invention relates to an overlay measurement device capable of quickly measuring an overlay error between layers having a great height differen...
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WO/2023/190516A1 |
[Problem] To form with high precision a recess-and-protrusion structured pattern having an arbitrarily defined three-dimensional shape on the outer peripheral surface of a master disk. [Solution] This manufacturing method for a master di...
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WO/2023/190410A1 |
The present invention provides a compound which is represented by formula (A). In the formula, n represents an integer of 1 to 4; each of R3 and R4 independently represents a C1-C20 alkyl group, a C3-C20 cycloalkyl group, a C6-C20 aryl g...
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WO/2023/189503A1 |
The present invention causes a radiation-sensitive composition to contain a polymer including acid-labile group and a compound (Q) given by formula (1). In formula (1), L1 represents an ester group, -CO-NR3-, a (thio) ether group, or a s...
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WO/2023/190062A1 |
A resin composition containing a polyimide precursor that includes a repeating unit represented by formula (1) and a repeating unit represented by formula (2), a polymerizable compound, and a polymerization initiator; a cured article; a ...
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WO/2023/190454A1 |
[Problem] To provide a photosensitive resin composition having preferable characteristics required during printed wiring board production, wherein crystallization of a component is suppressed even when exposed to an environment under whi...
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WO/2023/188297A1 |
A photosensitive resin film containing (A) a compound having an ethylenic unsaturated group, (B) a thermosetting resin, (C) a photopolymerization initiator, (D) an inorganic filler, and (E) a fluorine-containing resin, wherein the (D) in...
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WO/2023/191980A1 |
An overlay metrology system may include an illumination an illumination source to generate an illumination beam, one or more illumination optics to direct the illumination beam to an overlay target on a sample as the sample is scanned re...
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WO/2023/190393A1 |
The present invention provides a cured product of a photosensitive resin composition, the cured product containing an inorganic filler and still having excellent resolution, while being capable of suppressing warp of a substrate during m...
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WO/2023/190837A1 |
A solid-state imaging device (10) comprises a base member (11), a frame, a frame-like light-blocking member (13), and a transparent substrate (14) in this order. The base member (11) includes a semiconductor substrate (15) in which a pix...
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WO/2023/186446A1 |
A method for ordering and/or selection of latent elements for modeling low dimensional data within a latent space representation, the low dimensional data being a reduced dimensionality representation of input data as determined by a fir...
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WO/2023/190218A1 |
The present invention addresses the problem of providing an organic EL display that, in obtaining a desired current density, has both excellent light emission characteristics which can be driven at low voltages and high reliability of li...
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WO/2023/190811A1 |
The present invention pertains to a photosensitive multilayer resin film comprising a first resin composition layer and a second resin composition layer. The first resin composition layer and the second resin composition layer each conta...
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WO/2023/190807A1 |
Provided is a composition for brush formation that is used in order to induce phase separation of a block copolymer contained in a layer formed on a substrate, the composition containing a brush polymer, an organic base, and a solvent.
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WO/2023/190064A1 |
Provided are: a resin composition including a polyimide or a polyimide precursor, wherein a cured product obtained from the resin composition satisfies all of the following conditions (i) to (iv); a cured product; a laminate; a method fo...
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WO/2023/189969A1 |
This resist composition is obtained by adding a crosslinking agent that will react in the presence of ionizing radiation, or nonionizing radiation having a wavelength of 300 nm or less.
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WO/2023/188603A1 |
In order to provide an information processing device which can acquire a variation amount of the optical characteristics of an optical system in consideration of a control for suppressing a temperature variation of the optical system pro...
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WO/2023/184627A1 |
The embodiments of the present disclosure belong to the technical field of semiconductor manufacturing, and particularly relate to a semiconductor photoetching compensation method, which method comprises: performing photoetching on a waf...
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WO/2023/189586A1 |
A first problem to be addressed by the present invention is to provide an active light-sensitive or radiation-sensitive resin composition that can form a pattern having excellent resolution and excellent LWR performance. A second problem...
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WO/2023/190456A1 |
Provided is a cured product that has a surface onto which a marking ink can be easily applied, exhibits excellent adhesiveness with the marking ink after curing, and can form a marker having excellent visibility of characters and symbols...
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WO/2023/190400A1 |
The present invention forms a reference mark 22 formed in a first process of a photolithography process of semiconductor device manufacturing and a reference mark 24 formed in a second process following the first process as concentric do...
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WO/2023/182017A1 |
This coloring composition comprises a colorant A containing a dye a, and a resin B, wherein: the dye a includes a xanthene dye a1 containing a cation AX+ and an anion AZ- and having a xanthene dye structure; the content of the xanthene d...
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WO/2023/180135A1 |
A method for quality assessment in imprint lithography which is based on analyzing the quality of an imprintable layer based on indirect detection of its viscosity. The method comprises imprinting a dedicated test pattern comprising mult...
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WO/2023/181856A1 |
Provided is a compound constituted from a heteropolyacid anion, a photoreactive cation represented by formula (1), and a hydrogen cation. Also provided is a photosensitive composition containing this compound. (In formula (1), R1 and R2 ...
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WO/2023/182136A1 |
This positive-type photosensitive resin composition is used in a rewiring layer of a semiconductor device. The photosensitive resin composition includes (A) a phenol resin having a biphenol structure, (B) a crosslinking agent, and (C) a ...
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WO/2023/183158A1 |
Methods and apparatus for electroplating a substrate incorporate aspects of digital lithography and feedback from electroplating processes to improve characteristics of plating material based on die patterns. In some embodiments, a metho...
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WO/2023/179999A1 |
Disclosed is a method for performing a lithographic apparatus setup calibration and/or drift correction for a specific lithographic apparatus of a population of lithographic apparatuses to be used in a manufacturing process for manufactu...
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WO/2023/182327A1 |
The purpose of the present invention is to provide a positive photosensitive resin composition which has high sensitivity, good development adhesion and high heat resistance, while providing a cured product thereof with high folding resi...
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