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WO/2023/181960A1 |
A polymer including a partial structure represented by formula (1), a partial structure represented by formula (2), and a partial structure represented by formula (3). (In formula (2), Q1 represents a divalent organic group having either...
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WO/2023/181812A1 |
This invention addresses the problem of providing a positive photosensitive composition having both characteristics of high heat resistance and high transparency as well as high sensitivity, high residual film ratio patterning ability an...
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WO/2023/180393A1 |
The invention relates to an optical device (1), in particular for a lithography system (100, 200), comprising: at least one optical element (2) having at least one optical surface (3); one or more actuators (4) in order to tilt the optic...
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WO/2023/181961A1 |
A multilayer printed wiring board (100) includes: a multilayer wiring layer (10); a double-sided wiring layer (80); a first resin layer (111); a second resin layer (112); a third resin layer (113); and embedded resin sections (116). The ...
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WO/2023/183245A1 |
A device for determining coplanarity of two surfaces includes an illumination system for providing first light to a first surface and providing second light to a second surface. The first surface redirects at least a portion of the first...
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WO/2023/183764A1 |
Embodiments of the present disclosure also relate to methods of fabricating flow cell substrates. Some exemplary workflows exploit orthogonal chemistries of substrate layers such that the process does not include polishing steps. Substra...
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WO/2023/181962A1 |
Provided is a photosensitive resin composition capable of forming a high refractive index cured product, and having excellent hole resolution. This photosensitive resin composition is characterized by containing (A) an ethylenically unsa...
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WO/2023/182263A1 |
The purpose of the present invention is to provide a production method for an LED-mounted substrate with a cured film that excels in manufacturing efficiency and that is capable of, with respect to an LED-mounted substrate, collectively ...
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WO/2023/182092A1 |
The present invention addresses the problem of providing a transfer film that, when the same is attached to an object to be attached, exhibits excellent adhesiveness between the object to be attached and a photosensitive composition laye...
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WO/2023/182041A1 |
Provided is a photosensitive resin composition having excellent patterning property and providing excellent pressure resistance (elastic modulus) of a cured product. This photosensitive resin composition contains (A) a polyimide, (B) a c...
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WO/2023/182408A1 |
A composition for forming a resist-lower-layer film for EB or EUV lithography, the composition containing a solvent and a polymer including a fluorene structure.
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WO/2023/180161A2 |
In an example method, an initial depression is defined in a first resin layer of a multi-layer stack including the first resin layer over a second resin layer or a base support. The first resin layer is resistant to silanization in an or...
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WO/2023/182028A1 |
This patterning method includes a soaking step and an etching step. The soaking step involves soaking a material for increasing a selection ratio of an exposure portion and a non-exposure portion on a photoresist film of a substrate havi...
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WO/2023/180020A1 |
Methods, systems, and computer software are disclosed for determining a mask pattern for use with a lithographic process. One method includes assigning locations of two-dimensional elements based on a target pattern, associating the two-...
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WO/2023/181855A1 |
This photosensitive composition includes a tin compound which has three hydrocarbon groups that may have substituent groups and in which a pyridinedicarboxylic acid serves as a ligand. This pattern formation method comprises: a step for ...
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WO/2023/182837A1 |
Disclosed is a method for manufacturing a fine metal mask, the method comprising the steps of: a) patterning a plated resist on a substrate; b) forming a metal plated layer on the substrate exposed through the patterned plated resist; c)...
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WO/2023/182071A1 |
A resin composition containing (A) a soluble resin, (B) an organic salt, and (C) a solvent, wherein the (B) organic salt is formed from a carboxy-group-containing organic compound and an amino-group-containing organic compound, and the (...
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WO/2023/182040A1 |
The present invention addresses the problem of providing: an actinic-ray-sensitive or radiation-sensitive resin composition with which a pattern having excellent LWR can be formed; a resist film; a pattern forming method; a method for pr...
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WO/2023/180241A1 |
An arrangement (100) for a projection exposure system (1), comprising a first component (102), a second component (108) and an adjustable interface (114, 116, 118, 120, 122) operatively connecting the first component (102) to the second ...
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WO/2023/182273A1 |
The purpose of the present invention is to provide: an alkali-soluble resin and an alkali-soluble resin composition, each of which is capable of forming a cured product that has excellent thermal coloring resistance and a high refractive...
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WO/2023/178719A1 |
An optical measuring apparatus and method. The optical measuring apparatus comprises an object table (05) used to carry an object to be measured (4); an illumination system (01) used to emit a detection light beam, the illumination syste...
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WO/2023/182093A1 |
The present invention provides an active-ray-sensitive or radiation-sensitive resin composition having excellent DOF performance. The active-ray-sensitive or radiation-sensitive resin composition according to the present invention compri...
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WO/2023/182350A1 |
Provided are a pigment dispersion liquid with which a cured film having low surface roughness can be formed, and a photosensitive resin composition. One aspect of a pigment dispersion liquid according to the present invention contains (A...
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WO/2023/182094A1 |
The present invention provides an active-ray-sensitive or radiation-sensitive resin composition which makes it possible to achieve excellent pattern transferability when a resist pattern is formed therefrom and an object of interest is e...
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WO/2023/181950A1 |
A first problem addressed by the present invention is to provide an active-ray-sensitive or radiation-sensitive resin composition which has excellent sensitivity and a pattern formed from which has excellent resolution. A second problem ...
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WO/2023/176335A1 |
Provided are: a colored composition which can suppress the occurrence of a development residue and from which a film having excellent heat shrinkage resistance and moisture resistance can be formed; a film; a color filter; a solid-state ...
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WO/2023/176172A1 |
Provided are: a polyimide resin precursor that yields a polyimide resin having a low dielectric loss tangent and excelling in a chemical resistance property; a production method for the polyimide resin precursor; a photosensitive resin c...
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WO/2023/177032A1 |
The present invention relates to a device for moving optical equipment for precisely moving optical equipment for measurement or inspection. A device for moving optical equipment, according to an embodiment of the present invention, comp...
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WO/2023/174648A1 |
Disclosed is an illumination arrangement for providing at least one radiation beam for use as an illumination beam and/or reference beam in a metrology device. The illumination arrangement comprises at least one radiation beam modifier m...
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WO/2023/176888A1 |
Provided is a color filter manufacturing method having a fast developing-solution dissolution rate and high production efficiency. This color filter manufacturing method according to the present invention is characterized by comprising a...
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WO/2023/176259A1 |
A photosensitive resin composition for forming an insulating film, the composition comprising a solvent and at least one polymer from among polyimides, polyamic acids, and polyamic acid esters, said polymer including a photopolymerizable...
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WO/2023/174414A1 |
An asymmetric ultraviolet exposure method, an ultraviolet curable material used therein, and a metal mesh sensor manufactured by using the method. The method comprises: applying a first ultraviolet curable material to one side of an opti...
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WO/2023/173217A1 |
A system for trimming a photonic chip comprises a fabrication unit and a system controller communicatively coupled to the fabrication unit. The system controller is configured to cause the fabrication unit to fabricate the photonic chip ...
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WO/2023/177548A1 |
Actual physical locations of dies on a substrate package may be identified without using a full metrology scan of the substrate. Instead, one or more cameras may be used to efficiently locate the approximate location of any of the alignm...
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WO/2023/174650A1 |
A method for determining a vertical position of a structure on a substrate with respect to a nominal vertical position is disclosed. The method comprises obtaining complex field data relating to scattered radiation from said structure, f...
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WO/2023/176898A1 |
Provided is a photosensitive resin composition from which a pattern having excellent light-blocking properties can be formed and which is prevented from the occurrence of foreign matters and unevenness. The photosensitive resin compositi...
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WO/2023/173690A1 |
The present invention relates to the technical field of photoetching, and particularly relates to a method and apparatus for solving a coloring boundary conflict, and a computer device. The method comprises the following steps: S0, provi...
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WO/2023/176882A1 |
Provided is a colored resin composition having a high dissolution rate in a developer even when a pre-baking temperature is low. This colored resin composition contains (A) a coloring agent, (B) a solvent, (C) an alkali-soluble resin, (D...
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WO/2023/177869A1 |
Methods of forming a resist model for angled gratings on optical devices. In one example, a method includes designing a model with a model area and a verification area with initial mask patterns having a first grating pattern with a firs...
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WO/2023/176546A1 |
The present invention provides a resist composition which contains a base material component (A) and a compound (B0) that is represented by general formula (b0). In the formula, Rpg represents an acid-decomposable group; Rl0 represents a...
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WO/2023/176868A1 |
The present invention provides a photosensitive resin composition which contains a polymer (A) that has an acid-cleavable group, a photoacid generator (B) and a solvent (C), wherein: the polymer (A) comprises a structural unit (I) that i...
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WO/2023/173594A1 |
An anti-collision apparatus, relating to the technical field of ultra-precision equipment protection, and for use in solving the problem that existing anti-collision apparatuses cannot achieve an effective anti-collision protection effec...
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WO/2023/177039A1 |
A digital exposure system, according to one embodiment of the present invention, comprises: a light source that radiates light to a substrate; a digital mirror device that selectively transmits the light emitted from the light source so ...
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WO/2023/176899A1 |
Provided is a photosensitive resin composition that exhibits excellent linearity in a pattern formed thereby and excellent fine line characteristics, and in which the generation of foreign matter originating from a pigment is suppressed....
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WO/2023/173691A1 |
The present invention relates to the technical field of photolithography machines, and in particular, to a photolithography machine matching method, comprising the steps of: obtaining preset photolithography patterns, X key positions bei...
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WO/2023/171670A1 |
This resist composition, which generates an acid by being exposed to light and of which the solubility in a developer changes due to the action of the acid, contains a resin component (A1) of which the solubility in a developer changes d...
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WO/2023/171186A1 |
Provided is a compound that is capable of functioning as a leveling agent that imparts high smoothness and an effect of inhibiting pin unevenness to a coating film. Specifically, the compound has polymer blocks of polymerizable monomers ...
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WO/2023/171743A1 |
The present invention employs a resist composition containing a resin component that has a constituent unit derived from a compound represented by general formula (a0-1). In formula (a0-1), W01 is a polymerizable group-containing group, ...
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WO/2023/171284A1 |
The present invention relates to a photosensitive resin composition that has high sensitivity and can form a low-transmittance film after curing irrespective of the heating atmosphere during curing. This photosensitive resin composition ...
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WO/2023/171733A1 |
This wafer edge protective film-forming composition for semiconductor manufacturing comprises a solvent and a cross-linkable group-containing polymer or compound, wherein the solvent includes a first solvent and a second solvent; and whe...
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