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WO2002060643A9 |
The present invention provides an improved planarization or polishing apparatus for chemical mechanical planarization and other types of polishing such as metal polishing and optical polishing. In an exemplary embodiment, an apparatus fo...
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WO/2003/072303A1 |
An angle positioning tool for positioning a blade portion of a hand scaler at a predetermined angle when grinding the hand scaler and a hand-scaler grinding device that has a relatively simple structure, is easily operated and maintained...
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WO/2003/066282A2 |
Systems and methods for detecting a presence of blobs on a specimen (12), are provided. A method may include scanning measurement spots across the specimen, (12), during polishing of a specimen. The method may also include determining if...
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WO/2003/053206A1 |
This invention provides a simple yet effective means of damping out vibrations in floor polishing machines. The invention teaches the use of a circular or toroidal damping element (20) disposed between the work head and the body of a flo...
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WO/2003/051617A1 |
A method for producing lenses includes assembling a plurality of glass rods having a desired length into a single unit and cutting the single unit into multiple slices, each slice having a plurality of individual lenses. The method furth...
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WO/2003/049168A1 |
A substrate holding device for holdingly pressing a substrate (W) such as a semiconductor wafer against a polishing surface in a polishing device for flattening the substrate by polishing, comprising a top ring body (2) having a storage ...
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WO/2003/045672A2 |
A milling machine for shaping blanks to create optical lenses to be attached to eyeglass frames and to create filter lenses (14) for a clip-on accessory (13) whose pair of filter lenses register with a pair of optical lenses in prescript...
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WO/2003/028951A1 |
A process for forming a semiconductor wafer which is single side polished improves nanotopography and flatness of the polished wafer. The process reduces the effect of back side surface features, such as edge ring phenomena and back side...
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WO/2003/028079A1 |
A semiconductor wafer end face polishing machine capable of polishing the end face of a semiconductor wafer easily in a short time and also changing a polishing tool in a short time, comprising a polishing head having a drive roller (33)...
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WO2002024410A9 |
A CMP system make repeatable measurements of eccentric forces applied to carriers for wafer or conditioning pucks. Force applied to the carrier may be accurately measured even though such force is eccentrically applied to such carrier. A...
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WO/2003/022521A1 |
The invention relates to a device for the grinding of central bearing positions on crankshafts with several grinding discs employed simultaneously. An additional machining unit (11) for the pre-working of at least one central bearing pos...
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WO/2003/022520A1 |
The invention relates to a device (1) for sharpening multiple blade knives (17), comprising at least one motor (5) and a retaining table (2) which can be displaced in relation to the motor, said retaining table (2) comprises a retaining ...
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WO/2003/022518A2 |
A chemical mechanical polishing tool, apparatus and method. The polishing tool includes a central polishing assembly (322) comprised of a central pad mount (326) on a central shaft. That central pad mount beneficially retains a center po...
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WO/2003/011517A1 |
A wafer carrier (10) for use in polishing disks. The carrier (10) includes a main body (38) and an integral visual inspection wear indicator (40). The main body (38) has at least one opening (12) formed therein adapted to receive a disk....
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WO/2003/009967A1 |
The invention relates to a polishing jig for mounting a processing subject lens on a polishing device that polishes the concave surface of the processing subject lens, to a conveyor tray exclusively used for conveying the polishing jig, ...
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WO/2003/003428A2 |
The present invention is a method, apparatus and process for an improved substrate mounting and processing technique for various substrate treatments comprising cleaning, dicing, sawing, polishing, and planarization, among others.
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WO/2002/100596A1 |
A fixture (1) for guidance of a tool having a cutting edge with respect to the periphery of a rotating grinding- or polishing wheel (2), comprising a frame structure that runs along the periphery (6) of the wheel and has a guide formed a...
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WO/2002/098606A2 |
The invention concerns a device comprising in combination: means for detecting (4) characteristics of a lens; means for integrating characteristics representing a patient's morphology; a support (3) of the mobile lens along a predetermin...
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WO/2002/097298A1 |
An auto-balancing device (1) for damping the vibrations produced by a grinding wheel (18) on an angle grinder (30). The device includes a body (2) having a trackway (4) allowing ball bearings (6) to distribute themselves around the track...
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WO/2002/094505A1 |
A multi-spindle end effector is provided for a multiple axis robot. The multi-spindle end effector includes a plate housing having at least a pair of spaced-apart spindles (36, 38) mounted thereon. A servo-motor (42) drivingly engages th...
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WO/2002/092281A1 |
The invention relates to a device for sharpening cutter blades (6, 7) comprising a sharpening tool and a sharpening fixture, by means of which a cutter blade (6') is held during the sharpening process. The sharpening fixture (13) and/or ...
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WO/2002/091433A2 |
The invention relates to a method for grinding the back sides of wafers using foils having a carrier layer known per se and a gradually polymerizable adhesive layer. The invention also relates to foils having said gradually polymerizable...
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WO/2002/087826A1 |
A method for controlling a process in a multi-zonal processing apparatus and specifically for determining the optimum values to set for processing parameters J(Z¿i?) in each of the zones of that apparatus includes processing a test work...
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WO/2002/085571A1 |
A chemical mechanical polishing (CMP) apparatus (100) and method for polishing semiconductor wafers (W) utilizes multiple wafer carriers (106) that are transferred to different positions about a polishing pad (104) to polish at least one...
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WO/2002/074487A1 |
A system and method for chemically and mechanically polishing surfaces of semiconductor wafers (W) utilizing multiple polishing pads (102A) (102B) having diameters that are smaller than the diameter of the wafers (W) to simultaneously po...
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WO/2002/071445A2 |
Specific embodiments of the present invention provide a chemical-mechanical planarization apparatus for planarizing an object (115) comprising a shaft (260) having a shaft axis (270) and being connected with a polishing head (250) which ...
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WO/2002/070199A1 |
A device for repairing by polishing an optical disk, which can provide a proper, uniform pressure necessary for polishing, correct the planar parallelism precision of the rotation surfaces of an optical disk and a polishing sheet, elimin...
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WO/2002/068151A1 |
An abrasion tool that is selectively configurable for spin or random-orbit without the need for a reversible motor. The tool uses two collars, each having half of the desired offset and half of the counterweight. In spin mode, the collar...
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WO/2002/062524A1 |
The invention relates to an arrangement in a mobile machine for screeding floor surfaces. This comprises a housing with a planet disk (3), which is rotatably supported in the bottom of the said housing and driven by a drive motor (1). Th...
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WO/2002/060645A1 |
A polisher head backing film (140) that resists slipping relative to a backing plate (150). In one embodiment, a polisher head backing film/backing plate assembly (180) is provided. The backing film/backing plate assembly (180) includes ...
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WO/2002/057051A1 |
A dressing apparatus dresses a polishing surface of a polishing table used for polishing a workpiece such as a semiconductor wafer in a polishing apparatus. The dressing apparatus comprises a dresser body (31) connected to a dresser driv...
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WO/2002/047870A1 |
Applying heat and pressure to a backing film (3) comprising an adhesive layer (4) during the procedure of mounting it to a polish head (1) for use in chemical mechanical polishing (CMP), inhomogeneities inside the adhesive layer (4), e.g...
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WO/2002/042033A1 |
A wafer polishing apparatus for polishing a semiconductor wafer. The polisher comprises a base (23), a turntable (27), a polishing pad (29) and a drive mechanism (45) for driven rotation of a polishing head (63). The polishing head is ad...
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WO/2002/036306A2 |
An apparatus for eliminating the differences in the curvatures of a facing lens blank and an abrasive pad mounted on a formable lap (20) includes a drivable track portion (14), a compensation pl ate (12) disposed on the drivable track po...
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WO/2002/036305A1 |
A centreless cylindrical grinding machine, for through-feed and in-feed grinding of various workpieces (8), has a first driven positioning axis X¿S? for a grinding spindle head (2) with a grinding wheel (1) and a second driven positioni...
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WO2000066903A9 |
A fixture (80) for selectively locating and retaining hydraulic gerotor rotors (30) in position in respect to a grinding wheel (20), the fixture clamping the rotor between two oversized positioning rolls (84) located in rotor lobe valley...
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WO/2002/026443A1 |
A polish head (3) for Chemical Mechanical Polishing comprises a backing film (5) made of silicone on a rigid support element (6, 7), preferably consisting of amorphous ceramic. The silicone backing film (5) is fabricated by molding, ther...
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WO/2002/024409A1 |
The CMP apparatus (1) is equipped with an attitude-maintaining means (50) which maintains a polishing member (40) in a fixed attitude with respect to a wafer (W) by applying a corrective moment to the polishing member during the polishin...
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WO/2002/016078A2 |
CMP systems and methods implement instructions for moving a polishing pad (202) relative to a wafer (206) and a retainer ring (282) and for applying pressure for CMP operations. Feedback of polishing pad position is coordinated with dete...
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WO/2002/016076A1 |
A sheet peripheral edge grinder, comprising a grinding wheel axis tilting mechanism (1) capable of varying the tilt angle of the rotating axis of a grinding wheel (3) relative to the rotating axis of a sheet (2) and also varying the dire...
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WO/2002/016080A2 |
A carrier head assembly (200) of a substrate (202) polishing apparatus and a substrate supporting carrier pad (220) is disclosed. A down force is uniformly distributed over the backside of the substrate (202) by the carrier pad (220) ada...
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WO/2002/011198A2 |
A method for controlling wafer uniformity in a polishing tool (20) includes providing a plurality of carrier heads (40), determining a signature for each of the carrier heads (40), and installing carrier heads (40) with similar signature...
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WO/2002/007920A1 |
Known headstocks are relatively long since clamping chucks, the rotationally mounted spindle and the clamping cylinder etc are situated axially behind each other. The invention provides for a shortening of the headstock by accommodating ...
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WO/2002/007931A2 |
A carrier head (100) that has a base assembly (104) and a flexible membrane (140). The flexible membrane has a generally circular main portion (142) with a lower surface (144) that provides a substrate-mounting surface and a plurality of...
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WO/2002/008636A2 |
Automatic balancer (300) for balancing a mass rotating at high speed reduces the impact of unbalanced rotary tools and other devices. The automatic balancer provides a housing (301) within which is defined a race (309). The race is acces...
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WO/2002/006005A1 |
A method and apparatus for substantially nullifying vibration and deflection in a single point lens turning lathe (100) having a rapidly reciprocating lens cutting tool (114) and shuttle assembly. The apparatus includes three or more too...
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WO2001056743B1 |
An interfaced carrier assembly including an interface circuit (150) having printed contacts (152) to provide electrical interface or feedback control for lapping operations. The printed contacts are formed on a base material (154) on the...
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WO/2002/002276A2 |
A projected gimbal point drive system is disclosed. The projected gimbal point drive system includes a spindle (412) capable of apply a torque, and having a concave spherical surface formed on its lower portion. Further included is a waf...
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WO/2002/000392A1 |
The invention relates to a device for loading and unloading optical workpieces, for an optical machine. Said device comprises a loading arm (24) which is pivotally driven about an axis (A) and is pivoted in controlled movement sequences ...
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WO/2001/098025A1 |
A ferrule holder assembly for an optical fiber end face polishing machine capable of solving a problem of a variation in length of a ferrule, comprising a ferrule holder panel (1) supported on the polishing panel of the optical fiber end...
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