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Patent Searching and Data


Matches 901 - 950 out of 9,089

Document Document Title
JP2019212815A
[Subject] A device chip is formed, without reducing quality. [Means for Solution] A polyester system sheet allocation process is a processing method of a wafer and allocate a polyester system sheet in the back of a wafer that a plurality...  
JP2019535540A
The present invention relates to a wire saw (10), and is the wire saw concerned, The 1st wire guide roller (1) and the 2nd wire guide roller (2) for supporting a cutting field (19) formed from a cutting wire, A wire guide roller (1, 2) i...  
JP2019212734A
[Subject] Cutting fluid which invades from a crevice between a frame of a zipper table and a table pedestal provides a cutting apparatus which can stop low a possibility of reaching a porous board. [Means for Solution] A zipper table whi...  
JP2019212842A
[Subject] Even thinness of 30 micrometers or less maintains a form, and a metaphor polyether ether ketone film provides a spacer for wafers which can be manufactured easily or can be dealt with. [Means for Solution] When vacuum adsorptio...  
JP2019212803A
[Subject] Even thinness of 30 micrometers or less maintains a form, and a metaphor polyether ether ketone film provides a spacer for wafers which can be manufactured easily or can be dealt with. [Means for Solution] When back grinding of...  
JP2019212814A
[Subject] A device chip is formed, without reducing quality. [Means for Solution] A polyester system sheet allocation process is a processing method of a wafer and allocate a polyester system sheet in the back of a wafer that a plurality...  
JP2019212812A
[Subject] A device chip is formed, without reducing quality. [Means for Solution] A plurality of devices are the processing methods of a wafer which divides into each device chip a wafer formed in each field of the surface divided by div...  
JP2019212817A
[Subject] A device chip is formed, without reducing quality. [Means for Solution] A polyester system sheet allocation process is a processing method of a wafer and allocate a polyester system sheet in the back of a wafer that a plurality...  
JP2019209427A
[Subject] It prevents grinding the end face of a steel pipe too much, and provides a device which can realize stabilization and mass production nature of product quality by automation. [Means for Solution] In end face processing device 1...  
JP2019212813A
[Subject] A device chip is formed, without reducing quality. [Means for Solution] A polyester system sheet allocation process is a processing method of a wafer and allocate a polyester system sheet in the back of a wafer that a plurality...  
JP2019212818A
[Subject] A device chip is formed, without reducing quality. [Means for Solution] A polyester system sheet allocation process is a processing method of a wafer and allocate a polyester system sheet in the back of a wafer that a plurality...  
JP2019212710A
[Subject] After making into flat shape the surface side of a resin package board which has curvature and unevenness, a resin package board is processed. [Means for Solution] An adhesion field is stuck on an end material field, sticking a...  
JP6616922B1
Area of a spacer which makes it intervene between substrates adjacent among substrates which constitute a layered product, and makes adjacent substrates estrange, When releasing pressure from a press state which added pressure 0.60MPa to...  
JP6615643B2  
JP2019202359A
[Subject] A grinding device which can control vibration with easy composition using Static pressure support structure is provided. [Means for Solution] Static pressure pocket 42p of plurality [device / 1 / grinding / sliding surfaces / 4...  
JP2019202358A
[Subject] A grinding device which can form a processing side which has an inclination in a structure with easy composition is provided. [Means for Solution] A plurality of Static pressure pockets 42p are arranged along the direction [as ...  
JP6612574B2  
JP6610043B2  
JP2019201103A
[Subject] Processing sending of a workpiece is accelerated and processing efficiency is raised. [Means for Solution] A maintenance table which is a processing device into which a tabular workpiece is processed, is provided with a buildup...  
JP2019198931A
[Subject] It enables it to form in a buildup area of a maintenance table, and the undersurface of a wafer a maintenance table to which grinding waste does not adhere at the time of grinding of a wafer. [Means for Solution] A formation me...  
JP2019195894A
[Subject] Art which a part can be fixed to a rolling-up core, and other parts can control rapid crookedness of wiring fixed to a fixing cylinder or piping, and can control wiring or breakage of piping is provided. [Means for Solution] Wh...  
JPWO2019097738A1
A work piece support device (6) is arranged at least one about the direction of the circumference of a pedestal (10) and the work piece (1a) rotated using a rotary drive (4), It has a shoe (11) made to Sliding contact to the peripheral s...  
JP2019197086A
[Subject] A glasses lens is pinched stably and a conveying machine which can perform position Matching of a glasses lens with sufficient accuracy is provided. [Means for Solution] The 1st clamp pin unit which has one pair of clamp pins c...  
JP6606017B2  
JP2019193960A
[Subject] Even if you are a wafer of not only a frame unit but a simple substance state, provide a cutting apparatus which can take out after cutting and can check a processing result easily. [Means for Solution] Cassette placement mecha...  
JP2019192777A
[Subject] When power of absorption is made to act, suction maintenance of a board-shaped object and the divided chip can be carried out certainly, and when power of absorption is canceled, a zipper table which can take out a divided chip...  
JP2019192854A
[Subject] When picturizing a wafer held on a maintenance table and detecting a position of a perimeter edge of a wafer, it enables it to detect a perimeter edge of a wafer correctly, as halation is not generated in a formed image pick-up...  
JP2019188543A
[Subject] A pressing device excellent in energy-saving nature is provided, using power, such as compressed air and electricity, as unnecessary by using a magnet for press to a workpiece of a de-burring tool. [Means for Solution] Tool att...  
JP2019192826A
[Subject] When power of absorption is made to act, suction maintenance of a board-shaped object and the divided chip can be carried out certainly, and when power of absorption is canceled, a zipper table which can take out a divided chip...  
JP2019191488A
[Subject] Provide a manufacturing method of the Pericle frame which can manufacture the Pericle frame with the high degree of plane, and its Pericle frame. [Means for Solution] In a manufacturing method of the Pericle frame 1, in the sta...  
JP2019192827A
[Subject] When power of absorption is made to act, suction maintenance of a board-shaped object and the divided chip can be carried out certainly, and when power of absorption is canceled, a zipper table which can take out a divided chip...  
JP6597926B2  
JP2019186489A
[Subject] Even if masking tape is stuck on the surface of a wafer and it grinds the back, a processing method of a wafer which does not make an adhesive layer remain on the surface of a wafer is provided. [Means for Solution] A polyester...  
JP2019186488A
[Subject] Even if masking tape is stuck on the surface of a wafer and it grinds the back, a processing method of a wafer which does not make an adhesive layer remain on the surface of a wafer is provided. [Means for Solution] A polyolefi...  
JP2019181634A
[Subject] When grinding water is sprayed towards a center from the perimeter side of a wafer, grinding waste is not made to adhere to a buildup area holding a wafer of a zipper table, but it is made not to soil the undersurface of a wafe...  
JP2019181670A
[Subject] The present invention indicated automatic buffing equipment. [Means for Solution] An installation slot is installed in the machine Rack including a pedestal installed in a bottom of A base and the machine Rack fixed, The first ...  
JP2019181630A
[Subject] The work supporting structure which can maintain maintenance accuracy of a work with high precision is provided for reservation of processing accuracy of a work. [Means for Solution] Work attaching part 14 which work supporting...  
JP2019181584A
[Subject] Cooling water used in a spindle housing for cooling of a spindle housing is used effectively. [Means for Solution] A zipper table holding a workpiece, and a spindle equipped with a whetstone tool into which a workpiece held at ...  
JP6594215B2  
JP6593863B2  
JP2019177461A
[Subject] A grinding method of a workpiece which can process a workpiece of various sizes is provided, without exchanging a zipper table of a grinding device. [Means for Solution] A grinding device provided with a zipper table which has ...  
JP6589391B2  
JP6589373B2  
JP2019171562A
[Subject] An improvement mechanic implement which can perform work movement of two different types of a backing pad attached is provided. [Means for Solution] Stock type mechanic implement 1 which performs sanding or polishing is provide...  
JP6587261B1
[Subject] It prevents grinding the end face of a steel pipe too much, and provides the device which can realize the stabilization and mass production nature of product quality by automation. [Means for Solution] In end face processing de...  
JP2019166597A
[Subject] An elastic deformation pad, an adsorption pad unit, a vacuum chuck device, and a machine tool which can control a fall of adsorption power easily are provided. [Means for Solution] Elastic deformation pad 60 is located in a sid...  
JP2019166607A
[Subject] A workpiece is ground in a polish device for a short time. [Means for Solution] Polish device 1 is provided with the following. Holder 10 which holds a periphery of optical element W (workpiece) and rotates the optic-axis (cent...  
JP6585913B2  
JP6584889B2  
JP6585961B2  

Matches 901 - 950 out of 9,089