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Patent Searching and Data


Matches 601 - 650 out of 9,052

Document Document Title
WO2003045672A3
A milling machine for shaping blanks to create optical lenses to be attached to eyeglass frames and to create filter lenses (14) for a clip-on accessory (13) whose pair of filter lenses register with a pair of optical lenses in prescript...  
WO/2003/080291A2
The polisher (10) includes a polishing unit (12), a processor (14), a porting device (16) for a portable memory device (18), and multiple input devices (15). The polishing unit (12) is comprised of a pneumatic arm assembly and a platen a...  
WO/2003/080289A2
The polishing machine processes a workpiece put on table of body by four-directional control and is provided with a pair of columns. It comprises: first carrying unit having both ends fixed to pair of columns and having carrying part mou...  
WO2002002276A3
A projected gimbal point drive system is disclosed. The projected gimbal point drive system includes a spindle (412) capable of apply a torque, and having a concave spherical surface formed on its lower portion. Further included is a waf...  
WO2002098606A3
The invention concerns a device comprising in combination: means for detecting (4) characteristics of a lens; means for integrating characteristics representing a patient's morphology; a support (3) of the mobile lens along a predetermin...  
WO/2003/076131A1
The present invention relates to an arrangement in a mobile machine (1) for grinding floor surfaces, comprising a housing (1a), which is supported partly by two wheels (4, 5) and partly by a number of rotatably supported grinding disks (...  
WO2002060643A9
The present invention provides an improved planarization or polishing apparatus for chemical mechanical planarization and other types of polishing such as metal polishing and optical polishing. In an exemplary embodiment, an apparatus fo...  
WO/2003/072303A1
An angle positioning tool for positioning a blade portion of a hand scaler at a predetermined angle when grinding the hand scaler and a hand-scaler grinding device that has a relatively simple structure, is easily operated and maintained...  
WO2002071445A3
Specific embodiments of the present invention provide a chemical-mechanical planarization apparatus for planarizing an object (115) comprising a shaft (260) having a shaft axis (270) and being connected with a polishing head (250) which ...  
WO/2003/066282A2
Systems and methods for detecting a presence of blobs on a specimen (12), are provided. A method may include scanning measurement spots across the specimen, (12), during polishing of a specimen. The method may also include determining if...  
WO2003003428A3
The present invention is a method, apparatus and process for an improved substrate mounting and processing technique for various substrate treatments comprising cleaning, dicing, sawing, polishing, and planarization, among others.  
WO/2003/053206A1
This invention provides a simple yet effective means of damping out vibrations in floor polishing machines. The invention teaches the use of a circular or toroidal damping element (20) disposed between the work head and the body of a flo...  
WO/2003/051617A1
A method for producing lenses includes assembling a plurality of glass rods having a desired length into a single unit and cutting the single unit into multiple slices, each slice having a plurality of individual lenses. The method furth...  
WO/2003/049168A1
A substrate holding device for holdingly pressing a substrate (W) such as a semiconductor wafer against a polishing surface in a polishing device for flattening the substrate by polishing, comprising a top ring body (2) having a storage ...  
WO/2003/045672A2
A milling machine for shaping blanks to create optical lenses to be attached to eyeglass frames and to create filter lenses (14) for a clip-on accessory (13) whose pair of filter lenses register with a pair of optical lenses in prescript...  
WO/2003/028951A1
A process for forming a semiconductor wafer which is single side polished improves nanotopography and flatness of the polished wafer. The process reduces the effect of back side surface features, such as edge ring phenomena and back side...  
WO/2003/028079A1
A semiconductor wafer end face polishing machine capable of polishing the end face of a semiconductor wafer easily in a short time and also changing a polishing tool in a short time, comprising a polishing head having a drive roller (33)...  
WO2002024410A9
A CMP system make repeatable measurements of eccentric forces applied to carriers for wafer or conditioning pucks. Force applied to the carrier may be accurately measured even though such force is eccentrically applied to such carrier. A...  
WO/2003/022521A1
The invention relates to a device for the grinding of central bearing positions on crankshafts with several grinding discs employed simultaneously. An additional machining unit (11) for the pre-working of at least one central bearing pos...  
WO/2003/022520A1
The invention relates to a device (1) for sharpening multiple blade knives (17), comprising at least one motor (5) and a retaining table (2) which can be displaced in relation to the motor, said retaining table (2) comprises a retaining ...  
WO/2003/022518A2
A chemical mechanical polishing tool, apparatus and method. The polishing tool includes a central polishing assembly (322) comprised of a central pad mount (326) on a central shaft. That central pad mount beneficially retains a center po...  
WO/2003/011517A1
A wafer carrier (10) for use in polishing disks. The carrier (10) includes a main body (38) and an integral visual inspection wear indicator (40). The main body (38) has at least one opening (12) formed therein adapted to receive a disk....  
WO/2003/009967A1
The invention relates to a polishing jig for mounting a processing subject lens on a polishing device that polishes the concave surface of the processing subject lens, to a conveyor tray exclusively used for conveying the polishing jig, ...  
WO/2003/003428A2
The present invention is a method, apparatus and process for an improved substrate mounting and processing technique for various substrate treatments comprising cleaning, dicing, sawing, polishing, and planarization, among others.  
WO/2002/100596A1
A fixture (1) for guidance of a tool having a cutting edge with respect to the periphery of a rotating grinding- or polishing wheel (2), comprising a frame structure that runs along the periphery (6) of the wheel and has a guide formed a...  
WO/2002/098606A2
The invention concerns a device comprising in combination: means for detecting (4) characteristics of a lens; means for integrating characteristics representing a patient's morphology; a support (3) of the mobile lens along a predetermin...  
WO/2002/097298A1
An auto-balancing device (1) for damping the vibrations produced by a grinding wheel (18) on an angle grinder (30). The device includes a body (2) having a trackway (4) allowing ball bearings (6) to distribute themselves around the track...  
WO/2002/094505A1
A multi-spindle end effector is provided for a multiple axis robot. The multi-spindle end effector includes a plate housing having at least a pair of spaced-apart spindles (36, 38) mounted thereon. A servo-motor (42) drivingly engages th...  
WO/2002/092281A1
The invention relates to a device for sharpening cutter blades (6, 7) comprising a sharpening tool and a sharpening fixture, by means of which a cutter blade (6') is held during the sharpening process. The sharpening fixture (13) and/or ...  
WO/2002/091433A2
The invention relates to a method for grinding the back sides of wafers using foils having a carrier layer known per se and a gradually polymerizable adhesive layer. The invention also relates to foils having said gradually polymerizable...  
WO/2002/087826A1
A method for controlling a process in a multi-zonal processing apparatus and specifically for determining the optimum values to set for processing parameters J(Z¿i?) in each of the zones of that apparatus includes processing a test work...  
WO2002036306A3
An apparatus for eliminating the differences in the curvatures of a facing lens blank and an abrasive pad mounted on a formable lap (20) includes a drivable track portion (14), a compensation pl ate (12) disposed on the drivable track po...  
WO/2002/085571A1
A chemical mechanical polishing (CMP) apparatus (100) and method for polishing semiconductor wafers (W) utilizes multiple wafer carriers (106) that are transferred to different positions about a polishing pad (104) to polish at least one...  
WO2002060643A3
The present invention provides an improved planarization or polishing apparatus for chemical mechanical planarization and other types of polishing such as metal polishing and optical polishing. In an exemplary embodiment, an apparatus fo...  
WO2000038882A3
The invention provides for a modular machine frame structure instead of the frame constructions customary to date. According to the invention the individual modules are made of non-metal castings, notably a mineral casting, produced usin...  
WO/2002/074487A1
A system and method for chemically and mechanically polishing surfaces of semiconductor wafers (W) utilizing multiple polishing pads (102A) (102B) having diameters that are smaller than the diameter of the wafers (W) to simultaneously po...  
WO/2002/071445A2
Specific embodiments of the present invention provide a chemical-mechanical planarization apparatus for planarizing an object (115) comprising a shaft (260) having a shaft axis (270) and being connected with a polishing head (250) which ...  
WO/2002/070199A1
A device for repairing by polishing an optical disk, which can provide a proper, uniform pressure necessary for polishing, correct the planar parallelism precision of the rotation surfaces of an optical disk and a polishing sheet, elimin...  
WO/2002/068151A1
An abrasion tool that is selectively configurable for spin or random-orbit without the need for a reversible motor. The tool uses two collars, each having half of the desired offset and half of the counterweight. In spin mode, the collar...  
WO2002016080A8
A carrier head assembly (200) of a substrate (202) polishing apparatus and a substrate supporting carrier pad (220) is disclosed. A down force is uniformly distributed over the backside of the substrate (202) by the carrier pad (220) ada...  
WO/2002/062524A1
The invention relates to an arrangement in a mobile machine for screeding floor surfaces. This comprises a housing with a planet disk (3), which is rotatably supported in the bottom of the said housing and driven by a drive motor (1). Th...  
WO/2002/060645A1
A polisher head backing film (140) that resists slipping relative to a backing plate (150). In one embodiment, a polisher head backing film/backing plate assembly (180) is provided. The backing film/backing plate assembly (180) includes ...  
WO/2002/060643A2
The present invention provides an improved planarization or polishing apparatus for chemical mechanical planarization and other types of polishing such as metal polishing and optical polishing. In an exemplary embodiment, an apparatus fo...  
WO2001068314A3
The invention relates to a machining center provided with a workpiece machine tool. Said machine tool comprises: an essentially horizontal working plate (10) which is supported by a machine tool stand (2); a workpiece support (20) which ...  
WO/2002/057051A1
A dressing apparatus dresses a polishing surface of a polishing table used for polishing a workpiece such as a semiconductor wafer in a polishing apparatus. The dressing apparatus comprises a dresser body (31) connected to a dresser driv...  
WO2002007931A3
A carrier head (100) that has a base assembly (104) and a flexible membrane (140). The flexible membrane has a generally circular main portion (142) with a lower surface (144) that provides a substrate-mounting surface and a plurality of...  
WO2002016078A3
CMP systems and methods implement instructions for moving a polishing pad (202) relative to a wafer (206) and a retainer ring (282) and for applying pressure for CMP operations. Feedback of polishing pad position is coordinated with dete...  
WO2002016080A3
A carrier head assembly (200) of a substrate (202) polishing apparatus and a substrate supporting carrier pad (220) is disclosed. A down force is uniformly distributed over the backside of the substrate (202) by the carrier pad (220) ada...  
WO/2002/047870A1
Applying heat and pressure to a backing film (3) comprising an adhesive layer (4) during the procedure of mounting it to a polish head (1) for use in chemical mechanical polishing (CMP), inhomogeneities inside the adhesive layer (4), e.g...  
WO2002008636A3
Automatic balancer (300) for balancing a mass rotating at high speed reduces the impact of unbalanced rotary tools and other devices. The automatic balancer provides a housing (301) within which is defined a race (309). The race is acces...  

Matches 601 - 650 out of 9,052