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Patent Searching and Data


Matches 1,051 - 1,100 out of 9,089

Document Document Title
JP6511051B2  
JPWO2018008158A1
In a lens surface-of-a-sphere processing method, the contact state where the revolving cup form whetstone (9) was made to contact a lens surface (5a), and the ball core rocking state, in which a cup form whetstone (9) carries out ball co...  
JP2019063957A
To provide a polishing jig which has a simple structure and yet allows production of a sample, which is polished so as to form two surfaces orthogonal to each other, with good working efficiency.A polishing jig includes: a body part 40 h...  
JP2019063885A
To provide a processing device capable of removing a pollutant from a holding area of holding means where processing has been applied to a workpiece.Holding means 14 of a processing device comprises at least a holding area 18 for sucking...  
JP6504352B2  
JP2019058984A
To provide a holding pad that is excellent in flatness and adsorptivity more than those of existing holding pads and has appropriate detachability, and to provide a laminate used for manufacturing the holding pad and a method for manufac...  
JP2019510646A
The present invention relates to a division machine provided with a rotation division wheel which performs division cutting of a work, and relates to a work positioning device of this type of division machine. A division machine is provi...  
JP2019058986A
To provide a holding pad that is excellent in adsorptivity and flatness of an object to be polished after being polished, and to provide a method for manufacturing the same.A holding pad has a polyurethane sheet that has a plurality of t...  
JP2019058985A
To provide a holding pad that is excellent in adsorptivity and flatness of an object to be polished after being polished, and to provide a method for manufacturing the same.A holding pad includes a polyurethane sheet that has a plurality...  
JP2019062147A
To provide a new protective member processing method capable of properly processing a resin protective member.A protective member processing method for processing a protective member stuck to a wafer using a grinding device including a c...  
JP2019058955A
To provide a polishing head which enables reduction of differential interference contrast (DIC) at an end stage of a template life.A polishing head holds a rear surface of a workpiece and places a surface of the workpiece in slidable con...  
JP6503053B2  
JP6503023B2  
JP2019057618A
To easily remove a ring frame from a ring frame holding mechanism.A ring frame conveyance mechanism 10 includes: suction paths 14 for causing a suction cup 13 to communicate with a suction source 1; and an opening valve 15 disposed in th...  
JP2019055450A
To replace and add a cooling mechanism without adjusting belt tension and shorten a work time.A processing device includes holding means 2 for holding a wafer W. The holding means 2 has a holding table 20 for holding the wafer W, a rotar...  
JP6498142B2  
JP2019051572A
To reduce time required until negative pressure of desired magnitude acts on a glass sheet and thereby shorten tact time, in adsorbing and fixing the glass sheet onto a support table utilizing a negative pressure generation source.A glas...  
JP2019509178A
A method of grinding a structure provided with one cylinder classification and variant classification at least, respectively with the same grinding machine is indicated. A structure is first ground in the 1st grinding operation by the 1s...  
JP6495054B2  
JP6495079B2  
JP6492699B2  
JP6496681B2  
JP2019508260A
The present invention is applied to a field of grinding processing of work piece, and a technical field of a micro drill especially for PCB processing, and is really indicating production equipment and a manufacturing method of a formula...  
JP2019048436A
To reduce the deflection of a substrate caused by mechanical vibration during cutting, and to prevent the cracks of a substrate.Provided is a cutting method for a single crystal where a single crystal is cut by using a wire saw apparatus...  
JP6490151B2  
JP6490444B2  
JP6489970B2  
JP6488894B2  
JP2019042888A
To prevent a cassette from floating on a water surface and enable a cassette size of the cassette to be recognized.A polishing device includes storage means 50 which stores wafers W in a second cassette 8. The storage means 50 includes: ...  
JP2019042899A
To provide a processing device that can perform both cutting processing and honing processing alone, is small-sized and does not require a complicated structure.The processing device, in which a cutting processing unit 6 having a cutting...  
JP2019042890A
To inhibit vibration occurring during glass plate end surface processing to improve accuracy of the end surface processing.In a glass plate end surface processing method according to the invention, a tool 13 (14) provided at an end surfa...  
JP2019042923A
To perform finish processing of a processing object after main polishing while suppressing lowering of throughput of a polishing device.A polishing device includes: a polishing unit 3 for polishing a processing object by relatively movin...  
JP2019042864A
To provide a grinding apparatus capable of effectively preventing a ring-shaped member from having a chatter on an outer peripheral surface.A grinding apparatus comprises: a rotary drive shaft of a ring-shaped member 6; a grindstone 5 fo...  
JPWO2018164244A1
Processing device 1 performs removal processing which removes at least one copy of the peripheral face of supported rotating body 6 which rotates with rotation of a plurality of support rotating bodies 501, 502 while being supported by a...  
JP6487800B2  
JP6485165B2  
JP6486176B2  
JP6486770B2  
JP6486379B2  
JP2019038133A
To provide a damage processing product which is a decorative sheet having both of natural feeling and intensity of wood, suppressed in a cost of manufacture, and having sense of solidness and material feeling, and to provide a damage pro...  
JP2019040945A
To propose a washing station of chuck table capable of restraining deterioration of wafer shape after grinding, by suppressing uneven wear of the chuck surface of a chuck table at time of cleansing, and to provide a grinding device inclu...  
JP2019038044A
To suitably suck and hold a work-piece having a warp and grind the same.A grinding method for grinding a work-piece having a valley-shaped warp comprises: a detection step at which a shape of a work-piece to be ground is detected; a hold...  
JP2019034391A
To provide a processing method by which a work-piece can be divided without giving an impact to the work-piece compared to a conventional one.This processing method comprises a laser processing step at which laser processing of a work-pi...  
JP2019034357A
To provide a workpiece carrier that enables double-sided abrasive machining for a workpiece to be performed without scratching an outside-diameter surface of the workpiece, a double-end surface grinder comprising the workpiece carrier, a...  
JP2019034395A
To provide a workpiece support device which allows a shoe to be easily replaced.A workpiece support device comprises: a mounting base; a shoe base to be attached to the mounting base; and a shoe attached to the shoe base to support a wor...  
JP2019034379A
To provide a method and a device capable of efficiently polishing an entire reverse surface including the outermost part of the reverse surface of a substrate in a state that the reverse surface of the substrate faces down and to provide...  
JP2019034376A
To correctly position a grinding wheel and to facilitate detachment of the grinding wheel.A mount 20 has a mount body 21 and a plate-like projection 23 provided on the underside 22 of the mount body 21. The plate-like projection 23 has f...  
JP6476910B2  
JP6479585B2  
JP6477213B2  

Matches 1,051 - 1,100 out of 9,089