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JP7330086B2 |
To provide a processing method capable of reducing an influence from heat generation due to re-utilization in a shorter time than a conventional one.A processing method includes an idling step and a cutting step. The idling step is a ste...
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JP2023115592A |
To provide a grinding device 1 which realizes rotation of an abrasive wheel 33 with a configuration that does not correspond to a fire instrument and can perform grinding processing.A grinding device 1 comprises: a frame 10 which can be ...
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JP2023115106A |
To provide a grinding device capable of efficiently carrying out maintenance work and discharging grinding water to a fixed place to efficiently cool a wafer and a grindstone.A grinding device 1 comprises: a chuck 11 that absorbs and hol...
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JP7328932B2 |
The invention relates to a centerless cylindrical grinding machine (100) for throughfeed and plunge grinding of arbitrary workpieces comprising a first drivable positioning axis XS for a grinding headstock (10) with a grinding wheel (11)...
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JP7328507B2 |
To suppress the residue of scraps on a jig that supports a workpiece.A manufacturing method of a semiconductor device includes a step (A) of preparing a composite substrate having a device area including a plurality of unit structures an...
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JP2023114076A |
To provide a method for processing a workpiece that can provide high flatness of a surface to be polished while efficiently processing a workpiece.A method for processing a workpiece which is applied when processing a plate-like workpiec...
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JP7327217B2 |
An automatic wet sanding apparatus is equipped with a suction unit having a suction nozzle that is located under an automatic wet sanding unit in a state where automatic wet sanding is performed and a suction device that generates a suct...
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JP2023113093A |
To provide a grinder in which a grinding wheel with a grindstone on its lower surface side can be safely attached to and detached from a discoid spindle flange.A grinder 10 for processing a wafer W includes: a grinding wheel 22 provided ...
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JP7323341B2 |
To urge an operator to execute an origin position recognition operation.In a griding device, when an origin position recognition operation is to be executed, an origin position recognition operation start button 51 is made conspicuous by...
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JP2023534119A |
A method for cutting a plurality of slices from a work piece by a wire saw during a series of cutting operations divided into an initial cut and subsequent cuts, the wire saw having a wire array and a drive of a movable wire section of t...
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JP7323342B2 |
To make dirt less likely to adhere to a holding surface of transporting means of a robot etc.If a robot 155 is located in a stand-by position, a holding surface 156 of the robot 155 is oriented in parallel with airflow S1 of a cleaned ga...
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JP2023108668A |
To provide a grinding device that can effectively utilize grinding wheel accompanying air stream, in generating electric power.A grinding device 1 grinds a work-piece 8, by rotating a grinding wheel 31 with respect to the work-piece 8. T...
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JP7320358B2 |
To provide a processing device of cleaning a work-piece underside by cleaning means which is reduced in space and is not unusable due to dirty of a sponge in the cleaning means.A processing device comprises means 16 of holding a work-pic...
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JP2023106877A |
To provide a plate-like object support device which can suppress positional deviation of a plate-like object.A plate-like object support device 80 includes a support unit 81 for supporting a plate-like object, and a destaticizing unit fo...
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JP7319912B2 |
The utility model provides a cover accessory and an electric tool. The cover attachment is used for being detachably installed on an electric tool. The electric tool is provided with a top end tool and a cover, wherein the top end tool i...
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JP2023532659A |
In a chemical mechanical polishing system, a platen shield cleaning assembly is mounted above the rotatable platen in a gap between the rotatable platen and the platen shield. The assembly includes a sponge holder attached to the platen ...
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JP2023104215A |
To provide a grinding device, which is configured so that ground chips are ejected from a holding surface and porous members constituting the holding surface, without being enlarged in size.Ground chips intruding from a holding surface 2...
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JP2023104443A |
To provide a gas-liquid separation device that can surely separate exhaust air exhausted from a processing device or the like into gas and liquid.A gas-liquid separation device, which separates exhaust air into gas and liquid, includes: ...
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JP7316785B2 |
The present invention relates to a method of cleaning an optical film-thickness measuring system used for measuring a film thickness of a substrate, such as a wafer, while polishing the substrate. The method includes: cleaning an optical...
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JP2023532464A |
The polishing assembly includes a rotatable platen for supporting the polishing pad, an open bottom enclosure, and one or more plates for supplying polishing and cleaning fluids downwardly onto the polishing pad through an interior space...
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JP2023102926A |
To restore a wafer ID in a grinding apparatus without inviting an increase in the size of the apparatus.A grinding apparatus 1 includes an ID formation unit 110 which executes reading and restoration processing of a wafer ID. The grindin...
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JP2023102458A |
To prevent an adhesion of dust adhered to a spinner table to a wafer.A processing device comprises: a spinner cleaning unit 80 of cleaning a wafer held by a spinner table 81; a robot that conveys the wafer to a cassette by approaching a ...
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JP2023101881A |
To provide a cutting device capable of suppressing worsening of responsiveness and the occurrence of overshooting in flow rate control of process water, and a method for manufacturing a cut product.The cutting device receives process wat...
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JP2023101963A |
To perform washing by keeping a distance between a washing surface of an object to be washed and a nozzle constant in a washing device.A washing device 1 includes: a table 28 which holds an object 90 to be washed on a holding surface 282...
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JP2023101596A |
To provide a cleaning method capable of removing abrasive grains stuck to a light passage in a polishing table.This cleaning method guides light through a light passage 50A provided in a polishing table 3 to a substrate W during polishin...
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JP7312058B2 |
To measure fine water pressure distribution around a processing point.A measurement jig 8 comprises: a lower table 80 having a mounting surface 80b mounted on a base 22; a side part 81 erecting from an upper surface 80a of the lower tabl...
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JP2023101146A |
To provide a cleaning mechanism that can suppress remaining of a foreign matter on a chuck table.A cleaning mechanism for cleaning a chuck table for holding a workpiece at a holding surface includes: a fluid supply unit capable of being ...
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JP2023101211A |
To provide a technique capable of suitably suppressing the over-rolling of a blade cover.A working machine comprises: a rotary cutter; an output shaft fitted with the rotary cutter; a driving-motor rotationally driving the output shaft; ...
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JP2023100378A |
To provide a processing device including two fluid washing mechanism for washing holding surfaces etc., which is not enlarged and prevents scattering of two fluids.A processing device 1 includes a turn table 59 which has a plurality of c...
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JP2023530636A |
A method of cutting a plurality of slices from a workpiece with a wire saw during a series of cutting operations, the cutting operations being divided into an initial cut and a subsequent cut, the wire saw cutting a movable wire section ...
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JP7308547B2 |
The present disclosure provides an automatic processing apparatus including a main body, a receiving portion, a working assembly, a workpiece magazine, a setting mechanism, a passivation bucket assembly, and a rotation driving assembly. ...
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JP2023097533A |
To provide a polishing device which, even when using a substrate holding device causing the substrate to rotate about its axial center, can effectively discharge cleaning fluid supplied to the surface of the substrate, from the substrate...
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JP7304742B2 |
The present invention provides a technology capable of simplifying maintenance work of a substrate processing apparatus. The substrate processing apparatus includes: a rotating disk on which a tool for processing a substrate is mounted s...
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JP2023095080A |
To provide a method for slicing a silicon ingot, by which the variation in wafer thickness can be reduced, and the worsening of quality of wafers can be prevented.A method for slicing a silicon ingot comprises the step of supplying a coo...
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JP2023092774A |
To enable telescopic motion of a bellows without contacting a rail when moving a suspension type spindle unit in a bellows mechanism.A suspension type bellows mechanism 4 has one end connected to a first spindle unit 61 and the other end...
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JP2023528236A |
The present invention relates to a laboratory disc polisher and in particular a method for flat polishing the underside of an embedded sample, as well as a supplementary polisher for said laboratory disc polisher and a polisher in a labo...
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JP2023092675A |
To provide a method for setting the fullerene content in a processing oil composition and a cutting method using the same that reduce wear of tools and the like while suppressing the decrease in cutting performance.Fullerene content is s...
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JP2023092623A |
To provide a polishing device configured so that an installation cost of a hand shower cleaner and an installation space of a storage box can be reduced.A polishing device comprises: a first polishing module 4A and a second polishing mod...
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JP2023091897A |
To provide a grinding device which can prevent an operator from forgetting execution of self-grinding.A grinding device includes: a control unit which has a processing device and a storage device, and controls a chuck table, a grinding u...
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JP7301473B2 |
A grinding apparatus includes a first chuck table that has a porous holding surface corresponding to a first wafer and holds the first wafer, a second chuck table that has a porous holding surface corresponding to a second wafer differen...
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JP7300943B2 |
To provide a method for detecting a foreign matter on a holding surface, capable of more easily detecting a foreign matter on a holding surface of a holding table.A method for detecting a foreign matter on a holding surface includes: a r...
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JP7300260B2 |
To provide a grinding attachment that enables efficient execution of maintenance work and that efficiently cools a wafer and a grinding stone by discharging grinding water to a fixed place.A grinding attachment comprises: a chuck 11 for ...
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JP2023089533A |
To provide a substrate processing device that can prevent a substrate from warping and further prevent the substrate from being contaminated due to removed chips, when making a processing head press an outer periphery part of the substra...
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JP7299773B2 |
To enable a grinding wheel to be washed in a processing chamber before wheel replacement in a case where the grinding wheel is soiled.A grinding device 1 comprising: means 30 that rotates a grinding wheel 304 to grind a work piece held o...
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JP7299102B2 |
An intermediate raw material according to the present invention includes a charge control agent having a critical packing parameter of 0.6 or more and a dispersing medium and a pH of the intermediate raw material is less than 7.
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JP2023088376A |
To provide a workpiece grinding method by which the air-cut period in which the rotation of a grinding wheel drops at a low speed to be idled, is shortened compared to heretofore.A workpiece grinding method includes: a first movement ste...
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JP2023089266A |
To provide an alternative apparatus and a method for finishing an edge of a glass sheet by combining with a discharged cooling agent.A finishing member is rotatably maintained in a chamber of a shroud. The shroud includes a wall part 52 ...
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JP2023088515A |
To appropriately perform gas-liquid separation even when an amount of mist of cutting waste liquid is increased.A cutting device 1 is such that a cutting mechanism 6 comprises a nozzle 66 for supplying cutting water to a region for cutti...
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JP2023087899A |
To prevent processing chips from adhering to a spindle.When a spindle 44 rotates, a downward spiral air flow is generated in a cylindrical clearance 88 by a spiral groove 90 formed in an outside surface of a second disk part 77 thereof. ...
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JP2023088145A |
To solve such a problem that detection of a region to be imaged by imaging means and to be processed is hindered, by preventing waste liquid scattered during cutting work from dropping onto an upper surface of a wafer from a blade cover ...
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